Semiconductor Wafer Processing
9Pages

{{requestButtons}}

Catalog excerpts

Semiconductor Wafer Processing - 1

PRECISION SEMICONDUCTOR WAFER PROCESSING Routes to success in wafer thinning across a wide variety of semiconductor materials.

Open the catalog to page 1
Semiconductor Wafer Processing - 2

KNOWLEDGE & PROBLEM SOLVING Logitech is a world leader in materials processing, shaping and surface finishing technologies. From a business developing out of a project in 1965, to research advanced semiconductors at the University of Glasgow, one of the world’s oldest and widely-respected academic institutions, Logitech has grown a wealth of knowledge and problem-solving skills in wafer surfacing, thinning and the chemical mechanical polishing of semiconductor wafers. We specialise in the design and manufacture of lapping and polishing equipment. Also in cutting, bonding, testing and...

Open the catalog to page 2
Semiconductor Wafer Processing - 3

PROCESSING FRAGILE MATERIALS Some materials used in semiconductor applications can be considered soft and / or fragile to process in comparison with other materials. These tend to be ranked lower on the Mohs hardness scale. As those within the industry are well aware, semiconductor materials can be expensive, so for more fragile materials, specific processes must be determined to reduce the risk of damage or breakage. All semiconductor wafers go through several customised stages during manufacture. These include: slicing the wafer from the crystal; preparing the surface prior to...

Open the catalog to page 3
Semiconductor Wafer Processing - 4

PROCESSING HARDER MATERIALS The search for cost-effective solutions in semiconductor device production, consistently driven by volume and yield, pushes more and more popular materials on to the market, like silicon carbide for example, which are capable of providing competitive cost reductions when compared to the traditional semiconductor technology. With ever increasing industry requirements, however, and the pressure for high productivity, there is no room for error in device fabrication processes. These ‘hard’ materials, which rank highly on the Mohs hardness scale, are notoriously...

Open the catalog to page 4
Semiconductor Wafer Processing - 5

Whatever your application requirements, Logitech equipment can support your wafer fabrication processes. Our wide range of precision systems provide a full service solution for wafer thinning from bonding, to lapping bulk material removal to chemically polishing for the attainment of defect-free, mirror-like surfaces that are used in device production and test and measurement equipment for process step and sample data collection. EQUIPMENT GLOSSARY To see our full product range please visit our website: logitech.uk.com The PM6 precision lapping and polishing machine will reproduce...

Open the catalog to page 5
Semiconductor Wafer Processing - 6

Logitech's precision lapping and polishing systems are available for a variety of wafer sizes and throughput requirements — including single station units and multiple station units for multi-wafer processing. DL driven-head system Dp driven-head system Wafer substrate bonding unit The Logitech CMP Orbis is a precision engineered, floor standing CMP tool ideally suited for R&D environments. Typically used in applications which conduct pilot production tests with optimum analytical capabilities and enhanced processing performance. The Logitech CMP Tribo is a benchtop chemical mechanical...

Open the catalog to page 6
Semiconductor Wafer Processing - 7

TECHNOLOGY TRANSFER Logitech’s Technology Transfer programme is an integral part of our materials processing systems. Our training courses offer over 50 years of processing expertise and have proven to be the best method of providing information and guidance on the use and maintenance of our systems. 3 & 4: Our in-house facilities include a CMP Lab, a Test & Measurement Lab, a Geology Lab and our Main Training Lab which is fully equipped for customer training sessions 1: Logitech training programmes are carried out at our purpose built, in-house laboratories 2: Customers can expect...

Open the catalog to page 7
Semiconductor Wafer Processing - 8

Logitech offers an extensive range of certified consumable products, carefully developed to work in unison with our range of sample processing systems and machinery. Our own research and analysis provides us with the expertise to achieve the best results from Logitech equipment using diverse material processing applications. Utilising Logitech's consumable range with your Logitech system will enable you to achieve optimal performance and maximise the lifespan of your Logitech equipment. Visit our online store: store.logitech.uk.com

Open the catalog to page 8
Semiconductor Wafer Processing - 9

Logitech Ltd Erskine Ferry Road Old Kilpatrick Glasgow, G60 5EU United Kingdom Tel: +44 (0) 1389 875 444 Email: enquiries@logitech.uk.com Web: logitech.uk.com

Open the catalog to page 9

All Logitech Limited catalogs and technical brochures

  1. NCG-2

    3 Pages

  2. WSBU

    3 Pages

  3. Jigs

    6 Pages

  4. CMP Orbis

    3 Pages

  5. CMP Tribo

    3 Pages

  6. CP4000

    3 Pages

  7. DP Series

    4 Pages

  8. DL Series

    3 Pages

  9. WG6

    3 Pages

  10. LP70

    3 Pages

  11. PM6

    3 Pages

  12. Akribis-air

    3 Pages