<8> M ASTERBOND CASE STUDY Utilized to Bond Silicon Wafers to Glass Support Substrates during Microelectronics Fabrication Master Bond Inc. 154 Hobart Street, Hackensack, NJ 07601 USA Phone +1.201.343.8983 | Fax +1.201.343.2132 | [email protected]

CASE STUDY EP112: Utilized to Bond Silicon Wafers to Glass Support Substrates during Microelectronics Fabrication Overview of EP112 Master Bond EP112 is an ultra-low-viscosity, electrically insulating, two-component epoxy system ideal for various applications. This two-part case study series presents two use cases for EP112 for microelectronics fabrication processes when used to bond a silicon wafer to a glass substrate. Because the fabrication processes involved high temperature etching in KOH, an adhesive with high chemical resistance was required so that the pair did not de-bond during the...

Results The START method combines bulk silicon's lower cost with SOI's improved device isolation and speed, thus enabling the formation of thin-film silicon microelectronics on non-silicon substrates (glass, in this case). To demonstrate the viability of using this method to transfer silicon circuits to arbitrary substrates, patterned islands were successfully transferred to a Corning® 7059 glass substrate. The transfer process maintained the surface quality of the backside of the silicon wafer after silicon thinning, ensuring it would be suitable for the final island patterning step. The authors...

characteristics remained unchanged, indicating that the substrate thickness did not affect the device threshold voltage. This was validated by subsequent experiments (Figure 2), which showed little change before and after wafer thinning. As noted by the authors, “EP112 [was] employed due to its excellent resistance to the chemical solutions commonly used in silicon processing, its high optical clarity, its high shore hardness value of 93, and low viscosity of less than 200 cps.” Conclusions Both case studies show that EP112 is suitable for bonding dissimilar substrates used during microelectronics...