Overview

The document provides technical specifications and features of the TASK(L) Series embedded system, designed for applications such as automation, surveillance, POS, kiosks, digital signage, and networking.

Main Specifications

• Motherboard (M/B): Model 3I170NX with Intel Skylake-S / Kaby Lake-S processors including i3, i5, i7, and Celeron CPUs.
• Dimensions: 77 mm (Height) x 210 mm (Width) x 200 mm (Depth).
• Material & Color: Aluminum chassis in black color.
• Weight: Approximately 3 kg including motherboard.
• Mounting: Optional VESA mounting support (75 x 75 mm).

Hardware Features

• Video Input: DIO Video-in supporting 3G/4G Wi-Fi.
• Storage: Supports mSATA and 2.5" SSD storage options.
• Connectivity: Includes VGA, COM ports, LAN (1 x GbE), USB ports (4 x PoE+), HDMI, audio line-out, and mic-in.
• Thermal Performance: Fanless design with excellent heat dissipation, operating temperature up to 70°C (CPU) and 50°C (other components).

Additional Notes

The system is described as powerful and fanless, emphasizing reliability and thermal management. The document suggests contacting the manufacturer for more detailed motherboard specifications and available functions.

Summary

This embedded system is tailored for industrial and commercial applications requiring robust performance, multiple I/O options, and flexible storage, all within a compact, durable, and thermally efficient design.