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Laird_Thermoelectric_Module

Laird_Thermoelectric_Module
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Thermoelectric Modules www.lairdtech.com

About Laird Technologies Laird Technologies designs and manufactures customized, performance-critical products for wireless and other advanced electronics applications. Laird Technologies is a global technology company focused on providing components and solutions that protect electronic devices from electromagnetic interference and heat, and that enable connectivity through wireless applications and antenna systems. Custom products are supplied to all sectors of the electronics industry including the handset, telecommunications, data transfer and information technology, automotive,...

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High Standard Laird Technologies designs and manufactures thermoelectric modules (TEMs) which adhere to strict process control standards and pass/fail criteria, assuring our customers receive the best possible modules. Our extensive standard product portfolio covers a wide range of cooling capacities, temperature differentials, input power constraints and geometric footprints. Standard finishing options are available to accommodate alternate lead lengths, lapping thickness tolerances, and moisture protective sealants. Standard pre-tinning and solder constructions are available to...

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• Features center hole for transmission of light, wires, probes or other hardware through the thermoelectric component • Round or square configurations available • Rapid prototyping available to accommodate unique shape requirements IMAX (AMPS) VMAX (VOLTS) • Designed for higher current, larger heat pumping applications • Wide product breadth to cover many sizes, input power configurations and heat pumping capacities • Ideal for clinical diagnostics, analytical instrumentation, photonics laser systems and enclosure cooling Annular Series Notes: 1) QMax rated value at ∆T = 0°C, Imax and...

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Thermoelectric M O D U L E S OptoTECTM • Miniature Form Factor • Pb-free solder construction with three solder melt temperatures • Alumina or Aluminum Nitride Substrates Available • Designed for laser diodes, infrared detectors, pump lasers and optical transceivers Internal Solder Melt Temperature OT ET HOT IMAX (AMPS) VMAX (VOLTS) Notes: 1) QMax rated value at ∆T = 0°C, Imax and Vmax, Th = 25°C; 2) Thickness for non-metallized versions only. All modules are lead-free. For wiring options contact Laird Technologies. eTECTM • Uses thin film semiconductor technology • Micro form factor • Very...

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Thermoelectric M O D U L E S ThermaTECTM • High Operating Temperature, up to 175°C • Superior Thermal Cycling Capability • Able to use on Power Generating applications to turn waste heat into usable output DC power Notes: 1) QMax rated value at ∆T = 0°C, Imax and Vmax, Th = 25°C; 2) Thickness for non-metallized versions only. All modules are lead-free. For wiring options contact Laird Technologies. PolarTECTM • Porch style ceramic for improved lead attachment • Standard 4,6 and 8 Amp configurations available • Designed for high volume production runs in consumer, food and beverage markets...

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Thermoelectric M O D U L E S Multi-stage • Designed for large temperature differential applications • Custom designs available to meet unique attribute requirements • Ideal for CCD cameras, IR Detectors and Industrial Sensing Instrumentation ZT Series • Assembled with premium Bismuth Telluride semiconductor material • Achieves a higher temperature differential than standard single stage TEMs • Ideal for applications that require to reach colder temperatures IMAX (AMPS) VMAX (VOLTS) IMAX (AMPS) VMAX (VOLTS) Typical Multistage Module Notes: 1) QMax rated value at ∆T = 0°C, Imax and Vmax, Th =...

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ANTENNAS & RECEPTION | EMBEDDED WIRELESS | EMI | TELEMATICS | THERMAL | WIRELESS AUTOMATION & CONTROL Finishing Options CP Center Hole OptoTEC ThermaTEC PolarTEC UltraTEC Multistage SH/RH Series Metallized Hot/Cold Surface MM 00 00 MM MM Non-Metallized Hot and/or Cold face L 11 11 11 11 L L Pre-tinning Hot and/or Cold face with 118˚C InSn Solder TT 22 22 TT TT Pre-tinning Hot and/or Cold face with 138˚C BiSn Solder 33 Au plating (Hot/Cold Surface) GG GG Example: CP10,127,05TL = Pre-tinned Hot Face (118˚C InSn), Non-Metallized Cold Face. Note: Metallization and pretinning are not recommended...

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