Catalog excerpts
MODULAR WAFER BONDING SYSTEM Simultaneous processing with up to 12 bonder heads being controlled from one system
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MODULAR WAFER BONDING SYSTEM →→Wafer process capacity of small wafer pieces and wafers sizes from 2” up to 8” per bonding head. Introducing the most recent addition to our range of premium wafer bonders, the Modular Wafer Bonding System (MWBS). The MWBS offers a bonding capacity of small pieces of wafers and wafer sizes, from 2” up to 8” wafers. The modular design allows for up to 12 heads (with the capacity for expansion) from one single control unit. This saves valuable bench space and allows for easy, synchronous and asynchronous processing. →→Modular design with expansion capacity...
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TECHNICAL SPECIFICATIONS 1MWB1 CONTROL UNIT: Power supply: Single Phase, Earth. 110-240V 0.8A (24V DC 1.25A Input cable) Control unit Height: Control unit Depth: Control unit Width: Control unit Weight: 1MWB8 BONDING UNIT: Power supply: Single Phase, Earth. 240V Fuse rating: Earth leakage: Bond unit Height: Bond unit Depth: Bond unit Width: Bond unit Weight Sample size capability: Total Packed weight: Dependent upon number of units (1+1 units = 90kg approx.) Cabinet details: Benchtop modular setup (control panel plus (max 12) bonding units) Logitech Ltd Erskine Ferry Road Old Kilpatrick...
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