PHENOFREE METALLOGRAPHIC HOT EMBEDDING RESIN
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LAM PLAN S.A. 7 rue des Jardins BP 15 74240 GAILLARD France Tel. +33 4 50 43 96 30 Fax +33 4 50 87 01 60 www.lamplan.com email : mmsystem@lamplan.fr HOT EMBEDDING RESIN Thermosetting resin without phenol and without formaldehyde. Ref. 06 PF010 20 PRODUCT DATA SHEET LAM PLAN’s new polyvalent and economic hot resin for everyday inspection of your metallographic samples. For many years now, LAM PLAN’s R&D department has been committed to developing avant-gardist products which are more respectful of the health of users and which preserve the environment without compromising efficiency. With the new PHENOFREE resin, LAM PLAN aheres firmly to this approach, offering the market the first efficient alternative to phenolic, metallographic embedding resins or resins likely to generate phenol (and/or formaldehyde) during the curing process. LAM PLAN has chosen to place at your disposal a resin which contains no trace of these substances, in order to remove them totally from your working environment. LAM PLAN’s hot resin PHENOFREE represents an excellent alternative to classical, phenolic resins in terms of quality and security. NON CONTRACTUAL DOCUMENT RESINE PHENOFREE ANG / 07-2010 PHENOFREE REFERENCES Type Colour Packaging References PHENOFREE Light grey 2,5 kg powder pot 06 PF010 20 10 kg bucket 06 PF010 10 APPLICATION: LAM PLAN’s hot resin PHENOFREE is destined for use in the technical embedding of all types of materials for material inspections and edge examinations. It advantageously replaces the traditional phenolic resins, its field of application being identical. DESCRIPTION: - Hot resin, single component, - colour: light grey - hardness: equivalent to phenolic resins - shrinkage: equivalent to phenolic resins - applications: identical to phenolic resins - curing time: less than 10 minutes - cost: equivalent to phenolic resins - without phenol or formaldehyde (preserves user health).