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YX-16F x-ray orientation instrument for ingot recheck after sticking

YX-16F x-ray orientation instrument for ingot recheck after sticking
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YX-16F x-ray orientation instrument for ingot recheck after sticking - 1

■ sit: »svx-i6sisitt»«±sifii, asmsg^i+sx«sY$swiM^tt, ammi, ^mthn&miJRT, mm&m, rntm-. ffiie, wmm, Siam Ifffcffi: 30KVP, If 0---5mA, iS^nJiS Functions: This is researched for professional inspect splice precision of each section crystal bar. Will orientation and spliced crystal bar on YX-16 instrument, and the flitch will be put on YX-16F recheck device, lean bottom of flitch on slope of angular instrument to inspect the adhesive error. Calculate X axis&Y axis error automatically by calculating software. And compare with the stand ard values. If different, please remove the crystal bar from flitch, adhesive it again, to make sure the splice accuracy before cut crystal bar. Its advantage is N sections crystal bar on one flitch all can be inspected. Technical targets: X-ray tube: copper target with anode grounding, force air cooling Tube voltage: 30KVP, switch closed under full voltage Tube current: 0—5mA, continuous adjustable. Input power: Not over 0.3KW Orientation accuracy: ±30" Worm gear running error: Not over 30" Counter rotation angle: -10°------+100° Sample rotation angle: -10°------+50° Counter tube: Geiger tube, voltage of 600—1100V Time constant: 0.1, 0.4, 3second; 3levels adjustable Protection: FHigh voltage interlock protection, temperature protection slit: 4', 5', 6' Outer dimension: 1200mmx650mmx1100mm Equipment weight: 250KG Sample diameter: Silicon single crystal <D2—<D8inch silicon wafer; Measured crystal bar length: Silicon single crystal (t>3—8inch: 500m

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