Heat sink compound
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Heat sink compoundnon-siliconeType series MT8800 Features ■ Non-silicone product ■ Better heat transfer than silicone-based products ■ No solder bath contamination ■ Very low bleed and evaporation value ■ Compatible with metal and plastic components ■ Wide temperature range ■ Non toxic ■ Will not melt, dry or harden ■ Meets KS 21343 spec and Military Specification MIL-C-47113B The non-silicone heat sink compound was created to solve the problems of contamination and migration associated with silicone-based products. The compound is a unique synthetic-based thermal grease used to insurequick, efficient heat transfer and dissipation. The primary advantage of this non-silicone product is long-term material stability. Virtually no bleed or evaporation over a wide operating temperature range - even in a vacuum atmosphere (10-5 tor/mil, 24 hrs. at 100°C). Compound will not leach, dry, harden, or melt in normal industrial use. Consistency 320 (Penetration, worked, 60x) per ASTM D-217 Specific gravity 2,7 g /cm3 at 25 °C per ASTM D-70 Bleed 0.1 %/Wt. at 200 °C/24h FTM-321 modified Evaporation 0.6 %/Wt. at 200 °C/24h FTM-321 modified Thermal Conductivity at 36 °C 0.70 W/m °K 16.7 x 10'4 Cal/sec cm °C 4.8 BTU.In (h/FT2°F) "hot wire" method per MIL-C-47113B Electrical properties 305 V/mil dielectric strength 0.05" gap per ASTM D-149 4.50 dielectric constant, 25 °C at 1000 Hz per ADTM D-150 32 ppm/°C coefficient of thermal expansion 1.65 x 1014 Ohm/cm volume resistivity per ASTM D-257 Operating temperature range -40...200 °C Appearance white paste Order details Heat sink compound, non-silicone Data sheet T6-030_2019-04_10.00 Heat sink compound Page 1

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Heat sink compound 1Pages

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Heat sink compound
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