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LPKF Allegro™ series
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Catalog excerpts

LPKF Allegro™ series - 1

Laser systems for scribing thin-film solar panels LPKF Allegro™ series

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LPKF Allegro™ series - 2

LPKF Allegro™ series • All technologies • All process steps • All substrate sizes CdTe, aSi/ìSi, CIS

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LPKF Allegro™ series - 3

Optimal dynamics Maximal processing speed independent of the cell orientation on the module Efficient utilization of module area Successive laser processes are ideally positioned to each other Clean process Effective particle extraction in the process zone Reliable quality Particular material combinations for the machine basis and motion system ensure freedom from maintenance and longterm accuracy Comfortable process window Constant process parameters despite glass waviness

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LPKF Allegro™ series - 4

Thin-film solar module manufacturers demand efficient equipment for mass production. The highperformance LPKF Allegro™ series offers more than the required speed, precision and reliability in thin-film scribing: in other words perfect efficiency. Profitable solar panel scribing Produce a better product at lower costs LPKF Allegro™ series is based on a special system concept with innovative technical details. The most important development aim for the laser systems was to achieve real customer benefits such as: • Manufacture more modules per shift • Enhance module efficiency • Reduce cost of...

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LPKF Allegro™ series - 5

The conducting and semi-conducting layers on thin-film modules are precisely removed using the laser. According to the different technology requirements in each case the optimum laser process is chosen in order to achieve the best possible results. Laser scribing with LPKF Allegro™ is: faster, more precise, clean Figure 1: Removal of aSi/µSi-absorber and metal back contact without damaging TCO-layers underneath (aSi/µSi P3) Figure 2: Scribing of Molybdenum (CIS P1), track width approx. 45 µm

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LPKF Allegro™ series - 6

LPKF SolarQuipment GmbH Mittelbergstraße 17 DE-98527 Suhl Germany Techical data LPKF Allegro™ series Laser wavelength 1064 nm and 532 nm Scribing line width 35–70 µm Line to line distance 5–15 mm, motor-driven optional Processing From film or non-film side of glass Processing beams Multiple according to customer requirements Substrate dimensions Customer dependent Substrate thickness 2-6 mm Substrate material Float glass Particle Extraction Dimensioning customer dependent Thin-film technologies CdTe, aSi, aSi/µSi, CIS Process integrated quality assurance Optional LPKF SolarQuipment is an...

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