LEICA EM TXP Target surfacing system

LEICA EM TXP – TARGET SURFACING SYSTEM The Leica EM TXP is a unique tar- easy. Before the Leica EM TXP, get preparation device especially sawing, milling, grinding and pol- developed for cutting and polishing ishing exactly to the target was samples prior to examination by often a very time-consuming and difficult procedure as points of excels with challenging specimens interest were easily missed and where pinpointing and preparing specimens often difficult to han- barely visible targets becomes dle due to their small size. With the Leica EM TXP such samples can easily be prepared. Furthermore,...

INTEGRATED VIEWING SYSTEM Stereomicroscopic target observation during the working process With the specimen pivot arm the sample can be observed during preparation at an angle between 0° and 60°, directly onto the front face, or 90° to the front face for distance determination with an eyepiece graticule. The Leica EM TXP features brilliant ring LED top light and optimized backlight illumination for excellent viewing. Viewing with full ring illumination >> Accurate location and preparation of microtargets >> In-situ observation with a stereomicroscope >> Multifunctional machine processing >> Automatic...

PROCESS POSSIBILITIES Once the sample is clamped into the specimen holder and inserted in the pivot arm, the specimen can be: >> milled >> sawn >> drilled >> ground >> and polished without removing the sample from the Leica EM TXP and simply changing the tools while observing the process directly through the stereomicroscope. The tool and sample are enclosed within a protective chamber with a transparent cover for safety. This prevents access to moving parts and avoids particulate matter escaping. During milling a low-noise extraction and filtration unit with a Hepa filter (optional) provides...

INTEGRATED AUTOMATIC PROCESS CONTROL Let the Leica EM TXP do the job The Leica EM TXP automatic process control mechanism saves you from time-consuming routine sample preparation: >> with the automatic E-W guiding mechanism >> with the force-regulated feed control >> with the distance or time countdown function >> with force-controlled auto-advance for core-drilling Peristaltic cooling system and level sensor for the integrated lubricant cooling system E-W guiding mechanism (manual or automatic) – Pivot arm lever – Hand wheel for manual feed in steps of 0.5, 1, 10 and 100 μm – Control panel for...

Target preparation on surfaced sample for incident light LM and SEM All processing steps are carried out consecutively on the Leica EM TXP without removing the sample for pinpointing the area of interest via another microscope or for making any adjustments. Preparing specimens observed during operation with the integrated stereomicroscope avoids the time consuming interruption of locating the target with a stand alone microscope and then re-aligning the sample in the polishing instrument. Sample thinning for transmitted light LM or prior to ion thinning for TEM Specimen thinning with the Leica...

Observation via stereo microscope of the Leica EM TXP The surface of the stub is milled with the tungsten carbide miller so it is parallel to the grinding and the polishing plane for processing the second side of the sample. The prepared first side is fixed onto the surface of the stub. The second side is then cut, ground and polished. The thickness of the sample can be determined with the advance counter display. In such a manner, ly prepared for TE Within a few minutes all sample details are aligned. LM-image of gold wire bondings processed with the cut-off wheel and ground with 6 pm diamond...

Gold-wire bonding of IC-package prepared with the Leica EM TXP (LM image). Same gold wire bonding subsequently processed for half an hour with the Leica EM RES102 (SEM image). Left: Leica EM RES102 for ion beam processing of TEM and SEM samples even hard and brittle materials can be thinned to be subsequentEM investigation e.g. for ion thinning with the Leica EM RES102. gs of IC-package during processing with the Leica EM TIC 3X. ove the gold wires has already been polished by the ion beam. High surface quality within a few hours. The user interaction time of the complete process is around 20...

qualityaustria SYSTEM CERTIFIED ISO 9001:2008 No.00805/0IS014001:2004 No.02783/0 Leica Mikrosysteme GmbH | Vienna, Austria T +43 1 486 8050-0 | F +43 1 486 8050-30 www.leica-microsystems.com Leica EM TXP Brochure •English - 09/2015 • Copyright © by Leica Mikrosysteme GmbH, Vienna, Austria, 2015. Subject to modifications. LEICA and the Leica Logo are registered trademarks of Leica Microsystems IR GmbH.