Pioneers in the discipline of precision materials processing for over 50 years
32Pages

LEADING THE MATERIAL WORLD Pioneers in the discipline of precision materials processing for over fifty years

The labs: Logitech's custom-built laboratories include a training lab, CMP lab, test & measurement lab and a Geological Thin Section Preparation lab.

CLYDESIDE PRIDE WORLDWIDE REACH 1: Precision engineering is at the heart of Logitech 2: Our HQ is situated on the banks of the River Clyde, under the Erskine Bridge, near the site of the original river ferry 3: Logitech maintains its status as one of the world leaders in materials processing technologies 4: The company was created from a project out of the prestigious University of Glasgow. We are proud to be part of its heritage Logitech are world leaders in materials processing, shaping and surface finishing technologies. The business developed from a project into the research of advanced...

The workshop: All of our machines are precision engineered on-site at our HQ on the banks of the River Clyde in the west of Scotland

1960s Logitech Ltd is founded in 1965 by Dr Bob Wilson and George Bennett, as a spin-off from a research project into advanced semiconductor materials at the University of Glasgow. The first order placed at Logitech was an export, today 90% of our business is export. 1970s Logitech’s Technology Transfer Programme is devised by the in-house process development team at our manufacturing and training facilities. The company achieves global recognition as world leaders in geological thin section preparation as its expertise continues to grow. 1980s Global presence grows further with the...

1990s PM5 Precision Lapping & Polishing System is developed, based on our previous staple lapping and polishing system, the PM2. The PM5 goes on to be one of Logitech's staple machines for over 20 years. 2000s Systems specifically for Chemical Mechanical Planarization (CMP) are launched alongside our CDP systems. Focus turns to the development of hard materials processing with the launch of the driven head, high speed polishing systems. 2010s Logitech CMP dedicated lab is opened. Ever-evolving customer needs are met with the introduction of highly automated processes and the launch of the...

Exacting standards: All of our machines are quality checked by our process development engineers to ensure our high standards are met

TECHNOLOGY TRANSFER 1: Logitech training programmes are carried out at our purpose built, in-house laboratories 2: Customers can expect hands-on, one-to-one training with a Logitech Process Engineer

Logitech’s Technology Transfer programme is an integral part of our materials processing systems. Our training courses offer over 50 years of processing expertise and have proven to be the best method of providing information and guidance on the use and maintenance of our systems. 3 & 4: Our in-house facilities include a CMP Lab, a Test & Measurement Lab, a Geology Lab and our Main Training Lab which is fully equipped for customer training sessions Our training courses are held at our purpose built laboratories at Logitech in Scotland. With over 50 years of combined experience, training...

The full process: We provide full process solutions from initial sample bonding through to test & measurement stages

LAPPING & POLISHING Lapping is a mechanical process involving counter rotating plates using a chemical abrasive with a defined grain size distribution for material removal with minimal specimen damage. Polishing is the chemical, mechanical process often seen as the final material removal process that takes place after lapping, to reduce the amount of surface and sub-surface damage to the specimen. Since our founding over half a century ago, Logitech has been a leader in providing complete, 2-in-1 lapping and polishing system solutions for customers worldwide. Pm6 precision lapping &...

LP50 precision lapping & polishing system The LP50 precision lapping & polishing machine has three work stations offering variable speed settings for greater flexibility, with integral abrasive autofeed system and integral vacuum system. Key features →→Triple station machine with a wafer process capacity up to 150 mm / 6" →→Plate speed up to 70 rpm →→Infra-red drip detector prevents plate running dry and damaging samples, →→ Optional automatic plate flatness control Akribis-air This intelligent sample preparation system delivers the ultimate in processing innovations and is a highly...

CHEMICAL POLISHING Chemical Polishing is widely used as a finishing process for applications that require stringent control over wafer geometry in terms of surface finish, flatness, specimen parallelism and thickness. This provides excellent surface polish with minimal sub-surface damage. CP 3000 / CP 4000 The Logitech CP3000 and CP4000 have been developed as two systems that are resistant to the chemicals used in polishing processes for example: bromine methanol, hydrogen peroxide, ammonia, standard acid or alkaline etches. The CP 3000 is a compact system designed to fit inside your...

CMP Tribo The Logitech CMP Tribo is a bench-top chemical mechanical polishing system ideal for Tribological or CMP applications. This system can achieve nanometer level material removal on a wide variety of wafers / substrate materials used in today’s device fabrication processes. CMP Orbis Key features →→Wafer process capacity of up to 100 mm / 4" →→Ra to subnanometer levels on substrates →→Ideal for tribological and chemical mechanical polishing applications →→ Customisable carrier heads / templates: polish standard wafer diameters, unique diameters or shapes as well as small wafer dies...

DRIVEN HEAD LAPPING & POLISHING SYSTEMS These high-speed driven head lapping & polishing systems were developed by Logitech to allow the creation of flat, thin and uniform samples — which can often be seen as a challenge for some material types. These systems have the largest sample process capacity of any Logitech system so are suited for small research laboratories through to production scale environmen