Catalog excerpts
PM6 PRECISION LAPPING & POLISHING SYSTEM Produce results typically found on production scale equipment with this highly automated, bench-top system from Logitech.
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PRECISION LAPPING & POLISHING →→Single workstation with a wafer process capacity of up to 4”/100mm – driven jig roller arms greatly increases accuracy and repeatability. →→Bluetooth automatic-plate-flatness control provides continuous in-situ measurement of the plate flatness, automatically correcting any deviation from the specification set by the operator. The PM6 Precision Lapping & Polishing system produces results typically found on production scale equipment. Highly flexible in use, the PM6 allows users to work with many different materials including; gallium arsenide, silicon, rock...
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TECHNICAL SPECIFICATIONS Wafer Capacity: (including extraction port) Power Supply: Plate diameter: Plate speed: Abrasive delivery: Up to two 2L cylinders, measured flow 1-100ml/min delivered via peristaltic pumps
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