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LPKF Contac S4
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Catalog excerpts

LPKF Contac S4 - 1

Reliable Through-hole Plating in the Lab LPKF Contac S4 Microvia cleaning step Tin option Homogeneous copper layer buildup Easy operation Reliable through-hole plating in the development lab Not only double-sided PCBs but also the cores of multilayer PCBs can be reliably and uniformly through-plated with the LPKF Contac S4.

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LPKF Contac S4 - 2

Through-hole Plating for Labs – LPKF Contac S4 for a Reliable Galvanic Process Reliable through-hole plating is key to the success of the challenging PCB prototyping process. Galvanic Through-hole Plating Interconnection of two or more layers is an indispensable part of PCB prototyping. The compact LPKF Contac S4 with six baths reliably performs this task: the board is passed through each stage of a bath cascade. This yields reliable copper layers on the surfaces of all existing vias, even in multilayer boards. The Contac S4 can process up to eight layers with a maximum aspect ratio of 1:10...

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