X#-Series SMT setup
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X #-Series SMT setup Flexible Inline AXI platform The X#-platform series is an inline automated X-ray system which covers a wide range of AXI applications. It is a flexible platform with very versatile fields of use depending on the application requirements. The inspectable applications range from component level inspection for wire bonds, large SMT boards, high-power electronic modules up to fully assembled modules. The Nordson MATRIX system solutions present a modular inspection concept. The platforms feature up to 4 advanced technologies in one system: Transmission X-ray imaging (2D) with patented Slice-Filter-Technique™ (SFT), Off-Axis technology (2.5D) and 3D SART (Simultaneous Algebraic Reconstruction Technique). The X#-series platform is available in the following configurations: X2# X2.5# Transmission (2D) + SFTTM + Off-Axis (2.5D) X3# Transmission (2D) + SFTTM + Off-Axis (2.5D) + 3D SART Features and Benefits Flexible AXI system for inline and island of automation configurations Microfocus X-ray tube (sealed tube / maintenance free) Multiple programmable motion system with servo drives Digital CMOS flatpanel detector Automatic grey-level and geometrical calibration Flexible setup for inline pass through or same-side in/out configuration Barcode scanner for serial number and product type selection product traceability via customized MES-Interface Full Inspection & Process Software Station with multi    ore processor setup PC-  -c Windows 10 platform MIPS Inspection Platform Advanced algorithm library CAD import for automatic inspection list generation Simultaneous Algebraic Reconstruction Technique (3D SART: X3# only) Automatic Tree Classifcation (ATC) for Auto-Rule-Generation Offline programming for AXI program generation & simulation, tuning and defect reference catalogue Verification & process control MIPS Verify link with closed loop repair MIPS Proces with real tim

X#-Series SMT setup Applications For more information, speak with your Nordson MATRIX representative. Electronic components and solder joint A unique advanced algorithm library is available for electronic applications, specifically for component and solder-joint inspection on PCB, hybrid or chip level assembly processes. Germany/ Western Europe Feldkirchen (Munich) All standard SMD and THT/PTH components BGA & dedicated off-axis head-in-pillow (HIP) algorithm Comprehensive QFN & gullwing algorithm Robust solder surface / heatsink void inspection Pin in paste barel fill measurement Discrete...