Tantalum Sputtering Targets
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Making our world more productive Linde Advanced Materials Technologies Tantalum Sputtering Targets

Tantalum Sputtering Targets Linde Advanced Material Technologies is a leading global supplier of high-performance Tantalum PVD (Physical Vapor Deposition) sputtering targets. Our Tantalum Sputtering Targets are used for Barrier and Through-Silicon-Via (TSV) thin film deposition applications, mainly in the semiconductor industry for consumer applications in Automotive, Communication (5G), Cell Phones & Cloud Computing. The microstructure and texture of our Tantalum targets are customized for optimum deposition rate, low in-wafer adders, and low non-uniformity in thickness & sheet resistance...

Tantalum Sputtering Targets Product Offering Application Purity Grain Size (µm) Benefits Materials Properties Ta 2.0 300 mm Logic/MEM <10nm 4N8 55 ± 10 Medium cost, high purity product designed to match Advantage Ta High demand, limited supply Processing (TMP, bonding, machining) T1A 300 mm Logic/MEM <14nm 4N8 70 ± 10 High purity product with tight grain control for demanding applications Still early in customer acceptance Korea Advantage Ta 300 mm Logic/MEM <10nm 4N5, high O2, Mg 55 ± 10 Fine texture control for uniform deposition and film performance Unique supply chain Early development...

Worldwide Service Orangeburg, US | Toulouse, France | Mercus, France | Cheonan, Korea At Linde Advanced Material Technologies Electronics, we’re committed to being your global partner in sputtering targets with timely solutions and dependable results. With strategic manufacturing facilities based in America, Europe, and Asia, we can deliver tailored support and quick access to our services worldwide. No matter where your business is based, our dependable global distribution network, in conjunction with our convenient manufacturing locations, ensures our products meet precise quality...