DP Series

DP Series

DP Series

Product catalog summary
Overview: The Logitech DP high-speed polishing systems are designed for the semi-automated polishing of hard-to-process semiconductor materials such as sapphire, silicon carbide (SiC), and gallium nitride (GaN). These systems aim to reduce polishing times and increase throughput.
System Configurations: The DP series is available in two configurations: the DP1 with a single workstation and the DP4 with four workstations. The DP1 can handle materials up to 300mm, while the DP4 can process up to 260mm per workstation.
Key Features:
  • High downforce application: The DP1 can apply up to 200kg, and the DP4 up to 50kg per carrier head.
  • Manual and Automatic Modes: Allows for control over process parameters and the ability to save multi-stage process recipes for repeatability.
  • Safety and Compliance: Equipped with door interlocks and a built-in fume cabinet for handling toxic materials.
  • Real-time Monitoring: Graphical User Interface (GUI) displays key parameters for real-time analysis.
  • Chemical Resistance: Resistant to standard CMP chemicals, with integrated cleaning systems to prevent contamination.
Technical Specifications:
  • Dimensions: DP1 - Height: 2020mm, Width: 1577mm, Depth: 730mm (1025mm with services); DP4 - Height: 2038mm, Width: 2020mm, Depth: 1125mm (1269mm with services).
  • Power Supply: DP1 - 230v 16A max; DP4 - 400-500Vac, 3 Phase.
  • Plate Diameter: DP1 - 560mm; DP4 - 700mm.
  • Carrier Speed: DP1 - 5-125rpm; DP4 - 10-60rpm.
  • Slurry Flow Rate: 5-100ml per minute for both systems.
Applications: Suitable for small research laboratories to production-level environments, offering flexibility and high throughput for polishing hard materials.
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Catalog excerpts

DP Series-1

DL SERIES PRECISION LAPPING SYSTEMS High-speed polishing systems with driven-head technology for the semi-automated polishing of “hard-to-process” materials.

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DP Series-2

DP SERIES PRECISION POLISHING SYSTEMS The Logitech DP high speed polishing systems were developed to address the issue of polishing times when processing semiconductor materials often describe as “hard” to polish within the industry. These systems have been designed for semiautomated final stage polishing of hard materials such as sapphire, silicon carbide (SiC) or gallium nitride (GaN). Available as with a single or four workstations, the DP range can process materials up to 300mm (or multiple smaller samples) on the DP1 and 260mm per workstation (or multiple smaller samples) on the DP4. The...

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DP Series-3

KEY FEATURES & FUNCTIONALITY → Stand-alone system with the option to come as a single or four station unit, with a process capacity of up to 300mm on the DP1 and 260mm per workstation on the DP4 (or multiple smaller samples). → Door interlocks are installed on the DP systems while the built-in fume cabinet caters for processes involving toxic materials ensuring current health and safety regulations are adhered to. → The DP1 polishing carrier head can apply up to 200kg of download and the DP4 up to 50kg per carrier head - resulting in the highest sample thoughput of any Logitech polishing system....

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DP Series-4

TECHNICAL SPECIFICATIONS System Power Supply Plate Diameter Carrier Speed Carrier Download Slurry Flow Rate Logitech Ltd Erskine Ferry Road Old Kilpatrick Glasgow, G60 5EU United Kingdom Tel: +44 (0) 1389 875 444 Email: [email protected] Web: logitech.uk.com

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.