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Tantalum Sputtering Targets

Product catalog summary

Overview
Linde Advanced Material Technologies is a leading global supplier of high-performance Tantalum PVD sputtering targets, primarily used in the semiconductor industry for applications in automotive, communication (5G), cell phones, and cloud computing. The company offers customized microstructure and texture for optimal deposition rates and uniformity in tantalum thin films.

Key Features and Specifications

Purity up to 99.999% with impurity control at ppb levels.
Grain size approximately 60 µm.
Form factor up to 450mm in diameter.
Over 15 years of in-service history with tight control over texture and grain size.

Product Offerings

Ta 2.0: High volume production since 2018, with a purity of 4N5+ and grain size of 55 ± 10μm.
T1A Ta: New product offering with a purity of 4N5+ and grain size of 70 ± 10μm, featuring an independent supply chain.
Advantage Ta: High volume production for over 15 years, with a purity of 4N5 and grain size of 55 ± 10μm.
Ta Development: Products in development for 3nm applications and beyond, offering metallurgical solutions for specific customer needs.

Applications and Benefits

Used in 300mm Logic/MEM applications for <10nm and <14nm technologies.
Benefits include reduced in-film particle generation, increased sputter life, improved uniformity of Rs, and consistent sputter performance.

Global Presence and Contact Information
Linde provides worldwide service with manufacturing locations in the USA, Europe, and Asia. For more information or to request specific products, contact their technical sales team at [email protected] or visit their website at www.linde-amt.com.

Catalog excerpts

Making our world more productive Linde Advanced Materials Technologies Tantalum Sputtering Targets

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Tantalum Sputtering Targets Linde Advanced Material Technologies is a leading global supplier of high-performance Tantalum PVD (Physical Vapor Deposition) sputtering targets. Our Tantalum Sputtering Targets are used for Barrier and Through-Silicon-Via (TSV) thin film deposition applications, mainly in the semiconductor industry for consumer applications in Automotive, Communication (5G), Cell Phones & Cloud Computing. The microstructure and texture of our Tantalum targets are customized for optimum deposition rate, low in-wafer adders, and low non-uniformity in thickness & sheet resistance (Rs)...

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Tantalum Sputtering Targets Product Offering Application Purity Grain Size (µm) Benefits Materials Properties Ta 2.0 300 mm Logic/MEM <10nm 4N8 55 ± 10 Medium cost, high purity product designed to match Advantage Ta High demand, limited supply Processing (TMP, bonding, machining) T1A 300 mm Logic/MEM <14nm 4N8 70 ± 10 High purity product with tight grain control for demanding applications Still early in customer acceptance Korea Advantage Ta 300 mm Logic/MEM <10nm 4N5, high O2, Mg 55 ± 10 Fine texture control for uniform deposition and film performance Unique supply chain Early development challenging...

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Worldwide Service Orangeburg, US | Toulouse, France | Mercus, France | Cheonan, Korea At Linde Advanced Material Technologies Electronics, we’re committed to being your global partner in sputtering targets with timely solutions and dependable results. With strategic manufacturing facilities based in America, Europe, and Asia, we can deliver tailored support and quick access to our services worldwide. No matter where your business is based, our dependable global distribution network, in conjunction with our convenient manufacturing locations, ensures our products meet precise quality standards,...

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All Linde Advanced Material Technologies catalogs and technical brochures

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