Thermal Management Solutions
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Laird Technologies produces some of the worlds highest-rated thermally conductive materials for use inelectronic packaging. Its thermal management products include gap fillers (including putties), phase change materials, thermal greases, thermally conductive circuit boards and thermally conductive insula- tor materials.Partnering with Laird Technologies for your thermal requirements gives you access to the industryҒsbroadest product line of thermal interface materials specially engineered to solve your toughest thermal problems.The company's engineers around the globe collaborate with...

Features and Benefits: Thermoelectric coolers (TECs) are solid-state heat pumps that utilize thePeltier effect. During operation, DC current flows through the TEC, result- ing in heat being transferred from one side of the TEC to the other, cre- ating a cold and hot side. A single stage TEC can achieve temperature differences up to 70C, or can transfer heat at a rate of 140 Watts. To achieve greater temperature differences (up to 130аC) select a multi- stage (cascade) TEC. To increase the amount of heat transferred, the TECs modular design allows the use of multiple TECs teamed...

CP Series RH/SH ֖ Series > The Քworld standard pioneered by MelcorԕQuick and economical cooling below ambient temperature at reliable solid state operationLifetime of more than 200.000 hours ՕCover 80% of various application demands With porch style ceramic as option for increased heat dissipation (71 and 127 Couples) and strong lead attachments ՕFeatures center hole for transmission oflight, wires, probes or other hardwarethrough the TECRounded and square configurations avail-able HT Ֆ Series OT Series > ֕Designed for high temperature applicationsand packagingUnique patented technology...

Applications: Laird Technologies thermally conductive gap fillers are future generationcompliant cooling materials. These thermally conductive gap fillers are the softest and highest thermally conductive gap fillers available (in thick- nesses ranging from 0.25 mm to 5.08 mm).Laird TechnologiesҒ thermally conductive gap fillers deliver engineers anddesigners the most dimensional tolerance. Extreme compliancy reduces component stress while higher thermal conductivity provides thermal per-formance required for high thermal demands. Notebook computers ՕHandheld microprocessor devices...

Thermal performance leader Օ6W/mK thermal conductivity Available in 22 thicknesses from 0.010Ք (0.25 mm) to 0.200(5.00 mm) T-pliԙ 200 Series is the premium gap filler. A unique blend of boronnitride and silicone produce Laird Technologies' highest performing gap filling pad. T-pli 200's exceptional combination of high thermal conductivity andcompliancy generate unmatched thermal resistances in a gap filling interface material. T-pliٙ 200 absorbs shock and relieves stresses, thus minimizing potential damage to components. T-pli is electrically insulat-ing, stable from -45C to 200аC, and...

Construction and Composition Boron nitride filled, silicone Boron nitride filled, silicone Boron nitride filled, silicone elastomer, fiberglass reinforced elastomer, fiberglass reinforcedelastomer, fiberglass reinforced ColorRoseYellowBlue Thickness0.01 (0.254 mm)0.015Ԕ (0.381 mm)0.02 (0.508 mm) Thickness Tolerance+/- 0.001Ԕ(0.025 mm)+/- 0.001 (0.025 mm) +/- 0.002Ԕ (0.05 mm) Density1.44 g/cc 1.44 g/cc1.43 g/cc Hardness75 Shore OO 75 Shore OO 70 Shore OO Tensile StrengthNANA35 psi Elongation % NANA5 Outgassing TML (Post Cured) 0.08%0.08%0.07% Outgassing CVCM (Post Cured ) 0.03%0.03%0.02% UL...

Construction and Composition Boron nitride filled, silicone Boron nitride filled, Boron nitride filled, Boron nitride filled, elastomer, fiberglass optionsilicone elastomersilicone elastomersilicone elastomer ColorGreenGrayYellowGray Thickness0.025 (0.635 mm) 0.03Ԕ (0.762 mm) 0.04 (1.016 mm) 0.05Ԕ (1.270 mm) Thickness Tolerance+/- 0.002 (0.05 mm) +/- 0.002Ԕ (0.05 mm) +/- 0.002 (0.05 mm) +/- 0.002Ԕ (0.05 mm) Density1.43 g/cc 1.43 g/cc 1.43 g/cc 1.38 g/cc Hardness70 Shore OO70 Shore OO70 Shore OO 70 Shore OO Tensile Strength35 psi 35 psi 35 psi 20 psi Elongation % 5555 Outgassing TML (Post...

Construction and Composition Boron nitride filled, Boron nitride filled, Boron nitride filled, Boron nitride filled, silicone elastomersilicone elastomersilicone elastomersilicone elastomer ColorGrayGrayGrayGray Thickness0.06 (1.524 mm) 0.07Ԕ (1.778 mm)0.08 (2.032 mm)0.09Ԕ (2.286 mm) Thickness Tolerance+/- 0.003 (0.075 mm)+/- 0.003Ԕ (0.075 mm)+/- 0.004 (0.10 mm)+/- 0.004Ԕ (0.10 mm) Density1.38 g/cc1.38 g/cc1.38 g/cc1.38 g/cc Hardness70 Shore OO70 Shore OO70 Shore OO 70 Shore OO Tensile Strength20 psi 20 psi 15 psi 15 psi Elongation % 5555 Outgassing TML (Post Cured) 0.10%0.10%0.10%0.10%...

Construction and Composition Boron nitride filled, Boron nitride filled, Boron nitride filled, Boron nitride filled, silicone elastomersilicone elastomersilicone elastomersilicone elastomer ColorGrayGrayGrayGray Thickness0.10 (2.54 mm) 0.11Ԕ (2.794 mm)0.12 (3.048 mm)0.13Ԕ (3.302 mm) Thickness Tolerance+/- 0.005 (0.13 mm) +/- 0.005Ԕ (0.13 mm)+/- 0.005 (0.13 mm)+/- 0.006Ԕ (0.15 mm) Density1.36 g/cc 1.36 g/cc 1.36 g/cc 1.36 g/cc Hardness70 Shore OO70 Shore OO70 Shore OO 70 Shore OO Tensile Strength15 psi 15 psi 15 psi 15 psi Elongation % 5555 Outgassing TML (Post Cured) 0.15%0.15%0.15%0.15%...

Construction and Composition Boron nitride filled, Boron nitride filled, Boron nitride filled, Boron nitride filled, silicone elastomersilicone elastomersilicone elastomersilicone elastomer ColorGrayGrayGrayGray Thickness0.14 (3.556 mm)0.14Ԕ (3.556 mm) 0.16 (4.064 mm) 0.17Ԕ (4.138 mm) Thickness Tolerance+/- 0.006 (0.15 mm) +/- 0.007Ԕ (0.18 mm)+/- 0.007 (0.18 mm)+/- 0.008Ԕ (0.20 mm) Density1.36 g/cc 1.36 g/cc 1.36 g/cc 1.36 g/cc Hardness70 Shore OO70 Shore OO70 Shore OO 70 Shore OO Tensile Strength15 psi 15 psi 15 psi 15 psi Elongation % 5555 Outgassing TML (Post Cured) 0.15%0.15%0.15%0.15%...