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WSBU

Product catalog summary

Overview: The Logitech Wafer Substrate Bonding Units (WSBU) are designed for premium bonding of fragile semiconductor materials like indium phosphide and gallium arsenide. These units aim to minimize breakage and maintain high sample yield quality.

Specifications: The WSBU is available in single or three-station configurations, with capabilities for vacuum and pressure bonding. The WSB300 model can handle wafers up to 300mm in diameter, making it suitable for high throughput requirements.

Process and Features: The bonding process is controlled via a Graphical User Interface, allowing settings for bonding temperature up to 200°C and vacuum levels. The process includes phases of evacuation, soaking, bonding, and cooling, all completed within 45 minutes depending on parameters. The units support recipe mode for process repeatability and consistency.

Key Features: The WSBU range ensures consistent bond thickness and dimensional accuracy through precise diaphragm control. It supports bonding of single or multiple wafers simultaneously, with a focus on maintaining carrier parallelism.

Technical Specifications: The units require a power supply of 240v/110v Single Phase, mains pressure cold water, and regulated pressurized air. The vacuum pump specifications vary slightly between models, with the single station WSBU and triple station WSBU having different dimensions and weights.

Catalog excerpts

WAFER SUBSTRATE BONDING UNITS Premium bonding for the processing of fragile semiconductor wafers whilst retaining the highest quality of sample yield.

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SUBSTRATE BONDING →→Available as a single or three station benchtop unit with a wafer process capacity of 4”/100mm or 6”/150mm - bond three part or whole wafers consistently with a high standard of support carrier parallelism. →→The full bonding process - evacuation of wafer chamber, heating, pressure bonding and cooling can be completed automatically by the WSBU’s in 45 minutes (depending on the mounting media, wafer size and parameter combination). →→The WSB300 floor standing model allows operators to bond materials and wafers up to 300mm/12” (or smaller multiple samples using a template) in...

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TECHNICAL SPECIFICATIONS Single Station WSBU Triple Station WSBU Power Supply: Water Supply: Mains pressure cold water Vacuum Pump: 4” model: Torr 1.5 x 10 ˉ³ 6” model: mbar 2.0 x 10 ˉ³

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All Logitech Limited catalogs and technical brochures

*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.

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