Power Semiconductor 2022-2023 Product Catalog A guide to selecting the right power semiconductor for your applications

IXYS: A Littelfuse Technology proudly presents world-class power semiconductor and IC technologies, quality, and customer support. About this guide This selection guide offers a comprehensive look at the breadth and depth of the IXYS: A Littelfuse Technology power semiconductor and control IC portfolio. From milliwatt to gigawatt system solutions and everything in between, we’ve got the devices that meet your needs. General Nomenclature Featured Packages PressFit-Pin High-voltage / ISO- Discrete TO-247-4L ISOPLUS-SMPD™ ISOPLUS-DIL™ / ISOPLUS i4-PAC™ IGBT Discretes XPT™ Very High Voltage Reverse...

Littelfuse: Everywhere, Every Day Founded in 1927, Littelfuse has become the world’s most respected circuit protection brand, with well-established and growing platforms in power control and sensing technologies. Today, we are a global company offering a diverse and extensive product portfolio—fuses, semiconductors, polymers, ceramics, relays, sensors, and more—serving the electronics, automotive, and industrial markets. We manufacture them to exacting quality standards with an unwavering commitment to technical support and customer service. Our history of innovation, combined with our customer-first...

Nomenclature Capsule Devices - Excluding IGBT‘s W 0646 W C 15 0 Device Type W Rectifier diode M Fast/soft recovery diode F Extra fast diode E HP Sonic-FRD™ N Phase control thyristor R Distributed gate thyristor P Fast turn-off thyristor K Medium voltage thyristor A Asymmetric thyristor S Symmetrical gate turn-off thyristor H Fast symmetrical gate turn-off thyristor G Asymmetric gate turn-off thyristor Y Pulse Thyristor Special Designator 0 tq code (thyristors), VRRM % of VDRM for Gate turn-off thyristors - See relevant tables P PIN diode (Product groups: W, M, F, E) R Rotating package (N, K,...

Press-Pack IGBT Capsule Devices T 0240 N B 45 E Device type T Press-pack IGBT Build description for multiple square die A Reverse conducting E Asymmetric G Reverse Conductiing (IGBT to diode ratio of 2:1) 0240 Device pulse current rating Voltage grade - VRRM /100 Stud Devices W 0508 S A 04 0 Device type Rectifier diode W Fast/Soft recovery diode M 3/4” stud glass/metal M Phase control thyristor N Fast turn-off thyristor P Symmetrical Gate turn-off thyristor S Package A 3/4” stud glass/metal C 3/4” stud ceramic E 3/4” HV ceramic stud with lug F 3/4” HV ceramic stud H 1/2“ ceramic stud J 1/2” ceramic...

Valid only for products from IXYS / Littelfuse Lampertheim. Usage for new technologies, chips, packages and/or groups. Newer data sheets contain description of part number. Precisely defined package Basic package as Inde × 1-3; usage e.g. for special chips like SiC Voltage rating Precisely defined circuit Basic circuit Current rating Chip generation resp. precisely defined technology Chip technology Kind of main chip C = SCR, D = Diode, I = IGBT, M = MosFET M = Module; no letter for discretes Extras: e.g. delivery formats, auxiliaries Examples for Indexes Index 1 & 2 High Voltage Thyristor Sonic...

Common anode/ emitter/ source 1 Phase Rectifier Bridge , half-controlled (high side) Common cathode/ collector/ drain Single Part + multiple cathode pins + 1 Phase Rectifier Bridge Single Part , high-side Thyristor / low-side Diode Buck Chopper with series connected dice Boost/Brake Chopper + free wheeling diode + Vcesat-Diode Brake Chopper (Rating IGBT >> Rating Diode) + free wheeling diode 3 Phase Rectifier Bridge + 3 Phase Rectifier Bridge & Brake Unit Parallel legs Half 3 Phase Bridge , Common anode No Metal Inserts Phase Change Material PressFit-Pin + Shunt + Thermistor Tape & Reel Left...

Featured Packages PressFit-Pin for E2, E3, and SimBus F Module Packages IXYS presents a new PressFit-Pin for E2 and E3 module packages. Modules equipped with these pins can be connected to the PCB without soldering. For the pressing process, either hand tools or pressing machines can be used. Benefits of the assembly are Close look at the PressFit-Pin Technology • simplified process • reduced mounting time • no risk of bad solder contacts • reduced aging of pin contact • no thermal stress for the PCB assembly • press out possible for maintenance The pin concept is based on the proven “Bizon“-pin...

High Voltage TO-252 (D - Pak) Package Creepage (min): pin/pin: 3.6 mm pin/Cu back-side: 2.5 mm Part Number Config. Diode Standard Diode Fast Recovery Diode Single Phase Leg Sonic Diode Single MOSFET Standard MOSFET High Voltage TO-263 (D2 - Pak) Package Creepage (min): pin/pin: 4.2 mm pin/Cu back-side: 4.7 mm Part Number Config. Diode Single Standard Diode Phase Leg Avalanche Diode FRED / HiPerFRED DSEI 12-12AZ DSEP 12-12AZ DSEP 12-12BZ FRED HiPerFRED 650 Schottky Barrier Diode

Featured Packages High Voltage TO-263 (D2-Pak) Package Creepage (min): pin/pin: 4.2 mm pin/Cu back-side: 4.7 mm Part Number Standard Thyristor Fast Thyristor High Efficiency High Efficiency Triode (Reverse Conducting Thyristor) Part Number IGBT & BiMOS™ IXA 4IF1200PZ IXA 20I1200PZ IXYA 20N120C3HV IXYA 20N120A4HV IXYA 20N120B4HV IXYA 20N120C4HV IXYA 30N120A4HV IXYA 8N250CHV IXYA 12N250CHV IXGA 20N250HV IXBA 16N170AHV IXBA 10N300HV IXBA 14N300HV Part Number Fast XPT™ IGBT Copack Single Single High Voltage XPT™ IGBT High Voltage NPT IGBT High Voltage BiMOS™ XPT™ IGBT IXFA 8N85XHV IXFA 14N85XHV IXFA...

High Voltage TO-268 (D3-Pak) Package Creepage (min): pin/pin: 9.4 mm pin/Cu back-side: 5.8 mm Part Number VCES / VDSS IXYT 30N65C3H1HV IXYT 20N120C3D1HV IXYT 40N120A4HV IXYT 55N120A4HV IXYT 85N120A4HV IXYT 12N250CV1HV IXYT 25N250CHV IXYT 30N450HV IXGT 25N250HV IXBT 16N170AHV IXBT 22N300HV IXBT 32N300HV IXBT 42N300HV IXBT 16N360HV IXBT 20N360HV High Voltage XPT™ IGBT High Voltage NPT IGBT High Voltage BiMOS™ IXTT 140N075L2HV IXTT 44N25L2HV IXTT 440N04T4HV IXFT 26N100XHV IXFT 32N100XHV IXTT 34N65X2HV IXFT 60N65X2HV IXFT 80N65X2HV IXFT 30N85XHV IXFT 40N85XHV IXFT 50N85XHV IXFT 140N20X3HV IXFT 180N20X3HV...