LP70
LP70
- Multi-Station Capability: The system includes four workstations, each capable of processing wafers up to 100mm/4" in diameter, with individually controlled jig speeds for precise results.
- Graphical User Interface (GUI): Operators can control all process conditions, including plate speeds, material removal rates, and jig speeds, through an intuitive GUI.
- Bluetooth Integration: Features such as automatic plate flatness control and real-time data collection are Bluetooth-enabled, allowing for continuous monitoring and feedback.
- Metered Abrasive Feed: The system uses peristaltic pumps to deliver a controlled flow of abrasive, enhancing accuracy and reducing waste.
- Recipe Mode: Operators can create, save, and recall multi-stage process recipes, ensuring repeatability across different users.
- Sample Capacity: Various jig configurations are available, including PP5, PP6, PP8, PLJ7, WG6, and VPB7, accommodating different sample sizes and types.
- Dimensions: Height: 1000mm, Width: 950mm, Depth: 730mm.
- Power Supply: 240v/110v Single Phase.
- Plate Diameter: 400mm with speeds ranging from 5 to 100rpm.
- Abrasive and Colloidal Delivery: Up to two 2L cylinders with a flow rate of 1-100ml/min delivered via peristaltic pumps.
- Automatic Drip Detector: Prevents damage by stopping plate rotation when abrasive cylinders are empty.
- Chemical Resistance Option: Available for use with standard chemicals in CMP applications, with integrated cleaning systems to prevent contamination.
Catalog excerpts
LP70 PRECISION LAPPING POLISHING SYSTEM Achieve results to stringent specifications with this highly automated, multi-station precision lapping and polishing system from Logitech.
Open the catalog to page 1
PRECISION LAPPING & POLISHING →→Four workstations each with a wafer process capacity of up to 100mm/4” - jig speed of each workstation individually controlled for highly accurate results and the use of driven jig roller arms greatly increases accuracy and repeatability. →→Bluetooth automatic-plate-flatness control provides continuous in-situ measurement of the plate flatness, automatically correcting any deviation from the specification set by the operator. The LP70 multi-station precision lapping and polishing system. This bench-top machine is designed to run concurrent automated processes,...
Open the catalog to page 2
x4 (75mm/3”) or x3 + Automatic Plate Flatness Monitor x4 (100mm/4”) or x3 + Automatic Plate Flatness Monitor x2 PP8 Jigs (150mm/6”) + Automatic Plate Flatness Monitor x2 (up to 14 28x28mm slides per PLJ7 jig) + Automatic Plate Flatness Monitor x2 Up to six 26x48mm slides at one time per head x2 (up to 14 28x28mm slides per polishing jig) Power Supply Plate Diameter Plate Speed Abrasive Delivery Up to two 2L Cylinder, measured flow 1-100ml/min delivered to all four stations via peristaltic pumps and slurry chute Colloidal Delivery 1-100ml/min delivered to all four stations via peristaltic pumps...
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