VX307H3U VPX PLug-in Card Intel® 10nm x86 Microserver 3U VPX BLade * Intel® Xeon® D-2700/2800 processors with 100G Integrated Ethernet * Up to 20 cores with AVX-512 vector engine * Security enforced by Hardware Root of Trust * VITA48 cooling builds with VITA47 CC3/CC4 support * Designed in accordance with SOSA™ requirements

Product Highlights The SOSA™ architecture booster Kontron VX307H computing node provides an instant boost to the computing performance of existing HPEC architectures designed in accordance with SOSA™. With the VX307H, Kontron takes this outstanding silicon architecture to the next level, in the form of a rugged single 3U VPX board server, boasting numerous innovations and extensions designed to fulfill the most demanding mission profiles. 2nd layer Front Panel DDR4 2 CHAN In Band ECC Memory Down 32-64 GB Intel® Xeon® D-2700 HCC processor 12 - 20 cores Expansion Plane Control Plane Expansion Plane...

Product Highlights VX307H architecture The Kontron VX307H architecture is designed as a reusable building block offering the best SWaP-C ratio for a rugged high performance computer. Designing it to fit the 3U VPX standard computer blade, Kontron added numerous connectivity options which also make this computer the ideal candidate to build powerful and versatile rugged box servers and micro clouds. To facilitate board evaluation and simplify accessibility during maintenance, Kontron has developed a mezzanine board with front connectors such as USB2.0, RJ45 and RJ12. This tooling mezzanine attaches...

Technical Information FEATURE VX307H VX307H VX307C COMMENTS Compute Intensive Compute Intensive I/O Intensive P1 2nd DATA PLANE P1 EXPANSION PLANE Backplane connectivity 10G Base-KR 10G Base-KR One of 2nd Data Plane or 1G Base-KX 1G Base-KX Control Plane is 1G 8 Lane PCIe up to Gen4 8 Lane PCIe up to Gen4 4 Lane PCIe up to Gen4 PCIe can be 8 Lane PCIe up to Gen4 PCIe can be 10G Base-KR 10G Base-KR 10G Base-KR 1G Base-KX 1G Base-KX 1G Base-KX

3U Compute Intensive Single slot VPX Plug-In Card -1” Conduction-Cooled ‘RC3’ (-40°C to +70°C) conformal coating - Intel® Xeon-D2775TE Processor (25M Cache, up to 3.10 GHz) 100W TDP, 16 cores - 32 GB soldered SDRAM with ECC - No XMC mezzanine slot - no VITA 48 2LM covers - Rear module profile is MOD3p-PAY-1F1U1S1S1U1U4F1J-16.6.13-1: 100/40GbE +10GbE Data Planes, x16 PCIe up to Gen4 Expansion Plane, 1GbE Control Plane - No Front I/O connectors - Top 2242 M.2 slot : up to D5 and M Key with x2 PCIe up to Gen3 - Bottom 2242 M.2 slot : up to D5 and M Key with x2 PCIe up to Gen3 - RTC Power sourced...

Your Contact Kontron France 150 rue Marcelin Berthelot ZI de Toulon-Est - BP 244 83078 Toulon Cedex 9 Tel.: + 33 4 98 16 34-00 [email protected] Copyright © 2024 Kontron. All rights reserved. All data is for information purposes only and not guaranteed for legal purposes. Information has been carefully checked and is believed to be accurate;however, no responsibility is assumed for inaccuracies. Kontron and the Kontron logo and all other trademarks or registered trademarks are the property of their respective owners and are recognized.Specifications are subject to change without notice. VX307H-20250701...