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PCB Laser Cutting

PCB Laser Cutting
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Processing Sensitive Substrates with UV Laser Laser & Electronics

Cost-Effective Laser Processing for Printed Circuit Boards Demand-driven rhythm: today’s sophisticated production plans are pushing processing systems to their limits as product portfolios become more extensive and unexpected layout changes become more frequent. At the same time, cutting quality requirements are increasing. The LPKF MicroLine 6000 P laser system meets these requirements by providing cost-effective industrial laser processing with highly precise results. High Cutting Speed, Low Costs The LPKF MicroLine 6000 P laser system increases production planning while also lowering...

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• Minimum tool costs • Complex contours – without set-up outlay • Flexible production planning • Low maintenance outlay in 24/7 operation • Limited production waste

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• Versatile • Easily combined with handling systems • Self-adjusting beam position • 610 mm x 533 mm (24” x 21”) operating range Easy Automation Linear Actuators Due to the integrated SMEMA interface, the LPKF MicroLine 6000 P laser processing system easily combines with all types of handling systems. Linear actuators for laser head movement are quick, precise and maintenance-free, contributing to the performance of the entire system. Clean Process LPKF laser systems are always delivered with a highcapacity exhaust and filter unit, keeping the work environment and the laser optics clean and...

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Broad Range of Materials In the industrial field, the LPKF MicroLine 6000 P systems are optimized for precise processing of thin, flexible material lines. These new capabilities also make the system a perfect tool for a variety of applications. Flex-Rigid Circuitry and Decap Applications Cutting Rigid and Flexible PCBs Thanks to its high level of process stability, the UV laser of the LPKF MicroLine 6000 P cuts with reliable depth monitoring, a critical precondition for separating rigid components from the flexible components of flex-rigid circuitry. Because the stress-free laser cutting...

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• No thermal or mechanical stress • Particle-free cuts • Premium precision • Material processing with depth monitoring More Flexibility The UV laser wavelength makes the LPKF MicroLine 6000 P a multi-talented system. Since no tools are required for fixing or the cutting process and only layout data need to be adapted, the system is suitable for a wide variety of applications, such as: Cutting Cover Layers The level of integration required for complex electronic products can only be achieved with the precision and fineness of laser technology. Cover layers protect the surfaces of complex...

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MicroLine UV laser system users all over the world enjoy a direct connection to our application centers in Germany, the USA, Japan and China. There they receive support for their new project, new processes, and applications based on LPKF’s years of experience in laser material processing. Training for your operating staff and technical service complete your relationship with the world leader in PCB laser processing. Please contact LPKF for application reports and further information. Enjoy Worldwide Support Technical Data: LPKF MicroLine 6000 P 533 mm x 610 mm x 50 mm (21” x 24” x 2”) Data...

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