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YX-Z2 x-ray orientation instrument automatic type

YX-Z2 x-ray orientation instrument automatic type
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YX-Z2 x-ray orientation instrument automatic type - 1

iSi+$!JitW5t, m, fcHf£-f**SSmi§, (EfeUt*, £¥il#. »%£*> ¥##*») W k *fflPLcffi*ijft*, &ps»hk, ittim 5> j*£SP*E«#, iSM££> *§£, QAiMSttlA. 6> mmmmmimm, usBft&tttb&n, «r$#&$ExcE L«aaa*«#iiMra. 7\ iie«#, m&* tm. Functions: X-ray automatic orientation instrument is a kind of accurate device which deigned integrates light, mechanical, electrical into one body according to X-ray diffraction principle, it can fast measure crystal directio n of natural and artificial crystal(including piezoelectric, optic, laser, semiconductor), it can also use with cutter, grinder and other equipments. YX series X-ray orientation instrument is necessary device for precision proce ss and manufacture crystal component, it can be used for orientation of all kinds of crystal and is broadly use d in crystal material processing industry. Features: 1. PLC control technology is used, it is highly automated with low failure rate and high anti-inference capabilit y and good system stability. 2. All Chinese human-computer interface, 7-inch TFT touch panel, direct interface and easy for operation. 3. Automatic measurement by touch screen or foot switch. 4. It is accurate and convenient by automatic calibration, automatic scanning can be done for 10 times to get average value. 5. Meet different customers' requirements. Single-point,two-point and four-point measurement mode can be set. 6. It has measurement data printing function with USB data output interface.The data can be converted to Excel form and saved for management through the computer. 7. The Modularized circuit design for easy maintenance and repair. 8. Automatic shutter control. The shutter is turned on only when necessary to provide operator with maximum protection. 9. Customize all kinds of work tables and sample fixtures according to different samples to ensure measure ment accuracy and convenience of use. 10. Automatic measurement of wafer and ingot can be done. It is applied to angle test during every process ing step to increase conformity rate of the prod

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