
1. Specification Test conditions: TA = +25 C C Lnom; Pd = 0.01 mW Subject to technical modification
Open the catalog to page 12. Case Outline Drawing / Enclosure: Package Characteristics: Moisture Sensitivity Level: 1 Termination Finish: Gold over Nickel (Au-Ni) Max. Reflow Soldering Temperature: 260 °C Subject to technical modification
Open the catalog to page 2Subject to technical modification
Open the catalog to page 3Freq. stab. Temp. vs. temp. Range Part Number Example: XMP-5135-1A-16pF-20.000 MHz Mode = fund. Temp. range = -40 to +85 °C Freq.stab. = ± 30 ppm Adjust. tol = ± 10 ppm., CL = 16 pF Frequency = 20 MHz Subject to technical modification
Open the catalog to page 42 Pages
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