<8> M ASTERBOND CASE STUDY Master Bond Inc. 154 Hobart Street, Hackensack, NJ 07601 USA Phone +1.201.343.8983 | Fax +1.201.343.2132 | [email protected]

CASE STUDY Biocompatible Epoxies for Medical Device Manufacturing Microelectronics devices composed of integrated circuits are complex and pose many engineering challenges. A careful design must be employed to allow heat to be dissipated from the device and mitigate thermally induced stresses. Adhesive encapsulants have been developed to seal and protect the sensitive electrical components and connections from contaminants and assist with thermal management. Encapsulants provide mechanical support, distribute stresses, and protect sensitive connections from mechanical shock. Typically, encapsulants...

Flip-chip assemblies offer many advantages over wirebonding including higher interconnect density and speed improvements owing to the shorter interconnect lengths. Other benefits include smaller size, greater ruggedness, and lower cost when manufactured at high volume. An example of a flip-chip assembly is shown in Figure 2—in this fabrication method the chip is flipped or inverted with its solder balls facing the contacts of the substrate; thereafter, the solder is remelted to form the electrical connection. The gap present beneath the chip is then underfilled with Figure 2. Flip Chip Assembly...

Figure 3. Resistance to repeated autoclave cycles measured by percent weight loss for EP42HT-4OMed Black versus standard two-component, ambient cure epoxy. Application Example: Implantable neural probe with bond-wires sealed via biocompatible epoxy encapsulant In this application, Raducanu et al.(8) constructed an implantable, active neural probe capable of performing in-vivo neuroscientific studies on laboratory animals. The etch process used to form the electrodes on the chip’s implantable shank was optimized to provide a high degree of smoothness to avoid damage to the animal’s neural tissue....

1 “Enhancing reliability of flip-chip assemblies with underfill encapsulants.” Master Bond. White paper. 2 “Glob top epoxies.” Master Bond. URL: https://www.masterbond.com/industries/glob-top-epoxies. Accessed: August 2020 3 LeGall, C. A., Qu, J. and McDowell, D. “Some mechanics issues related to the thermomechanical reliability of flip chip DCA with underfill encapsulation.” Trans. ASME, vol. EEP-222, pp. 85-95, 1997. 4 Agrawal, A., Satapathy, A. “Experimental investigation of micro-sized aluminum oxide reinforced epoxy composites for microelectronic applications.” Procedia Materials Science,...