Catalogs >
LPKF Laser & Electronics >
LPKF Fusion3D 1500

LPKF Fusion3D 1500
8Pages

Catalog excerpts

Large Components in LDS Processing Laser & Electronics

Step by Step ... In the last years, laser direct structuring (LDS) has proven itself in series production a million times over. The technology has been continuously refined and developed and is now overcoming previous limitations related to component length. The LPKF Fusion3D 1500 maximizes the benefits of cutting edge LDS technology by combining the capability of the LPKF high-performance structuring unit with the flexibility of a compact system.

Open the catalog to page 2

LDS technology advantages: • For large components • Flexible production planning • Fewer parts required • Upgrade options available New Layout Manufacturers benefit when components can be omitted. This reduces production costs and minimizes assembly outlays. But above all, it saves space. LDS proved its capability to eliminate components long ago with smart phone antennas. LDS technology enables designers to meet ongoing demands for integrating more functions in ever-smaller spaces. With the LDS process, already existing plastic components take on electronic functions in addition to their...

Open the catalog to page 3

Key features: • Working range: max. 2 x 400 mm x 78 mm x 80 mm (L x W x H) • Precise linear drivers • Simple fixture design • Upgrade option for multiple processing unit controller (MPC) and up to 3 processing units Proven Technology The LPKF Fusion3D 1500 is a system that transfers the proven LDS technology of smart phone antennas to larger components. The whole system comes in a compact enclosure with handling module and linear actuators that offer precise motion and control. Components are moved into the processing area by a linear system with two drives. Structures can be produced up to...

Open the catalog to page 5

Simple Component Support High-Performance System Software The laser process itself is contact-free. Thus the requirements for the component supports are slight in comparison to the tools needed for other processes. The component supports merely have to ensure the exact infeed of the component to the laser beam. Fixing of the components takes place via clamps or by low pressure; alignment pins give precise positioning. In practice, repeat accuracies of ± 25 µm are achieved over the entire structuring process. From the layout program onto the component – the LPKF CircuitPro3D system software...

Open the catalog to page 6

Structuring Large Components The laser is a precision tool that runs in a defined operating range. High-frequency applications like complex antennas depend on an exact correspondence between the layout and processing result. The scanning field of the processing unit is as large as 160 x 160 x 80 mm (x, y, z). With a double feed, a width of 2 x 78 mm is available. Lengths that exceed the scanning field are processed by stitching together several structuring processes. In this additive process the metallization is built up on the structured surfaces and seamlessly bridges the connection...

Open the catalog to page 7

Technical Data: LPKF Fusion3D 1500 2 x 400 mm x 78 mm x 80 mm (15.8” x 3.0” x 3.1”) Number of processing units (PU) Input data formats IGES, STEP Laser wavelength Laser pulse frequency Machine dimensions (W x H x D) Machine weight 10 kHz – 200 kHz approx. 1,600 kg (3,527 lbs), excluding exhaust unit Operating conditions Electric supply 400 V single phase, 50/60 Hz, max. 7.2 kVA. Not supporting exhaust supply Ambient temperature Exhaust unit required; available as an option * Calibrated scanfield Worldwide (LPKF Headquarters) Hong Kong LPKF Laser & Electronics AG Osteriede 7 30827 Garbsen...

Open the catalog to page 8