Modular Wafer Bonding System

Product catalog summary

Introduction
The document introduces the Modular Wafer Bonding System (MWBS), a versatile and expandable system designed for bonding small wafer pieces and wafers ranging from 2” to 8”. It supports up to 12 bonder heads controlled from a single system, making it suitable for both research and development (R&D) and high-volume production environments.

Key Features & Functionality

Wafer Process Capacity: Handles wafer sizes from 2” to 8” per bonding head.
Modular Design: Allows expansion for cost-effective solutions tailored to specific bonding and throughput needs.
Control System: Manages up to 12 bonding heads from a single unit, enabling synchronous and asynchronous processing.
Customizable Processes: Features fully customized recipe-controlled process cycles for enhanced operator control and repeatability. Recipes can be stored, recalled, and exported via USB.
Graphical User Interface: Sets and controls process conditions, including bonding temperature up to 240°C and vacuum requirements, with options for temperature offset adjustments.
Production Suitability: Ideal for both low throughput R&D and high throughput production, with a SECS/GEM compliant option available for high-volume users.

Bonding Process

Consistent Bonding: Achieves consistent bond thickness and dimensional accuracy through precise control of a flexible diaphragm.
Process Steps: The bonding process includes reaching the set temperature, applying adhesive, creating a vacuum, maintaining temperature during the soak phase, applying pressure during the bond phase, and cooling before removing the sample.
Efficiency: The entire process, including evacuation, heating, pressure bonding, and cooling, is completed in 15-45 minutes depending on the media and wafer size.

Technical Specifications

Control Unit Dimensions: Depth: 285mm, Width: 395mm, Height: 270mm, Weight: 7kg.
Power Supply: Single Phase, Earth. 110-240V 0.8A (24V DC 1.25A Input cable).
Bonding Unit Dimensions: Height: 405mm, Depth: 700mm, Width: 410mm, Weight: 60kg.
Sample Size Capability: Up to 8” single.
Cabinet Details: Benchtop modular setup with control panel and up to 12 bonding units.

Contact Information
Logitech Ltd, Erskine Ferry Road, Old Kilpatrick, Glasgow, G60 5EU, United Kingdom. Tel: +44 (0) 1389 875 444, Email: [email protected], Web: logitech.uk.com

Catalog excerpts

MODULAR WAFER BONDING SYSTEM Simultaneous processing with up to 12 bonder heads being controlled from one system

Open the catalog to page 1

MODULAR WAFER BONDING SYSTEM →→Wafer process capacity of small wafer pieces and wafers sizes from 2” up to 8” per bonding head. Introducing the most recent addition to our range of premium wafer bonders, the Modular Wafer Bonding System (MWBS). The MWBS offers a bonding capacity of small pieces of wafers and wafer sizes, from 2” up to 8” wafers. The modular design allows for up to 12 heads (with the capacity for expansion) from one single control unit. This saves valuable bench space and allows for easy, synchronous and asynchronous processing. →→Modular design with expansion capacity allowing...

Open the catalog to page 2

TECHNICAL SPECIFICATIONS 1MWB1 CONTROL UNIT: Power supply: Single Phase, Earth. 110-240V 0.8A (24V DC 1.25A Input cable) Control unit Height: Control unit Depth: Control unit Width: Control unit Weight: 1MWB8 BONDING UNIT: Power supply: Single Phase, Earth. 240V Fuse rating: Earth leakage: Bond unit Height: Bond unit Depth: Bond unit Width: Bond unit Weight Sample size capability: Total Packed weight: Dependent upon number of units (1+1 units = 90kg approx.) Cabinet details: Benchtop modular setup (control panel plus (max 12) bonding units) Logitech Ltd Erskine Ferry Road Old Kilpatrick Glasgow,...

Open the catalog to page 3

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