Thermally Conductive Adhesives Keep Things Cool
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^MASTER BOND TECH SPOTLIGHT Thermally Conductive Adhesives Keep Things Cool Thermally conductive adhesives and potting compounds are an important weapon in the war against heat raging within today's powerful electronic devices Master Bond Inc. 154 Hobart Street, Hackensack, NJ 07601 USA

TECH SPOTLIGHT Thermally Conductive Adhesives Keep Things Cool Thermally conductive adhesives and potting compounds are an important weapon in the war against heat raging within today’s powerful electronic devices. Electronics are hot right now—literally. Chip makers have significantly upped the ante on microprocessor power and density over the past decade. And these powerful microprocessors are shoehorned into tiny mobile and embedded devices that make thermal management all the more difficult. Design engineers charged with keeping these devices cool have a big challenge on their hands....

Check Out The Latest Films Not all thermally conductive materials come in tubes and cans. Thermally conductive epoxy films are an increasingly popular application option—and for good reason: Films improves the uniformity of heat transfer. Depending on the type of film chosen, uniform bond lines as thin as 0.003 inches are easily achievable. With traditional adhesives in electronic assemblies, the bond lines are hard to control and can vary between 0.003 to 0.006 inches. Right: Master Bond’s line-up of thermal interface materials Films can also be die cut to intricate shapes that closely...

From Insulator To Conductor One obvious barrier to using any adhesives or potting compounds to help dissipate heat is that polymeric materials in their natural state are actually good thermal insulators. Unfilled epoxy, for example, has thermal conductivity of just 0.14 W/mK. Compare that value to a world-class conductor like aluminum, which comes in around 200 W/mK. With the addition of various metallic, ceramic or even nanotech fillers, formulators can improve on an adhesive’s baseline thermal conductivity values by a factor of 10 or more. The resulting products, while never approaching...

POPULAR THERMAL ADHESIVE GRADES Master Bond base resin: curing agent: Cure Schedule Two Component, Room Temperature Curing, Thermally Conductive, Electrically Isolating Epoxy For Bonding & Sealing Featuring High Temperature Resistance Along With High Shear & Peel Strength One Component, Heat Curing Epoxy Adhesive Featuring both High Shear and High Peel Strength for Optimal Bonding Performance & Exceptionally High Thermal Conductivity Two Component Highly Flexiblized Thermally Conductive Epoxy Resin Compound For High Performance Bonding, Sealing, Coating, And Two Component, Room Temperature...

THERMALLY CONDUCTIVE ADHESIVE FUNDAMENTALS Here's a look at the features to keep in mind when working with thermal adhesives in their liquid and film forms: LIQUID FILM HEATSINK THERMAL INTERFACE ELECTRONIC COMPONENT KEY FEATURES • Flexible chemistry • Wide range of physical properties available • Application versatility for bonding, potting and sealing • Room temperature cure options • Uniform bond line thickness for optimal cooling • Convenient handling, no mixing • Speeds production • New grades eliminate cryogenic storage needs APPLICATIONS • Assemble CSPs • Assemble SECC format devices...