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TVS Diode Array (SPA) Catalog

TVS Diode Array (SPA) Catalog

Product catalog summary

Introduction to TVS Diode Arrays (SPA® Diodes)
Littelfuse's TVS Diode Arrays are designed to protect signal lines from transient threats with low clamp voltage, offering enhanced protection over conventional diodes by absorbing repetitive ESD strikes without performance degradation.

Key Features

Low capacitance ranging from 30pF to 0.40pF.
High protection levels: ESD up to ±30kV, Lightning immunity up to 150A, EFT up to 40A.
Low clamping voltage and up to 14 inputs protection.
Space-saving designs, RoHS compliant, Lead-Free, and Halogen-Free.

How They Work
These devices protect against ESD, EMI, and Lightning by absorbing transients and clamping voltage levels, ensuring low clamp voltage during over-voltage conditions and maintaining low leakage current during normal operation.

Data Protocols and Applications
Diagrams show the relationship between data rates, applications, and applicable Littelfuse devices, emphasizing the importance of considering capacitance in high bandwidth applications to prevent signal degradation.

Product Series and Applications
The catalog lists various Littelfuse TVS Diode Arrays, detailing specifications such as working voltage, capacitance, ESD rating, and surge rating, mapping these products to suitable applications like USB ports, HDMI, Ethernet, and more.

Port Protection Examples
Examples of ESD and lightning suppression implementations for different ports, including Ethernet, USB, and HDMI, illustrate the use of Littelfuse products in protecting high-speed data ports and entertainment electronics.

Legal Disclaimers
Littelfuse disclaims liability for errors or inaccuracies in the document and emphasizes that product specifications do not modify their terms and conditions of purchase.

Right to Make Changes
Littelfuse reserves the right to modify products without prior notice. Products are not intended for life support applications unless specified, and customers assume risks for such uses.

Intellectual Property
No licenses to intellectual property rights are granted by this document. Product names may be trademarks of their respective owners.

Definitions

Operating Voltage Range: The voltage range for power supply across terminals.
Forward Voltage Drop: Maximum voltage drop for a specific current.
Reverse Voltage Drop: Voltage at which current begins to conduct.
Reverse Standoff Voltage: Should be equal to or greater than peak operating voltage.
Reverse Leakage Current: Maximum off-state leakage current.
Clamping Voltage: Maximum voltage during peak pulse current.
Input Leakage Current: DC current at input pins at specified voltage.
Quiescent Supply Current: Maximum DC current at maximum voltage.
Capacitance: Measured between input pin and reference.

Transient Threats
Transients are short surges of electrical energy caused by energy release or induction, such as from lightning or ESD. Key characteristics include:

Lightning: 25kV, 20kA, 10µs rise-time.
Switching: 600V, 500A, 50µs rise-time.
EMP: 1kV, 10A, 20ns rise-time.
ESD: 8kV, 30A, <1ns rise-time.

Characteristics of Transient Voltage Spikes
Transients exhibit a "double exponential" wave. Lightning has a rise time of 1.2µs to 10µs, while ESD is less than 1.0ns.

Why are Transients of Increasing Concern?
Miniaturization increases sensitivity to electrical stresses. Microprocessors in various devices are vulnerable to transients, necessitating careful circuit design.

Transient Voltage Threats and Scenarios
ESD and lightning-induced transients pose significant risks. Inductive load switching generates high-energy transients. Proper suppressor technology selection is crucial.

ESD Electrical Characteristics
ESD has a rapid rise time and high peak voltages. IEC61000-4-2 standard defines ESD event models for user environments.

ESD Damage Risks
ESD can cause soft failures, latent defects, or catastrophic failures. Circuit protection components like Littelfuse SPA® Diodes can mitigate these risks.

Why Implement Circuit Protection?
ESD can cause significant damage, leading to financial losses and reputational harm. Implementing ESD suppression strategies early in design can prevent these issues.

ESD Suppression Strategies
Chip-level ESD protection involves trade-offs between protection and die space. Littelfuse offers solutions to maximize protection with minimal space usage.

Board Level ESD Protection
Board layout is crucial in portable systems to prevent voltage overshoot from parasitic inductance, which can damage circuits. The need for board-level protection varies based on factors like board layout, IC ESD capabilities, and the potential for ESD transients to reach data lines. Empirical testing can help determine system susceptibility.

ESD Suppression and Circuit Design Considerations
Proper circuit protection reduces ESD risks. Littelfuse TVS Diode Arrays offer low capacitance to prevent signal degradation in high-speed communications. Designers should consider potential ESD entry points and select appropriate diode arrays for protection.

Common ESD Entry Points
ESD can enter devices through various paths, such as capacitive coupling, current injection, voltage pulses, magnetic fields, and electromagnetic fields. Identifying and fortifying weak points is essential.

ESD Suppression Strategies and Standards
Littelfuse TVS Diode Arrays provide low peak and clamping voltages for IC protection. Key considerations for suppressor selection include capacitance, peak voltage, clamping level, dynamic resistance, leakage current, standoff voltage, and the number of lines to be protected.

ESD Immunity Test Standards
Manufacturers use standards like MIL-STD-883 Method 3015 and IEC61000-4-2 for testing. The MIL-STD-883 is commonly used in manufacturing, while IEC61000-4-2 is used for system-level testing. The IEC standard results in higher peak currents compared to the military standard.

Additional Transient Immunity Considerations
Film resistors provide minimal protection and can be damaged by transients. Active components are crucial for ESD immunity, and multi-suppressor combinations can enhance protection. Preventive software programming and careful component selection are also important.

Legal Disclaimers
Littelfuse disclaims liability for errors or inaccuracies in the document and reserves the right to make changes without notice. Products are not intended for life support applications unless specified, and users should evaluate products for their specific applications.

Overview: The SP720 series is designed for ESD and over-voltage protection of sensitive input circuits. It features two protection SCR/Diode device structures per input, allowing protection for up to 14 external signal or bus lines. The protection mechanism involves clamping over-voltage from input pins to V+ or V-.

Specifications: The device operates with a continuous supply voltage of up to +35V and can handle forward peak currents of ±2A for 100µs. The operating temperature range is from -40°C to 105°C, with a maximum junction temperature of 150°C. The device is not intended for life support applications.

Electrical Characteristics: The SP720 has an operating voltage range of -2V to 30V, with a forward voltage drop of 2V for both IN to V- and IN to V+. Input leakage current ranges from -20 to 20 nA, and the input capacitance is 3 pF.

ESD Protection: The SP720 provides robust ESD protection, with capabilities exceeding 15kV for air discharge and 4kV for direct discharge according to IEC 61000-4-2 standards. The device also supports dual pin configurations for enhanced protection.

Thermal and Mechanical Information: The thermal resistance for PDIP and SOIC packages is 90°C/W and 130°C/W, respectively. The device is available in PDIP and SOIC packages, with specific dimensions and tolerances outlined for each.

Applications: The SP720 is suitable for microprocessor/logic input protection, data bus protection, and analog device input protection. It is designed to clamp over-voltage conditions effectively, ensuring the safety of connected circuits.

Ordering Information: The SP720 series is available in various package types, including lead-free and green options, with specific part numbers for different environmental conditions and packaging preferences.

Overview
The document provides technical specifications and details for the SP721 series of TVS Diode Arrays, designed for general-purpose ESD protection. These arrays are used to protect sensitive input circuits from electrostatic discharge (ESD) and over-voltage conditions.

Specifications
- ESD Interface Capability: Meets MIL STD 3015.7 with 15kV and IEC 61000-4-2 standards with 4kV for direct discharge and 15kV for air discharge.
- High Peak Current Capability: ±3A for IEC 61000-4-5 (8/20µs), ±2A for 100µs pulse width, and ±5A for 4µs pulse width.
- Voltage Protection: Single-ended voltage range up to +30V and differential voltage range up to ±15V.
- Fast Switching: 2ns rise time.
- Low Input Leakages: 1nA at 25ºC typical.
- Low Input Capacitance: 3pF typical.
- Operating Temperature Range: -40ºC to 105ºC.

Applications
The SP721 is suitable for protecting microprocessor/logic inputs, data buses, and analog device inputs. It provides voltage clamping and can protect up to six external signal or bus lines.

Functional Description
The SP721 uses SCR/Diode bipolar structures for protection. It triggers fast at a threshold of one diode threshold above V+ or below V-. It clamps to V+ or V- when transient pulses exceed these thresholds.

ESD Capability
The SP721's ESD capability varies with the test standard. It exceeds 15kV for air discharge and 4kV for direct discharge under IEC 61000-4-2 standards. The device can handle up to 8kV when two pins are used in parallel.

Absolute Maximum Ratings
- Continuous Supply Voltage: +35V
- Forward Peak Current: ±2A for 100µs
- Maximum Storage Temperature: -65 to 150ºC
- Maximum Junction Temperature: 150ºC
- Maximum Lead Temperature: 260ºC

Electrical Characteristics
- Operating Voltage Range: -2 to 30V
- Forward Voltage Drop: 2V typical
- Input Leakage Current: -20 to +20nA
- Quiescent Supply Current: 50 to 200nA
- Input Capacitance: 3pF
- Input Switching Speed: 2ns

Package Information
The SP721 is available in PDIP and SOIC packages. The document provides detailed dimensions and tolerances for these packages.

Reflow Soldering Parameters
Details on the reflow soldering process are provided, including preheat and peak temperature conditions.

Conclusion
The SP721 series offers robust ESD and over-voltage protection for various electronic applications, with high peak current capability and fast response times.

Overview: The document provides technical specifications and application details for the SP723 Series TVS Diode Arrays, designed for general-purpose ESD protection. It includes information on dimensions, electrical characteristics, and application guidelines.

Specifications:

ESD Protection: Complies with IEC 61000-4-2 standards, offering 8kV direct discharge and 15kV air discharge protection. MIL-STD-3015.7 provides up to 25kV protection.
Peak Current Capability: Handles ±7A for 8/20µs pulse and ±4A for 100µs pulse.
Voltage Range: Single-ended up to +30V, differential up to ±15V.
Switching Speed: Fast switching with a 2ns rise time.
Operating Temperature: -40ºC to 105ºC.

Applications:

Microprocessor/Logic Input Protection
Data Bus Protection
Analog Device Input Protection
Voltage Clamping

Package Information:

Available in PDIP and SOIC packages, with lead-free and green options.
Dimensions and tolerances are specified according to ANSI Y14.5M-1982 standards.

Notes:

Dimensions do not include mold flash or protrusions, which should not exceed specified limits.
Lead width and terminal positions are detailed for accurate assembly and soldering.

Additional Information: The document includes a disclaimer about the suitability of Littelfuse products for specific applications and advises independent evaluation by users.

Material and Product Specifications
The document outlines the specifications for a product with a lead material of copper alloy and a substitute material of silicon. The body material is molded epoxy with a flammability rating of UL 94 V-0. The lead coplanarity is specified at 0.004 inches (0.102mm).

Package Dimensions and Tolerances
The package dimensions are provided for Small Outline Plastic Packages (SOIC), with specific tolerances and dimensioning standards per ANSI Y14.5M-1982. Key dimensions include:

Dimension D: 4.80 to 5.00 mm (0.1890 to 0.1968 inches), excluding mold flash and protrusions.
Dimension E: 3.80 to 4.00 mm (0.1497 to 0.1574 inches), excluding interlead flash.
Lead width B: Maximum 0.61 mm (0.024 inches).

Ordering Information
Part numbers are provided with temperature ranges from -40 to 105°C, available in different package types such as 8 Ld PDIP and 8 Ld SOIC, with options for lead-free and green environmental compliance.

Product Description and Features
The SP724 series is described as a general-purpose ESD protection array, featuring:

4 SCR/Diode pairs in a 6-Lead SOT-23 package.
ESD capability per IEC 61000-4-2 standards, with direct discharge up to 8kV and air discharge up to 15kV.
Peak current capability of ±3A for IEC 61000-4-5 (8/20µs).
Low input leakage of 1nA and low input capacitance of 3pF.

Applications
The SP724 is suitable for protecting sensitive digital or analog input circuits on data, signal, or control lines operating on power supplies up to 20VDC. It is used in microprocessor/logic input protection, data bus protection, and analog device input protection.

ESD Capability and Testing
The document details the ESD capability of the SP724, tested to various standards including IEC 61000-4-2 and MIL-STD-3015.7. The SP724 achieves a Level 4 rating for ESD protection, with specific test conditions outlined in Table 1.

Thermal and Electrical Characteristics
Key thermal and electrical characteristics include:

Operating voltage range: 1 - 20V.
Forward voltage drop: 2V at peak pulse.
Input leakage current: -10 to 10 nA.
Maximum junction temperature: 150°C.

Soldering and Reflow Conditions
The document provides soldering parameters for Pb-free assembly, with a peak temperature of 260°C and specific ramp-up and ramp-down rates.

Disclaimer
The document includes a disclaimer noting that specifications are subject to change and that users should independently evaluate the suitability of the product for their applications.

Overview: The document provides technical specifications and guidelines for the SP724 and SP725 series of TVS Diode Arrays by Littelfuse, designed for general-purpose ESD protection.

Specifications: The SP724 and SP725 series are designed to protect sensitive input circuits from ESD and overvoltage. They feature a peak current capability of ±14 A for 8/20 µs pulses and a fast switching time of 2 ns. The operating temperature range is -40 ºC to 105 ºC.

Product Characteristics: The diodes are made with copper alloy leads, matte tin plating, and molded epoxy body material. They comply with UL 94 V-0 flammability standards.

Ordering Information: The SP724AHTG is available in tape and reel packaging with a minimum order quantity of 3000 pieces. The SP725 series is available in 8-lead SOIC packages with minimum order quantities of 1960 or 2500 pieces, depending on the packaging.

Applications: These diode arrays are suitable for microprocessor/logic input protection, data bus protection, and analog device input protection. They provide over-voltage protection with a single-ended voltage range up to +30V and a differential voltage range up to ±15V.

ESD Protection: The SP725 series meets IEC 61000-4-2 standards with a capability of 8kV for direct discharge and 15kV for air discharge. It also meets MIL-STD-3015.7 standards with a capability of 25kV.

Package Dimensions: The document includes detailed dimensions for the SOIC package, emphasizing the importance of precise measurements for proper installation and performance.

Disclaimer: Littelfuse advises users to independently evaluate the suitability of the products for their applications, as the specifications are subject to change without notice.

Overview: The SP05 Series of TVS Diode Arrays (SPA® Diodes) is designed for general-purpose ESD protection. These devices are used to suppress electrostatic discharge (ESD) and other transient overvoltage events, adhering to IEC 61000-4-2 standards for ESD requirements. They are suitable for protecting sensitive digital or analog input circuits on data, signal, or control lines with voltage levels up to 5VDC.

Features: The SP05 Series includes arrays of 2 to 6 TVS avalanche diodes in ultra-small packages such as SC70, SOT-23, SOT-143, or MSOP. Key features include:

ESD capability up to 30kV for both direct and air discharge.
Fast response time of less than 1ns.
Low input capacitance of 30pF, ideal for high-speed signal line protection.
Operating temperature range from -40ºC to 85ºC.

Applications: These diodes are used in various portable and digital devices, including mobile phones, PDAs, laptops, digital cameras, and MP3 players. They also provide input protection for computer ports and keyboards.

Specifications: The SP05 Series offers:

Reverse standoff voltage up to 5.5V.
Clamp voltage during ESD events up to 12V for positive and -8V for negative discharges.
Storage temperature range from -65ºC to 150ºC.
Diode dynamic resistance of 1.0Ω for forward conduction and 1.4Ω for reverse conduction.

Soldering and Packaging: The series supports Pb-free assembly with a peak reflow temperature of 260°C. The devices are available in various package dimensions, with specific recommendations for pad layouts to ensure optimal performance.

Ordering Information: The SP05 Series is available in different configurations, with part numbers indicating the number of channels and package type. Products are available in tape and reel packaging, with quantities per reel specified for each configuration.

Disclaimer: Littelfuse provides these products with the understanding that users will independently evaluate their suitability for specific applications. The products are not intended for life support or life-saving applications unless expressly indicated.

Overview: The document provides detailed specifications and information on TVS Diode Arrays (SPA® Diodes) for general-purpose ESD protection, specifically focusing on the SP1002, SP1003, and SP1004 series. These diodes are designed to protect electronic equipment from electrostatic discharges (ESD) and other electrical transients.

SP1002 Series:

Specifications: The SP1002 series is available in SC70-3, SC70-5, and SC70-6 packages. The document provides detailed dimensions in both millimeters and inches for these packages.
Part Numbering: The series includes part numbers SP1002-01JTG and SP1002-02JTG, indicating different channel configurations and packaging options.

SP1003 Series:

Description: Utilizes Zener diodes with silicon avalanche technology to protect I/O pins from ESD. Capable of absorbing ±30kV ESD strikes and dissipating 7A surge current.
Features: RoHS compliant, low leakage current, and available in compact SOD723/SOD882 packages. Suitable for mobile phones, tablets, and other portable devices.
Electrical Characteristics: Includes parameters like forward voltage drop, reverse voltage drop, and ESD withstand voltage.
Soldering Parameters: Details on reflow conditions for Pb-free assembly, including temperature ranges and ramp rates.

SP1004 Series:

Description: Back-to-back Zener diodes for bidirectional protection, capable of withstanding ±8kV contact discharge and ±15kV air discharge.
Features: Low capacitance, suitable for high-speed signal pins, and available in a small SOT953 package.
Electrical Characteristics: Includes reverse voltage drop, clamp voltage, and ESD withstand voltage.
Soldering Parameters: Similar reflow conditions as the SP1003 series.

General Information:

Disclaimer: Users should independently evaluate the suitability of the products for their applications. Littelfuse products are not designed for all applications, especially life-sustaining or life-saving applications.
Ordering Information: Lists part numbers, package types, and minimum order quantities for each series.

Overview: The document provides technical specifications and details for TVS Diode Arrays (SPA® Diodes) from Littelfuse, focusing on the SP1005, SP1006, and SP1007 series. These diodes are designed for electrostatic discharge (ESD) protection in electronic devices.

Specifications: The diodes are fabricated using silicon avalanche technology and are capable of handling ESD strikes above the IEC 61000-4-2 standard. They feature low capacitance and leakage current, making them suitable for high-speed data lines.

Key Features:

ESD protection up to ±30kV contact and air discharge.
Low capacitance and leakage current.
Space-efficient packaging options like 0201 Flipchip and SOD882.
AEC-Q101 qualified for automotive applications.

Applications: These diodes are used in mobile phones, smart phones, camcorders, portable medical devices, digital cameras, MP3 players, tablets, and point of sale terminals.

Electrical Characteristics: The document details parameters such as reverse standoff voltage, breakdown voltage, leakage current, and clamping voltage. It also provides thermal information and soldering parameters for the diodes.

Package Information: The document includes dimensions and recommended soldering pad layouts for different package types, including 0201 Flipchip and SOD882.

Disclaimer: Littelfuse advises users to independently evaluate the suitability of the products for their applications, as the products are not designed for life support or life-saving applications.

Overview: The document provides technical specifications and application details for the SP1007, SP1008, and SP1011 series of TVS Diode Arrays by Littelfuse, Inc. These components are designed for electrostatic discharge (ESD) protection in various electronic devices.

Specifications:

SP1007 Series: Features a bidirectional discrete TVS with a capacitance of 3.5pF and ESD withstand voltage of ±8kV (contact discharge) and ±15kV (air discharge). It operates within a temperature range of -40 to 125°C.
SP1008 Series: Offers a bidirectional discrete TVS with a capacitance of 6pF and ESD withstand voltage of ±15kV for both contact and air discharge. It supports a peak current of 3A and operates within the same temperature range as the SP1007.
SP1011 Series: Provides unidirectional TVS protection with a capacitance of 7pF and ESD withstand voltage of ±15kV (contact) and ±30kV (air). It is suitable for high-speed signal pins due to its low capacitance.

Applications: These TVS Diode Arrays are used in mobile phones, smart phones, camcorders, portable medical devices, digital cameras, MP3/PMP players, tablets, and other portable electronic devices.

Key Features:

RoHS compliant, halogen-free, and lead-free.
Designed to absorb repetitive ESD strikes without performance degradation.
Space-efficient footprints suitable for compact electronic devices.

Soldering and Thermal Information:

Maximum junction temperature is 150°C, with a maximum lead temperature of 260°C for soldering.
Reflow conditions for Pb-free assembly include a peak temperature of 260°C with specific ramp-up and ramp-down rates.

Package Dimensions: Detailed dimensions are provided for the 0201 Flip Chip and SOD882 packages, including recommended solder pad layouts.

Ordering Information: Part numbers and minimum order quantities are specified for each series, with options for different package types and configurations.

Disclaimer: Users are advised to independently evaluate the suitability of these products for their applications, as Littelfuse products are not designed for all applications.

Overview: This document provides technical specifications and guidelines for TVS Diode Arrays (SPA® Diodes) focusing on the SP1011, SD05, and SD05C series. These diodes are designed for general-purpose ESD protection in electronic equipment.

SP1011 Series:

Package Dimensions: The SP1011 series is housed in a µDFN-6 package with dimensions of 1.25x1.0x0.5mm, compliant with JEDEC MO-229 standards.
Soldering Parameters: Reflow conditions for Pb-free assembly include a preheat temperature range of 150°C to 200°C, with a peak temperature of 260°C not to be exceeded.
Ordering Information: Part number SP1011-04UTG is available in a µDFN-6 package with a minimum order quantity of 3000 units.

SD05 Series:

Description: The SD05 TVS diode is designed to replace multilayer varistors in low-speed and DC applications, providing protection against ESD and transient events.
Features: Capable of handling ±30kV ESD strikes and 30A surge currents with low clamping voltages. It is packaged in a small SOD323 format.
Electrical Characteristics: Includes a reverse voltage drop of 6V and a leakage current of 1.0 μA at 5V.

SD05C Series:

Description: Similar to the SD05, the SD05C is a bidirectional TVS diode offering protection for sensitive equipment from ESD and transient events.
Features: Handles ±30kV ESD strikes and 30A surge currents, with a low clamping voltage and packaged in SOD323.
Electrical Characteristics: Reverse voltage drop of 6V, leakage current of 1.0 μA, and a diode capacitance of 200 pF.

General Notes:

All dimensions are in millimeters and include solder plating.
Specifications are subject to change without notice, and users should evaluate the suitability of products for their applications.

Overview: The document provides technical specifications for the SP3001 and SP3002 series of low capacitance ESD protection diodes by Littelfuse. These diodes are designed to protect electronic equipment from electrostatic discharges (ESD) and are suitable for high-speed signal pins such as HDMI, DVI, USB2.0, and IEEE 1394.

SP3001 Series:

Description: Features ultra-low capacitance rail-to-rail diodes with an additional zener diode for high-level ESD protection.
Features: Low capacitance of 0.65pF per I/O, ESD protection up to ±8kV contact discharge and ±15kV air discharge, low leakage current of 0.5μA at 5V, and small SC70 package.
Applications: Suitable for computer peripherals, mobile phones, PDAs, digital cameras, network hardware, test equipment, and medical equipment.
Electrical Characteristics: Reverse standoff voltage of 6V, clamp voltage ranging from 9.5V to 13.0V, and diode capacitance between 0.35pF and 0.9pF depending on bias conditions.
Thermal Information: Operating temperature range from -40°C to 125°C, storage temperature range from -55°C to 150°C.

SP3002 Series:

Description: Similar to SP3001 but with slightly higher capacitance and ESD protection levels.
Features: Low capacitance of 0.85pF per I/O, ESD protection up to ±12kV contact discharge and ±15kV air discharge, and lightning protection up to 4.5A.
Applications: Same as SP3001, with additional packaging options for space-saving.
Electrical Characteristics: Reverse standoff voltage of 6V, clamp voltage similar to SP3001, and diode capacitance between 0.5pF and 1.25pF.
Thermal Information: Same as SP3001.

General Information:

Package Dimensions: Detailed dimensions for SC70-6, SOT23-6, and µDFN-6 packages are provided.
Soldering Parameters: Includes preheat and reflow conditions for Pb-free assembly with a peak temperature of 260°C.
Ordering Information: Part numbers and packaging options for both series are listed, with a minimum order quantity of 3000 units.

Overview: The document provides detailed technical specifications and guidelines for TVS Diode Arrays (SPA® Diodes) from Littelfuse, specifically focusing on the SP3003, SP3004, and SP3010 series. These components are designed for low capacitance ESD protection in electronic devices.

Specifications: The document outlines the package dimensions for various configurations such as SOT553, SOT563, µDFN-6L, and MSOP10, providing measurements in both millimeters and inches. It also includes recommended solder pad layouts and embossed carrier tape & reel specifications for these packages.

Key Features: The SP3004 series features ultra-low capacitance rail-to-rail diodes with additional zener diodes for high-level ESD protection. It offers ESD protection up to ±12kV contact discharge and ±15kV air discharge, with a low capacitance of 0.85pF per I/O. The SP3010 series provides similar protection with a lower capacitance of 0.45pF per I/O.

Applications: These diode arrays are suitable for protecting high-speed signal pins in devices such as HDMI, DVI, USB2.0, and IEEE 1394. They are used in various electronic equipment including computer peripherals, mobile phones, digital cameras, network hardware, and medical equipment.

Electrical Characteristics: The document details the electrical characteristics of the diodes, including reverse standoff voltage, reverse leakage current, clamp voltage, ESD withstand voltage, and diode capacitance. It also provides absolute maximum ratings and thermal information.

Ordering Information: The document includes a part numbering system and ordering information for different configurations, specifying package types, marking, and minimum order quantities.

Reflow Soldering Parameters: Guidelines for reflow soldering are provided, including preheat temperatures, ramp-up rates, peak temperatures, and time within peak temperature.

Disclaimer: A disclaimer notes that specifications are subject to change and advises users to evaluate the suitability of products for their applications.

Soldering Parameters: The ramp-down rate should not exceed 6°C/second, and the time from 25°C to peak temperature should be a maximum of 8 minutes. The peak temperature should not exceed 260°C.

Part Numbering and Marking System: The part numbering system for the SP3012 series includes the series, package type, and number of channels. For example, SP3012-03UTG indicates a 3-channel device in a µDFN-6 package. The marking system uses a code to indicate the product series and number of channels.

Product Characteristics: The lead plating is pre-plated frame for µDFN and matte tin for SOT23. The lead material is copper alloy, and the body material is molded epoxy with a flammability rating of UL 94 V-0.

Application Information: The SP3012 series is designed for high-speed data port protection, such as HDMI and USB 3.0, with low capacitance to minimize impedance mismatch. It is rated up to ±12kV contact discharge, exceeding IEC 61000-4-2 standards.

Package Dimensions: Detailed dimensions are provided for various package types, including µDFN-6, µDFN-10, µDFN-14, and SOT23-6, with specifications for soldering pad layouts and tape and reel packaging.

Ordering Information: The SP3012 series is available in different configurations, with a minimum order quantity of 3000 pieces per reel.

ESD Protection Features: The SP0524P series offers ultra-low capacitance ESD protection with a typical capacitance of 0.5pF per I/O, suitable for high-speed signal pins. It can withstand up to ±12kV contact and ±25kV air discharge.

Reflow Soldering Conditions: The reflow conditions for Pb-free assembly include a preheat temperature range of 150°C to 200°C, with a peak temperature of 260°C. The time within 5°C of the peak temperature should be 20-40 seconds.

Overview: The document provides technical specifications and details for the SP3021 and SP3030 series of TVS Diode Arrays, designed for low capacitance ESD protection. These components are used to protect electronic equipment from electrostatic discharges and other electrical transients.

Specifications: The SP3021 series features back-to-back TVS diodes with ESD protection of ±8kV contact discharge and ±15kV air discharge, low capacitance of 0.5pF, and low leakage current of 1μA at 5V. The SP3030 series offers enhanced ESD protection of ±20kV contact discharge and ±30kV air discharge, with a low capacitance of 0.5pF and leakage current of 0.1μA at 5V.

Applications: These diodes are suitable for high-speed data lines such as USB 3.0, HDMI, and eSATA, and are used in devices like smartphones, tablets, and game consoles.

Design and Layout: The document includes detailed dimensions and recommended soldering pad layouts for the µDFN-10 and SOD882 packages, ensuring proper integration into electronic circuits.

Thermal and Electrical Characteristics: The SP3021 series can handle peak currents of 2A, while the SP3030 series can handle up to 3A. Both series operate within a temperature range of -40 to 125°C.

Soldering Parameters: Guidelines for soldering include a peak temperature of 260°C and specific ramp-up and ramp-down rates to ensure component integrity during assembly.

Disclaimer: The document includes a disclaimer noting that Littelfuse products are not intended for life support applications and that specifications are subject to change.

Overview: The document provides technical specifications and application information for Littelfuse's TVS Diode Arrays, specifically the SP3031, SRV05, and SP4060 series. These components are designed for ESD and surge protection in various electronic devices.

SP3031 Series:

Features low capacitance ESD protection with a reverse leakage current of 1μA at 5V.
Suitable for USB 2.0, Ethernet, HDMI, and other high-speed interfaces.
Peak current handling of 5A and operating temperature range from -40°C to 125°C.
Comes in a small 0402 footprint, making it ideal for compact devices like smartphones and tablets.

SRV05 Series:

Integrates low capacitance diodes with a zener diode for enhanced ESD protection.
Handles up to 10A surge current and offers a low leakage current of 0.5μA at 5V.
Designed for applications in Ethernet, Firewire, and flat panel displays.
Features a small SOT23-6 package, suitable for space-constrained designs.

SP4060 Series:

Provides robust protection against ESD and high surge events, withstanding up to 20A surge current.
Low capacitance of 4.4pF per I/O, making it suitable for high-speed signal protection.
Applications include LCD/PD TVs, desktops, and game consoles.
Operates within a temperature range of -40°C to 125°C.

General Specifications:

All series are RoHS compliant and feature lead-free assembly.
Not intended for life support or life-saving applications.
Specifications are subject to change, and users should verify suitability for their applications.

Soldering and Packaging:

Reflow soldering parameters are provided, with a peak temperature not exceeding 260°C.
Products are available in tape and reel packaging for automated assembly processes.

Overview: This document provides technical specifications and details for TVS Diode Arrays, specifically the SP3304N and SLVU2.8 series, designed for lightning surge protection and ESD protection in electronic devices.

SP3304N Series:

Package and Marking: The SP3304N series uses a µDFN-10 package, with a part numbering system indicating series, package type, and environmental compliance (Green).
Product Characteristics: Features include copper alloy lead material, silicon substitute material, and molded epoxy body material with UL 94 V-0 flammability rating.
Dimensions: Detailed dimensions are provided for the µDFN-10 package, including specific measurements in millimeters and inches.

SLVU2.8 Series:

Description and Features: Designed to protect low voltage CMOS devices from ESD and lightning transients, the SLVU2.8 series can handle ±30kV ESD strikes and dissipate up to 40A with low clamping voltages.
Applications: Suitable for Ethernet, WAN/LAN equipment, desktops, servers, and more.
Electrical Characteristics: Includes parameters such as reverse standoff voltage, breakdown voltage, leakage current, and clamping voltage, with specific test conditions and ratings.
Package Dimensions: The SOT23-3 package dimensions are detailed, along with recommended solder pad layouts.

SLVU2.8-4 Series:

Description and Features: Similar to the SLVU2.8, this series offers protection with low capacitance and is suitable for high-speed data lines.
Electrical Characteristics: Similar ratings to the SLVU2.8 series, with additional details on dynamic resistance and diode capacitance.
Package Dimensions: The SOIC-8 package dimensions are provided, with a focus on mechanical drawings and solder pad outlines.

Soldering Parameters: Detailed reflow conditions for Pb-free assembly are provided, including preheat and peak temperature specifications.

Ordering Information: Part numbers, package types, and minimum order quantities are listed for each series.

Specifications:
The document outlines the specifications for the SR05 Series TVS Diode Arrays, designed for lightning surge protection. Key features include compliance with ESD (IEC61000-4-2) up to ±30kV, EFT (IEC61000-4-4) at 80A, and lightning protection (IEC61000-4-5) at 25A. The device has a low capacitance of 6.0pF per I/O, low clamp voltage, and is packaged in a small SOT143 (JEDEC TO-253) format with a moisture sensitivity level of MSL-1.

Applications:
The SR05 Series is suitable for T1/E1 IC/Secondary Protection, Ethernet 10BaseT, WAN/LAN Equipment, ISDN S/T Interface, Video Lines, and Microcontroller Input Protection.

Life Support Note:
The product is not intended for use in life support or life-saving applications unless expressly indicated.

Absolute Maximum Ratings:
Peak current (IPP) is 25.0A, peak pulse power (PPk) is 450W, operating temperature ranges from –40 to 125°C, and storage temperature ranges from –55 to 150°C.

Electrical Characteristics:
Reverse stand-off voltage (VRWM) is 5.0V, reverse leakage current (IR) is 5.0 µA, reverse breakdown voltage (VBR) is 6.0V, and clamping voltage varies with current (e.g., 9.8V at 1A).

Soldering Parameters:
Reflow conditions for Pb-free assembly include a preheat temperature range of 150°C to 200°C, a peak temperature of 260°C, and specific ramp-up and ramp-down rates.

Ordering Information:
The part number SR05-02CTG is available in SOT143 packaging with a minimum order quantity of 3000 units.

Product Characteristics:
Lead plating is matte tin, lead material is copper alloy, and the body material is molded epoxy with flammability rating UL 94 V-0.

Disclaimer:
The information is believed to be accurate and reliable, but users should independently evaluate the suitability of the product for their applications.

Catalog excerpts

Expertise Applied | Answers Delivered DIODE ARRAY Transient Voltage Suppression SPA® Diode

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TVS Diode Arrays (SPA® Diodes) Littelfuse* Expertise Applied | Answers Delivered TVS Diode Array Technology and Applications Overview Data Protocol, Application and Product Selection Port Protection Examples Definitions and Terms Transient Voltage Threats and Scenarios ESD Suppression Strategies and Standards Legal Disclaimers © 2017 Littelfuse, Inc. Specifications, descriptions and illustrative material in this literature are as accurate as known at the time of publication, but are subject to change without notice. Visit www.littelfuse.com for m

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TVS Diode Arrays (SPA® Diodes) Expertise Applied | Answers Delivered Littelfuse Silicon Protection Array family of TVS Diode Arrays (SPA® Diodes) are designed to protect analog and digital signal lines, such as USB and HDMI, from various transient threats using the lowest possible clamp voltage. They offer broader application use and improved impulse protection performance over conventional diodes. These robust devices safely absorb repetitive ESD strikes at the maximum level (Level 4) specified in the IEC 61000-4-2 international standard, without performance degradation. Key Features • Low capacitance...

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TVS Diode Arrays (SPA® Diodes) Littelfuse* Expertise Applied | Answers Delivered Data Protocol, Application and Product Selection For additional information including reference design examples, please visit www.littelfuse.com/SPA PRODUCT SERIES AND APPLICABLE DATA RATES AND PROTOCOLS Data Rate (Mbit/sec) 0 Data Protocols Typical Applications Serial Port (com) Keyboard Mouse DC Power Bus Keypad Buttons Parallel Port (LPT) Printer Scanner Coputer Input and Periperal Devices PDA / PMP / Cell Phone/ Digital Camera/ & Game Controller Ports Control System Network Hardware PCI Adapter Hub Router Webswitch...

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TVS Diode Arrays (SPA® Diodes) Port Protection Examples BROADBAND NETWORK PORT PROTECTION The following are examples of the implementation of ESD and lightning suppression for Ethernet ports (RJ-45 connectors). Note that the diagrams shown below represent 10Mbps and 100Mbps applications -- For 1Gbps applications, the circuit protection should be double of what is shown. For additional design examples, guidance and application assistance, please contact Littelfuse. Inter-Building - Robust Lightning Protection Intra-Building - Robust Lightning Protection The diagram show below is typical for outdoor...

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TVS Diode Arrays (SPA® Diodes) Littelfuse* Expertise Applied | Answers Delivered Port Protection Examples (continued)PERIPHERAL / STORAGE DATA PORT PROTECTION USB 1.1 The following are examples of ESD suppression for high speed data ports such as USB and eSATA. For additional design examples, guidance and application assistance, please contact Littelfuse. USB 2.0 Data speeds up to 12 Mbps Data speeds up to 480 Mbps Port Controller USB 3.0 Data speeds up to 5 Gbps * Package is shown as transparent SSTX+ SSTX-SSRX+ SSRX-Ground D+ D-Signal Ground Case Ground eSATA Data speeds up to 3 Gbps Signal...

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Llttelfuse* Expertise Applied | Answers Delivered TVS Diode Arrays (SPA® Diodes)Port Protection Examples (continued) ENTERTAINMENT ELECTRONICS PORT PROTECTION The following are examples of ESD suppression for ports common to entertainment electronics. For additional design examples, guidance and application assistance, please contact Littelfuse. Data speeds up to 3.4 Gbps per pair HDMI Chipset HDMI Port " Case * Package is shown as transparent Ground Video Port *— Case Ground " Signal" Ground Keypad / push button ESD protection For additional reference design examples, please view the product...

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TVS Diode Arrays (SPA® Diodes) Littelfuse* Expertise Applied | Answers Delivered Definitions and Terms Liability Definitions Operating Voltage Range (VSUPPLY; SP72x Series only) The range limits of the power supply voltage that may be across the V+ and V- terminals. The SCR/Diode arrays do not have a fixed breakover or operating voltage. These devices 'float' between the input and power supply rails and thus the same device can operate at any potential within its range. Forward Voltage Drop (SP72x Series only) The maximum forward voltage drop between an input pin and respective power supply pin...

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TVS Diode Arrays (SPA® Diodes) Expertise Applied | Answers Delivered Voltage Transients are defined as short duration surges of electrical energy and are the result of the sudden release of energy previously stored or induced by other means, such as heavy inductive loads or lightning. In electrical or electronic circuits, this energy can be released in a predictable manner via controlled switching actions, or randomly induced into a circuit from external sources. Repeatable transients are frequently caused by the operation of motors, generators, or the switching of reactive circuit components....

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Expertise Applied | Answers Delivered Transient Voltage Threats and Scenarios (continued)Electrostatic Discharge (ESD)Inductive Load Switching Electrostatic discharge is characterized by very fast rise times and very high peak voltages and currents. This energy is the result of an imbalance of positive and negative charges between objects. ESD that is generated by everyday activities can far surpass the vulnerability threshold of standard semiconductor technologies. Following are a few examples: The switching of inductive loads generates high energy transients which increase in magnitude with...

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TVS Diode Arrays (SPA® Diodes) Expertise Applied | Answers Delivered It is important to consider that most electronic equipment will spend 99% of its useful life in environments where it is subject to ESD. ESD can be generated from a wide range of everyday factors such as very dry air, static from plastics, or walking across a floor or carpet, and can be present during every phase of useful life from manufacturing, to product shipping, receiving, to field handling. Electrostatic Discharge (ESD) causes millions of dollars worth of damage to electrical components, rendering circuit boards non-functional,...

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TVS Diode Array (SPA) Catalog

TVS Diode Array (SPA) Catalog

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