µModule® Power Product Family
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Catalog excerpts

µModule®  Power Product Family - 1

µModule Power Product Family ® Magnetics Thermally Enhanced BGA or LGA Package Capacitors & Resistors Power Switches & DC/DC Controller Compensation Circuitry Diodes new BARRIER +VIN EMI –VOUT 9 × 15 9 × 11.25 .25 6.25 × 11 EN55022 Class B • VOUT VIN • • • • 9 × 15 11.25 × 15 Inverting 11.25 × 15 15 i i VIN VOUT 15 × 15 µM Powe odule r Pr 15 × oducts Isolated Page 2 Current Limit Current Limit • • LED Driver Page 3 • Battery Charger Step-Up & Down VOUT Step-Down Packages (mm) • 9 × 11.25 • • • • • • • • 6.25 × 6.25 × 6.25 5 6.2 Up to 1.5V • • • 6.25 × 11.25 60VIN • • • VIN 125°C 5.5V Sync –55°C Up to 60VIN Page 4 Low VIN Automotive Grade Page 5 6 3 2 6 Outputs 3 Outputs 2 Outputs Wide Temp N IOUT 1 Parallelable Output Page 6 Page 7 Synchronizable VOUT2 I ×R DROP VOUT1 t Precision Remote Sense Voltage Margining Output Sequencing Page 8-9 new BGA Package Page 9 Pin Compatible Page 10 Reliability Environmental Compliance L, LT, LTC, LTM, Linear Technology, the Linear logo, µModule and LTspice are registered trademarks and LTpowerCAD is a trademark of Linear Technology Corporation. All other trademarks are the property of their respective owners. Design Support Pages 10-12 PCB Assembly Page 12 TechClips µModule Power Products www.linear.com/micromodule

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µModule®  Power Product Family - 5

I ×R Input Voltage (V) Output Voltage (V) Input Voltage (V) VOUT2 Max* 20 28 26.5 0.6 0.6 0.6 3.3 3.3 3.3 6 6 Dual 8 ±1.5% ±1.5% ±1.5% 20 0.6 3.3 12 ±1.5% 4.5 20 0.6 3.3 12 ±1.5% 28 0.6 3.3 12 ±1.5% 4.5 28 0.6 3.3 12 ±1.5% 1.5 5.5 0.8 3.7 15 ± 2.0% 4.5 20 0.6 3.3 15 Package Dimensions (mm) Package Part Number ±1.5% LGA LGA LGA LGA BGA LGA BGA LGA BGA LGA BGA LGA LGA BGA Max Min Max Output Current (A) 2.375 5 4.5 4.5 4.5 4.5 2.7 5 5.5 36 20 26.5 28 28 5.5 36 0.8 3.3 0.6 0.8 0.6 0.6 0.6 3.3 5 15 5 5 5 5 5 15 4 5 6 6 6 6 8 8 4.5 20 0.6 5 12 LTM4611 4.5 20 0.6 5 12 LTM4627 4.5 20 0.6 5 12 4.5...

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µModule®  Power Product Family - 6

Design Support 1 After J-STD-020 Level 3 preconditioning To download the full reliability reports, visit http://www.linear.com/umodule ^Module power products in BGA packages with SAC305 solder balls and LGA packages are halogen-free and RoHS compliant. The Materials Declaration file for all released products is Scan to access these Design Support Design and Application Notes Thermal Performance ■ AN110 LTM4601 DC/DC uModule Regulator Thermal Performance ■ AN119B Powering Complex FPGA-Based Systems—Thermal Performance Electrical Performance ■ AN119A Powering Complex FPGA-Based...

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µModule®  Power Product Family - 7

Design Support Demonstration Circuits Demonstration circuits along with associated bill of materials (BOM) and gerber files are Scan to obtain or visit For detailed assembly and rework recommendations, the following documents are available for ■ Assembly Considerations for Linear Technology uModule LGA Packages ■ Assembly Considerations for Linear Technology uModule BGA Packages ■ uModule LGA Packaging Care and Assembly Instructions View technical videos covering key topics on uModule Power Products. Output Ripple Thermal Performance uModule Power Products

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