Introduction
CIM 500 is a modified epoxy system developed by Massivit 3D for use in their Cast In Motion (CIM) technology. It is designed for direct printing of tools and molds in the composite materials industry, offering isotropic, 3D printed molds with relatively low thermal expansion and high heat deflection temperature.

Key Advantages
- Additive manufacturing casting resin for composite tooling.
- Enables isotropic, 3D printed molds.
- Relatively low thermal expansion.
- High heat deflection temperature.

Mechanical Properties
- Izod Impact (un-notched): 60.0 ± 4.0 J/m (1.12 ± 0.004 ft.lbf/in).
- Linear shrinkage: 0.1%.
- Shore hardness: 85D.
- Tensile stress at break: 50.0 ± 3.1 MPa (7,250 ± 450 psi).
- Elongation at break: 0.9 ± 0.1%.
- Elasticity modulus: 6.1 ± 0.5 GPa (884,000 ± 72,000 psi).
- Flexural stress at break: 50.7 ± 5.3 MPa (7,350 ± 770 psi).
- Flexural elongation at break: 1.2 ± 0.3%.
- Flexural elasticity modulus: 6.2 ± 0.8 GPa (900,000 ± 110,000 psi).
- Compressive strength: 119 MPa (17,260 psi).
- Compressive modulus: 2.3 GPa (333,600 psi).

Physical Properties
- Mix ratio by weight: 75 A: 25 B.
- Mixing viscosity @45°C: 12,000 cP.
- Specific gravity - mixed: 1.53 g/cm³.
- Pot life @60°C: 20 minutes.
- Pot life @RT: 4 hours.
- Cure time @RT: 24 hours, followed by post-curing.
- Mixture color: Gray.

Thermal Properties
- Glass transition temperature (Tg): 156°C (312°F).
- Heat deflection temperature (HDT): 152°C (305°F).
- Coefficient of thermal expansion (CTE) @ 130°C: 29 ppm/°C (16 ppm/°F).
- Thermal conductivity: 0.5-0.6 W/m·k (0.30-0.35 BTU/h·ft·F).

Post-Curing Process
To achieve specified properties, CIM 500 should be heat-cured in a dedicated industrial oven. Post-cured specimens can be milled, polished, or coated. Ensure coatings are fully dry before use.

Storage and Safety
Store base-A and hardener-B in a dry place in sealed containers at +2˚C to +40˚C. Shelf life is 1 year. Avoid direct sunlight. Review the latest Material Safety Data Sheets (MSDS) for health and safety information.