Achieve the highest possible standards of processing control with this bench-top system designed for the research of wafer processing.

→→Bench-top CMP system designed with the research of wafer processes in mind with secondary applications in the field of Tribological science and research. →→ The ability to process part wafers and full wafers up to 4”/100mm on the 400mm polishing plate. The Logitech CMP Tribo is a bench-top chemical mechanical polishing (CMP) system designed with the research of wafer processes in mind, including their associated wafer, pad and slurry interactions. Primary application areas for the CMP Tribo are in the field of CMP planarization or delayering, with secondary application in the field of Tribological...

TECHNICAL SPECIFICATIONS Carrier sizes available: 100mm/4” - Templates can be used to allow partial and smaller sizes. Power supply: Plate diameter: Carrier speed: Carrier down pressure: Carrier back pressure: Slurry flow rate: