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LAIRD TECHNOLOGIES
THR-DS-GAPFILLER 0710

THR-DS-GAPFILLER 0710

Product catalog summary

Overview: Laird Technologies offers a range of thermally conductive gap fillers designed to enhance the performance of electronic devices by providing efficient cooling solutions. These materials are ideal for next-generation designs that require high thermal performance without compromising on size or power.

Key Features and Benefits:

Compliancy rates up to 50% deflection at 50 psi.
Thermal conductivity ranges from 1.1 to 6.0 W/mK.
Available thicknesses range from 0.2mm to 5.08mm.

Applications: These gap fillers are suitable for a variety of applications including notebook computers, handheld devices, telecommunication hardware, servers, memory modules, automotive engine control, LED lighting, and more.

Product Specifications:

Construction: Primarily ceramic or boron nitride filled silicone sheets.
Color: Varies by product, including light gray, light green, blue, and others.
Thickness Range: From 0.008” (0.20mm) to 0.200” (5.08mm).
Density: Ranges from 1.34 g/cc to 3.00 g/cc.
Hardness: Varies from 5 Shore 00 to 70 Shore 00.
Temperature Range: -45°C to 200°C.
Thermal Conductivity: Ranges from 1.1 W/mK to 6.0 W/mK.

Performance Data: The document provides detailed performance metrics such as tensile strength, elongation, outgassing rates, flammability ratings, thermal resistance, deflection percentages, thermal expansion, breakdown voltage, volume resistivity, and dielectric constant.

Disclaimer: Laird Technologies emphasizes that the performance data is for guidance only and recommends testing materials in specific applications. They also note that specifications are subject to change and that they do not guarantee the fitness or suitability of their products for any specific use.

Catalog excerpts

Gap Filler Product Line Innovative Technology for a Connected World It all starts with an idea... The idea to make devices faster, sleeker, more compact and powerful, yet the challenge is to do so without over-heating. Laird Technologies’ thermally conductive gap fillers are compliant, future-generation cooling materials. We offer the softest, highest thermally conductive gap fillers available (in thicknesses from 0.2mm to 5.08mm). These gap filler products afford designers and engineers the most flexibility in dimensional tolerances. Extreme compliancy reduces stress on components, while higher thermal conductivity provides the required thermal performance for next-generation designs. Thermal performance and softness is what Laird Technologies does best. Call us today to discuss your application and order free samples. Laird Technologies’ gap fillers - experience the cooler side of soft. FEATURES AND BENEFITS • Compliancy rates up to 50% deflection at 50 psi • Thermal conductivity range from 1.1 – 6.0 W/mK • Thicknesses from 0.2mm to 5.08mm APPLICATIONS • Notebook computers • Flat panel displays • Handheld microprocessor devices • Audio & video components • Telecommunication hardware • Semiconductor test equipment • Automotive engine control • Servers and desktop computers • Memory modules • Household appliances • Mass storage devices • Lighting ballasts • Power conversion equipment global solutions: local support Americas: +1.800.843.4556 Europe: +49.8031.2460.0 Asia: +86.755.2714.1166 [email protected] www.lairdtech.com/thermal

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Gap Filler Product Line Innovative Technology for a Connected World TflexTM 200V0 Construction & Composition Color Thickness Range Ceramic filled silicone sheet Ceramic filled silicone sheet Light Gray Light Green Ceramic filled silicone sheet Ceramic filled silicone sheet Boron nitride filled silicone sheet Ceramic filled silicone sheet Reinforced boron nitride filled silicone sheet Dark Grey Test Method Ceramic filled Boron nitride filled dispensable silicone sheet silicone gel Light Gray Multiple Colors Thickness Tolerance Helium Pycnometer Outgassing TML (Post Cured) Outgassing CVCM (Post...

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