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LS-Lab datasheet 2024

LS-Lab datasheet 2024

LS-Lab datasheet 2024

Product catalog summary
Overview: The document introduces the LS-Lab, a compact and flexible micromachining setup developed by LASEA. It emphasizes the system's precision and adaptability for high-end laser processes.
Specifications: The LS-Lab is available in three configurations: LS-Lab Access, LS-Lab Flex, and LS-Lab Max, each with varying dimensions and motorized axis capabilities. The standard laser type is a femtosecond laser ranging from 5 to 100 W, with wavelengths of 515/1030 nm or 343 nm. Key modules include LS-Shape, LS-View, and LS-Scan, and the system operates with Kyla basic software.
Features: The LS-Lab stations are designed for a variety of applications such as cutting, drilling, texturing, marking, engraving, thin-film removal, and 2-photon polymerization. The modular design allows for customization and upgrading based on specific needs.
Options: Additional options include spot size adjustment, polarization control, 0° taper, optical Z axis, synchronized motion in 1D or 2D, and a fume extractor.
Highlights: The LS-Lab's modular and upgradeable nature, combined with LASEA's beam management modules, provides a high-precision setup for developing laser micro-processing processes. The stations are pre-assembled and aligned with the chosen optical configuration, ensuring optimal performance.
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Catalog excerpts

LS-Lab datasheet 2024-1

LASEA. MAKING THE SMALLEST BIG DIFFERENCE LASEA - LS-Lab LS-Lab The right setup for micromachining process development. Like a high-end micromachining machine, this compact lab set-up, combined with LASEA’s beam management modules, allows high-precision laser processes Flexibility Simplicity Precision Discover the potential of the LS-Lab on lasea.eu/applications www.lasea.com / [email protected] Version 1.0 THIN FILM REMOVAL

 Open the catalog to page 1
LS-Lab datasheet 2024-2

LASEA. MAKING THE SMALLEST BIG DIFFERENCE LASEA - LS-Lab LS-Lab HIGHLIGHTS The 3 available LS-Lab micromachining stations, combined with the LASEA beam management modules,enable high precision laser micro-processing processes. This modular and upgradeable concept of machining stations and optical modules makes it possible to bettercompose your equipment according to your needs. Designed to provide access to cutting, drilling, texturing, marking, engraving, thin-film removal and 2-photon polymerization applications, these stations are pre-assembled and aligned with the chosen optical configuration....

 Open the catalog to page 2

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