CMP Tribo

CMP Tribo

CMP Tribo

Product catalog summary
Overview: The Logitech CMP Tribo is a bench-top chemical mechanical polishing (CMP) system designed for wafer processing research. It is also applicable in tribological science research. The system is engineered to achieve high standards of processing control, offering versatility and precision in wafer, pad, and slurry interactions.
Key Features & Functionality:
  • Designed for both part and full wafers up to 4”/100mm on a 400mm polishing plate.
  • Recipe mode for building, saving, and recalling multi-stage processes, ensuring repeatability across operators.
  • Independent settings for carrier and pad conditioner arms, allowing customization of sweep, amplitude, and force.
  • Optional integration of up to four independent slurry pumps for diverse process requirements.
  • Real-time process information via advanced in-situ sensors, aiding in End Point Detection (EPD) and process stability.
Technical Specifications:
  • Carrier sizes: 100mm/4” with templates for smaller sizes.
  • Dimensions: Height - 1123mm, Width - 1382mm, Depth - 985mm.
  • Power supply: 220v - 240v, 16Amps, 50/60Hz.
  • Plate diameter: 400mm.
  • Carrier speed: 10-100rpm.
  • Slurry flow rate: 20-500 ml/minute.
  • Carrier down pressure: Min 0.4psi/2.8kPa, Max 9psi/62kPa.
  • Carrier back pressure: Max 50psi/62kPa.
Additional Features:
  • Touch screen interface for configuring parameters such as CoF, carrier load, and slurry delivery.
  • Automated CMP process capabilities, freeing operator time.
  • Chemically resistant to standard CMP chemicals, with integrated cleaning features.
Applications: Primarily used for CMP planarization or delayering, with secondary applications in tribological research. The system is suitable for laboratories with limited space, maintaining high performance standards.
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Catalog excerpts

CMP Tribo-1

Achieve the highest possible standards of processing control with this bench-top system designed for the research of wafer processing.

 Open the catalog to page 1
CMP Tribo-2

→→Bench-top CMP system designed with the research of wafer processes in mind with secondary applications in the field of Tribological science and research. →→ The ability to process part wafers and full wafers up to 4”/100mm on the 400mm polishing plate. The Logitech CMP Tribo is a bench-top chemical mechanical polishing (CMP) system designed with the research of wafer processes in mind, including their associated wafer, pad and slurry interactions. Primary application areas for the CMP Tribo are in the field of CMP planarization or delayering, with secondary application in the field of Tribological...

 Open the catalog to page 2
CMP Tribo-3

TECHNICAL SPECIFICATIONS Carrier sizes available: 100mm/4” - Templates can be used to allow partial and smaller sizes. Power supply: Plate diameter: Carrier speed: Carrier down pressure: Carrier back pressure: Slurry flow rate:

 Open the catalog to page 3
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.