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- X#-Series SMT setup
X#-Series SMT setup
X#-Series SMT setup
The X#-platform series is an inline automated X-ray system designed for a wide range of Automated X-ray Inspection (AXI) applications. It is a flexible platform suitable for component level inspection, large SMT boards, high-power electronic modules, and fully assembled modules.
- PC-Station with multi-core processor and Windows 10 platform.
- MIPS Inspection Platform includes advanced algorithm library, CAD import for automatic inspection list generation, and 3D SART (X3# only).
- Features Automatic Tree Classification (ATC) for auto-rule generation and offline programming for AXI program generation and simulation.
- MIPS Verify link with closed-loop repair.
- MIPS Process with real-time SPC.
- Flexible AXI system for inline and island of automation configurations.
- Microfocus X-ray tube (sealed tube, maintenance-free).
- Multiple programmable motion system with servo drives and digital CMOS flat panel detector.
- Automatic grey-level and geometrical calibration.
- Full product traceability via customized MES-Interface.
- X2#: Transmission (2D) + SFTTM.
- X2.5#: Transmission (2D) + SFTTM + Off-Axis (2.5D).
- X3#: Transmission (2D) + SFTTM + Off-Axis (2.5D) + 3D SART.
- Dimensions: 1775 mm (H) x 3100 mm (W) x 1760 mm (D).
- Weight: 2800 kg.
- Operating Temperature: 15° - 28°C, optimal 20° - 25°C.
- Power Consumption: max. 6 kW.
- Line Voltage: 400 VAC, 50/60 Hz 3 phase, 16 A / 208 VAC, 50/60 Hz 3 phase, 25 A.
- Air: 5-7 Bar, < 2 l/min, filtered (30µ), dry, oil-free.
- X-ray Source: 130 kV/40 W, focal spot size 5 microns.
- Grey resolution: up to 16 Bit.
- Detector Types: CMOS Flatpanel Detector with 50 µm and 75 µm pixel sizes.
- Max. sample size: 510 mm x 410 mm.
- Max. inspection area: 480 mm x 410 mm.
- Resolution down to 3 µm/pix.
- Multiple axes programmable motion system with x, y sample table, z magnification, u, v detector movement.
- Barcode reader and Auto BCR scanning station.
- Low-dose radiation filter.
- Transmission: up to 3-4 views/s.
- Off-Axis: up to 2-3 views/s.
- 3D SART: up to 3 s/FoV.
For more information, contact Nordson MATRIX representatives in various regions including Germany, USA, Brazil, South East Asia, China, Japan, Korea, Taiwan, and India.
- Advanced algorithm library for component and solder-joint inspection on PCB, hybrid, or chip level assembly processes.
- Includes BGA, QFN, gullwing algorithms, and robust solder surface/heatsink void inspection.
Catalog excerpts
X #-Series SMT setup Flexible Inline AXI platform The X#-platform series is an inline automated X-ray system which covers a wide range of AXI applications. It is a flexible platform with very versatile fields of use depending on the application requirements. The inspectable applications range from component level inspection for wire bonds, large SMT boards, high-power electronic modules up to fully assembled modules. The Nordson MATRIX system solutions present a modular inspection concept. The platforms feature up to 4 advanced technologies in one system: Transmission X-ray imaging (2D) with patented Slice-Filter-Technique™ (SFT), Off-Axis technology (2.5D) and 3D SART (Simultaneous Algebraic Reconstruction Technique). The X#-series platform is available in the following configurations: X2# X2.5# Transmission (2D) + SFTTM + Off-Axis (2.5D) X3# Transmission (2D) + SFTTM + Off-Axis (2.5D) + 3D SART Features and Benefits Flexible AXI system for inline and island of automation configurations Microfocus X-ray tube (sealed tube / maintenance free) Multiple programmable motion system with servo drives Digital CMOS flatpanel detector Automatic grey-level and geometrical calibration Flexible setup for inline pass through or same-side in/out configuration Barcode scanner for serial number and product type selection product traceability via customized MES-Interface Full Inspection & Process Software Station with multi ore processor setup PC- -c Windows 10 platform MIPS Inspection Platform Advanced algorithm library CAD import for automatic inspection list generation Simultaneous Algebraic Reconstruction Technique (3D SART: X3# only) Automatic Tree Classifcation (ATC) for Auto-Rule-Generation Offline programming for AXI program generation & simulation, tuning and defect reference catalogue Verification & process control MIPS Verify link with closed loop repair MIPS Proces with real tim
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X#-Series SMT setup Applications For more information, speak with your Nordson MATRIX representative. Electronic components and solder joint A unique advanced algorithm library is available for electronic applications, specifically for component and solder-joint inspection on PCB, hybrid or chip level assembly processes. Germany/ Western Europe Feldkirchen (Munich) All standard SMD and THT/PTH components BGA & dedicated off-axis head-in-pillow (HIP) algorithm Comprehensive QFN & gullwing algorithm Robust solder surface / heatsink void inspection Pin in paste barel fill measurement Discrete down...
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