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Utilized to produce nanocomposites via vacuum infi ltration

Utilized to produce nanocomposites via vacuum infi ltration

Utilized to produce nanocomposites via vacuum infi ltration

Product catalog summary
Overview of EP114
Master Bond EP114 is a two-component epoxy system filled with nano silica, known for its excellent dimensional stability and high glass transition temperature (>200°C). It has a low initial mixed viscosity, which can be further reduced by preheating, making it suitable for vacuum infiltration to produce dense nanocomposites.

Application
Graphene nanoplatelets (GNP) and boron-nitride nanoplatelets (BNNP) are used in electric double-layer capacitors but tend to agglomerate, reducing their effectiveness. Vacuum infiltration with EP114 provides reinforcement without compromising toughness, as it has the necessary low viscosity to penetrate foam structures.

Key Parameters and Requirements
For infiltration, EP114 components are heated separately at 100°C, mixed, and then applied to the foam. A vacuum of 1 Pa is used for 1 hour to ensure complete penetration. The cure schedule involves multiple isothermal holds and gradual heating to ensure proper curing.

Results
EP114's infiltration was affected by temperature, foam composition, and shape. Higher GNP content decreased porosity, making infiltration challenging. Despite this, all foams achieved densifications >96%, indicating good infiltration. The infiltrated nanocomposites maintained hardness similar to neat EP114, suggesting mechanical properties were not compromised. The presence of GNP and BNNP networks increased thermal conductivity, indicating a connected structure within the foams.

Conclusion
EP114 effectively infiltrates GNP and BNNP networks to create nearly 100% dense nanocomposites with improved thermal conductivity without compromising hardness. This method can be used to fabricate various freeze-dried foams/polymer nanocomposites.
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Catalog excerpts

Utilized to produce nanocomposites via vacuum infi ltration-1

<§> M ASTERBOND CASE STUDY EP114:Utilized to produce nanocomposites via vacuum infiltration Master Bond Inc. 154 Hobart Street, Hackensack, NJ 07601 USA Phone +1.201.343.8983 | Fax +1.201.343.2132 | [email protected]

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Utilized to produce nanocomposites via vacuum infi ltration-2

<$> MASTER BOND CASE STUDY Master Bond EP114 is a two-component nano silica filled epoxy system which offers excellent dimensional stability and a very high glass transition temperature (Tg) > 200°C upon curing. Its ultra-low initial mixed viscosity (500-1500 cps at room temperature) can be further reduced by preheating to a slightly higher temperature, making EP114 ideal for vacuum infiltration to produce dense nanocomposites, as shown in the case study below. Graphene nanoplatelets (GNP) and boron-nitride nanoplatelets (BNNP) show promising application prospects in electric double-layer capacitors...

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Before using it to infiltrate the foam, the authors characterized various thermal and mechanical properties of EP114. The authors then created a variety of GNP and BNNP foams and studied the interactions between the foams and EP114. Using EP114 contact angle measurement, the authors showed that the wettability (and infiltration) of EP114 was affected by the infiltration temperature, foam composition, and foam shape. As the GNP content increased, infiltration became more difficult due to a decrease in the porosity. In nanocomposites with low loadings of GNP, the pores were incredibly small, and...

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References Benedetti, L.; Orikasa, K.; Agarwal, A. The Effect of Different GNP/BNNP Foam Structures in the Infiltration of Epoxy Resin: A Fundamental Study. Polymer Composites. 2023. https://doi.org/10.1002/pc.28070. No part of this article may be reproduced or transmitted in whole or in part, in any form, by any means, without the express written permission of Master Bond Inc. All requests for permission to reproduce material from this article should be directed to Master Bond at permissions@masterbond. com. The Master Bond logo is a registered trademark of Master Bond Inc. All other company,...

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