PRODUCT DATA - METALLOGRAPHY www.lamplan.com For cold mounting metallographic samples under pressure M.M.808 creates a pressurized environment for polymerization to avoid bubbles in the mount without affecting the physical characteristics of the resin. While M.M.808 can be used with all cold mounting resins, it is highly recommended to be used with transparent EPOXY RESINS 603 / 603.2 and ACRYLIC RESIN 609. Advantage By avoiding entrapped bubbles in transparent mounts, the visibility of the sample can be improved. In all cold mounting resins, avoiding bubbles improve edge retention while grinding and polishing metallographic samples. By avoiding entrapment of abrasives in bubbles, MM808 helps improve the polishing quality after mounting. Additionally, using the M.M.808 unit for cold mounting eliminates the odors typical of cold mounting resins. Technical Data Pressure connection Nominal pressure Inner diameter of lid opening Inner diameter base Pressure pot height to cover edge Capacity of the pressure pot Embedding mold Ø 25 mm M.M.808 pressure polymerization device, Quartz timer, 08 00808 20 Operating manual, Nozzle Recommended times for LAM PLAN mounting resins: Polymerization time Resin 603 LAM PLAN offers a whole range of molds for cold mounting with M.M.808. LAM PLAN S.A. - 7 rue des Jardins - BP 15 - 74240 GAILLARD - France www.lamplan.com