PM6
PM6
- Graphical User Interface (GUI): Allows complete control over process conditions including plate speeds, material removal rates, and abrasive feed.
- Material Removal Rates (MRR): Enhanced control and increased rates compared to systems without metered abrasive delivery or driven-jig-arm functionality.
- Chemical Resistance: Options available for resistance to standard CMP chemicals, with integrated cleaning using de-ionised water and nitrogen gun to prevent contamination.
- Metered Abrasive Feed: Peristaltic pumps allow flow rates between 1-100ml/min, improving quality and accuracy while reducing waste and costs.
- Bluetooth Features: Automatic plate flatness control, real-time data collection, and feedback for enhanced accuracy and process control.
- Recipe Mode: Enables creation, saving, and recall of multi-stage process recipes for consistent results across different operators.
- Time Weighted Average (TWA): Functionality for superior results in lapping and CMP processes.
- Automatic Drip Detector: Prevents damage by stopping plate rotation when abrasive cylinders are empty.
- Wafer Capacity: Up to 4”/100mm
- Dimensions: Height: 915mm, Width: 965mm, Depth: 802mm
- Power Supply: 240v/110v Single Phase
- Plate Diameter: 300mm
- Plate Speed: 5-100rpm
- Abrasive Delivery: Up to two 2L cylinders, flow measured 1-100ml/min via peristaltic pumps
Catalog excerpts
PM6 PRECISION LAPPING & POLISHING SYSTEM Produce results typically found on production scale equipment with this highly automated, bench-top system from Logitech.
Open the catalog to page 1
PRECISION LAPPING & POLISHING →→Single workstation with a wafer process capacity of up to 4”/100mm – driven jig roller arms greatly increases accuracy and repeatability. →→Bluetooth automatic-plate-flatness control provides continuous in-situ measurement of the plate flatness, automatically correcting any deviation from the specification set by the operator. The PM6 Precision Lapping & Polishing system produces results typically found on production scale equipment. Highly flexible in use, the PM6 allows users to work with many different materials including; gallium arsenide, silicon, rock and...
Open the catalog to page 2
TECHNICAL SPECIFICATIONS Wafer Capacity: (including extraction port) Power Supply: Plate diameter: Plate speed: Abrasive delivery: Up to two 2L cylinders, measured flow 1-100ml/min delivered via peristaltic pumps
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