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Leica EM TIC 3X

Leica EM TIC 3X
16Pages

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Leica EM TIC 3X Efficiency and flexibility

LEICA EM TIC 3X TRIPLE ION-BEAM MILLING SYSTEM Would you like to prepare surfaces of hard, soft, porous, heat-sensitive, brittle and /or heterogeneous materials for microstructure analysis in scanning electron microscopy (SEM) and investigations in the Atomic Force Microscope (AFM)? The unique broad ion beam milling system of the Leica EM TIC 3X is the system of choice for EDS, WDS, Auger and EBSD, because ion beam milling is often found to be the only method capable of achieving high quality cross-sections and planed surfaces of almost any material. The process reveals the internal...

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FLEXIBLE SETUP EXCELLENT QUALITY RESULTS HIGH THROUGHPUT

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LEICA EM TIC 3X – INNOVATIVE FEATURES IN DESIGN … >> Cuts high-quality cross-sections with large areas of 4 > 1 mm >> Multiple sample stage capable of processing several samples in one run >> Samples up to a size of 50 x 50 x 10 mm or up to 38 mm diameter can be inserted for processing >> Easy and accurate sample mounting and alignment >> Simple operation via touch-screen, no special skills necessary >> Process monitoring via stereomicroscope or HD-TV camera >> Four segement controlled LED illumination for optimal specimen viewing and alignment >> Integrated, decoupled roughing pump...

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… AND OPERATION Ergonomic and Easy to Use The stereo microscope of the Leica EM TIC 3X is not only used for aligning and process observation. A work-plate attached beneath the microscope can be used for handling the sample or attaching the sample to its holder. Thus, no additional observation system is needed for manipulating small samples. The outstanding performance of the integrated touch screen controller is not only reflected in its intuitive operation but hints and helpful information are also displayed to allow the most effective use of the instrument. A USB stick can be attached to...

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FLEXIBILITY: CONFIGURE YOUR SYSTEM Our customers seek faster and simpler methods of sample preparation without having to forgo quality. The innovative technology of the Leica EM TIC 3X triple ion beam milling system offers solutions to help laboratories with high expectations achieve their goals. Depending on the preparation needs, the Leica EM TIC 3X can be configured for applications of standard preparation, high throughput processing, and the preparation of extremely heat sensitive samples such as polymers, rubbers or even biological material at low temperatures. Samples can be...

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Cooling stage provides very low temperature processing. With temperatures of the sample holder and mask down to –160 °C, extremely heat-sensitive samples such as rubber, water-soluble polymer fibers or even marsh allows (if desired) can m be processed to a high quality. The 25 liter dewar provides at least enough LN2 for a full working day without refilling. Warming up of the sample is automatically carried out at the selected temperature under low vacuum, thus avoiding moisture contamination. Using the Vacuum Cryo Transfer docking configuration the sample can be transferred from the Leica...

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TRIPPLE ION BEAM TECHNIQUES Cross sectioning arrangements Flat Milling The three ion beams intersect at the center edge of the mask, forming a milling sector of 100° cutting the exposed sample (~ 20 to 100 µm above the mask) until the area of interest is reached. The design of the ion gun develops a milling rate of 300 µm/hour (Si 10 kV, 3.5 mA, 100 µm from edge) which is one of the highest values, considering the removed volume of the material. This unique technique produces a vast crosssectioning area of > 4 × 1 mm at a very high material removal rate with a high quality finish of...

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CONTRAST ENHANCEMENT In addition to cross-sectioning, the same holder can be used for cleaning and contrast enhancement to provide clear visualization of the surface topography (e.g. grain boundaries). Contrast enhancement holder of the standard stage 1) sample in cross sectioning position 2) contrast enhancement at low kV for few minutes Copper sample Left: after ion beam cross sectioning; middle: after additional contrast enhancement step; right: enlarged view Gold-wire bond Left: after ion beam cross sectioning; right: after additional contrast enhancement step

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CREATE SYNERGIES FOR WORKFLOWS Prior to use of the Leica EM TIC 3X, mechanical preparation is often required to get as close as possible to the area of interest. The Leica EM TXP is a unique target surfacing system developed for cutting and polishing samples prior to follow-on techniques with instruments such as the Leica EM TIC 3X. The Leica EM TXP is specially designed to pre-prepare samples by sawing, milling, grinding, and polishing. It excels with challenging specimens where pinpointing and preparing difficult targets becomes easy. Polyester coating on galvanised steel, cross sectioned...

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ADVANTAGES Using a dedicated sample holder, the sample can be left in situ on the holder from mechanical pre-preparation with Leica EM TXP through ion beam milling with the Leica EM TIC 3X to SEM examination. In addition, the Leica EM TXP can be used to pre-prepare environmentally sensitive samples (e.g. placed in a glovebox). These pre-prepared samples can be subsequently transferred with the Leica EM VCT shuttle to the ion beam milling system Leica EM TIC 3X with VCT port without changing the sample holder. After ion beam surfacing, the sample can be subsequently transferred to the...

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PREPARATION WORKFLOW UNDER CRYOGENIC CONDITIONS Sample Holders Several sample holders are available to fit vitrified samples prepared by high pressure freezing systems or bulky frozen samples, using plunge- or slush freezing techniques. Pre-Preparation The ion beam process follows the rules of the cross sectioning techniques in which the protruded portion a roughly pre-prepared sample is bombarded by high energy ion beams. In order to fulfill the prepreparation needs the distance of max. 100 µm is achieved by using the VCT loading station with the cryo-saw attachment. Transfer The seamless...

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Leica EM TIC 3X 16Pages

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Leica EM TIC 3X
16Pages