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Logitech Limited
Catalog excerpts
LP70 PRECISION LAPPING POLISHING SYSTEM Achieve results to stringent specifications with this highly automated, multi-station precision lapping and polishing system from Logitech.
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PRECISION LAPPING & POLISHING →→Four workstations each with a wafer process capacity of up to 100mm/4” - jig speed of each workstation individually controlled for highly accurate results and the use of driven jig roller arms greatly increases accuracy and repeatability. →→Bluetooth automatic-plate-flatness control provides continuous in-situ measurement of the plate flatness, automatically correcting any deviation from the specification set by the operator. The LP70 multi-station precision lapping and polishing system. This bench-top machine is designed to run concurrent automated...
Open the catalog to page 2
x4 (75mm/3”) or x3 + Automatic Plate Flatness Monitor x4 (100mm/4”) or x3 + Automatic Plate Flatness Monitor x2 PP8 Jigs (150mm/6”) + Automatic Plate Flatness Monitor x2 (up to 14 28x28mm slides per PLJ7 jig) + Automatic Plate Flatness Monitor x2 Up to six 26x48mm slides at one time per head x2 (up to 14 28x28mm slides per polishing jig) Power Supply Plate Diameter Plate Speed Abrasive Delivery Up to two 2L Cylinder, measured flow 1-100ml/min delivered to all four stations via peristaltic pumps and slurry chute Colloidal Delivery 1-100ml/min delivered to all four stations via peristaltic...
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