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Power Semiconductor & IC
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Power Semiconductor & IC 2023 –2024 Selection Guide A comprehensive portfolio of power semiconductor and integrated circuit technologies in industry standard and innovative packages

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Table of Contents About this guide This selection guide offers a comprehensive look at the breadth and depth of the IXYS: A Littelfuse Technology power semiconductor and control IC portfolio. From milliwatt to gigawatt system solutions and everything in between, we’ve got the devices that meet your needs. Diode Modules – Single and Dual100 Thyristor / Diode Modules 103 Thyristor Modules – Single and Dual 106 Bridges with Fast Diodes111 Three Phase, with Brake Unit 117 Buck / Boost / Phase Leg38 Fast Recovery Diodes 143 Soft Recovery Diodes 145 Very High Voltage

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Nomenclature Capsule Devices - Excluding IGBT’s Press-Pack IGBT Capsule Devices Device Type Special Designator Device Type Build description for multiple square die 0240 Device pulse current rating Reverse conducting Asymmetric Reverse conducting (IGBT to diode ratio of 2:1) Electrode diameter Voltage grade - VRRM / 100 Rectifier diode Fast/soft recovery diode Extra fast diode HP Sonic-FRDTM Phase control thyristor Distributed gate thyristor Fast turn-off thyristor Medium voltage thyristor Asymmetric thyristor Symmetrical gate turn-off thyristor Fast symmetrical gate turn-off thyristor...

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Common anode/emitter/source 1 Phase Rectifier Bridge Half-controlled (high side) Common cathode/collector/drain Single Part + Multiple cathode pins + 1 Phase rectifier bridge Single Part High-side thyristor low-side diode Buck Chopper With series connected dice Boost/Brake Chopper + Freewheeling diode + Vce,sat-Diode Nomenclature • Valid only for products from IXYS/Littelfuse Lampertheim. • Usage for new technologies, chips, packages, and/or groups. • Newer data sheets contain description of part number. Brake Chopper (Rating IGBT >> Rating Diode) 3 Phase Rectifier Bridge + 3 Phase...

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Featured Packages PressFit-Pin for E2, E3, and SimBus F Module Packages IXYS presents new PressFit-Pin technology for E2 and E3 module packages. Modules equipped with these pins can be connected to the PCB without soldering. For the pressing process, either hand tools or pressing machines can be used. The benefits of the assembly are as follows: High Voltage TO-252 (D-Pak) Package Creepage (min): A Close Look at the PressFit-Pin Technology pin/pin: 3.6 mm pin/Cu back-side: 2.5 mm • Simplified process • Reduced mounting time • No risk of bad solder contacts • Reduced aging of pin contact...

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Featured Packages High Voltage TO-263 (D2-Pak) Package High Voltage TO-268 (D3-Pak) Package pin/pin: 4.2 mm pin/Cu back-side: 4.7 mm Part Number pin/pin: 9.4 mm pin/Cu back-side: 5.8 mm Part Number Standard Thyristor Fast Thyristor Part Number High Efficiency Config. IGBT & BiMOS™ Part Number XPTTM IGBT Fast XPT™ IGBT Copack Single High Voltage XPT™ IGBT High Voltage BiMOS™ High Voltage BiMOS™ VCES / VDSS X-Class HiPerFET™ Depletion Mode MOSFET High Voltage MOSFET Single Single High Voltage MOSFET High Voltage MOSFET Single Single High Voltage XPT™ IGBT High Voltage XPT™ IGBT High Voltage...

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Featured Packages High Voltage TO-268 (D3-Pak) Package Creepage (min): High Voltage TO-247HV and PLUS247HV Packages pin/pin: 9.4 mm pin/Cu back-side: 5.8 mm Part Number Part Number FRED HiPerFRED HiPerFRED Standard Diode Standard Diode High Efficiency Standard Thyristor High Voltage Thyristor Phase leg Triac Single Single Single Single Single MOSFET Part Number Schottky Diode HiPerFRED Common Cathode Phase Leg Common Cathode High Efficiency Standard Single Single High Efficiency

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Featured Packages ISO247 Package Isolated Discrete Packages Part Number XPT™ IGBT Fast Trench IGBT High Voltage MOSFET Part Number • Thermal resistance from junction to case only slightly higher than A larger version of this packaging technology is the ISOPLUSi4PACTM, which has up to five terminal pins, making it possible to create full diode bridges, phase-leg transistor configurations, buck and boost converters, and much more within one isolated discrete package. for non-isolated versions • Increased power and temperature cycling capability • DCB can be patterned like printed circuit...

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Featured Packages Features and Benefits • • • • • • • • Electrical isolation of 2500 V Low thermal resistance Increased power & temperature cycling Saves PCB mounting area Replaces multiple discretes Reduces parasitic inductance & capacitance Reduces EMI Improved heat spreading Part Number Circuit Diagram/Technology SMPD-B SMPD-B Fast Rectifier DPG 60B600LB HiPerFRED DCG 20B650LB SiC DHG 40B1200LB Sonic Trench2 Trench2 Trench2 HiPerFET™ Trench HiPerFET™ Trench2 HiPerFET™ Trench HiPerFET™ Trench HiPerFET™ Trench HiPerFET™ Polar3 HiPerFET™ Polar3 HiPerFET™ Q3 HiPerFET™ MOSFET1 CP & FRED X2...

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Featured Packages IGBTs Circuit Diagram/Technology Part Number XPT™ XPT™ & Sonic XPT™ & Sonic XPT™ IGBT Gen4™ XPT™ fast & Sonic XPT™ fast & Sonic Gen3 IGBT & Sonic SMPD-B SMPD-B SMPD-B SMPD-X SMPD-X SMPD-X XPT™ & Sonic XPT™ & Sonic XPT™ & Sonic XPT™ & Sonic XPT™ & Sonic XPT™ & Sonic Trench IGBT & Sonic & NTC Trench IGBT & Sonic Circuit Diagram/Technology Schottky Schottky Schottky SiC SMPD-B SMPD-B SMPD-B HiPerFRED SiC Rectifier Rectifier Rectifier Sonic Sonic Rectifier SMPD-B SMPD-B SMPD-B Part Number SMPD-Y Part Number Circuit Diagram/Technology MOS-Gated Thyristors Part Number Circuit...

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Featured Packages Potential Application Block Diagram Exmaple (for i4-PACTM) 3, 4, and 5 leaded packages for various circuit topologies and DCB base plate MTI...W..GC MTC...W..GC Surface Mount Device MTI...WX...GD MTC...X...TGD GMM... Surface Mount Device Replaces multiple discretes Reduces parasitic inductance and capacitance Reduces EMI Less weight Power Factor Correction Solutions offered by IXYS System implementation options Rectifier Forward Converter FBO 16-12N (line rectifier) FBO 40-12N (line rectifier) FBE 22-06N1 (HiPerFRED) Part Number Part Number Electrical isolation of 2500 V...

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