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Kontron Embedded Modules Overview

Kontron Embedded Modules Overview

Product catalog summary

Overview: The document details the specifications and features of various Computer-on-Modules (COM) and related technologies, emphasizing their flexibility, scalability, and application suitability.

Specifications:

Processors: Options include TI Sitara AM3874, Freescale i.MX 6, NVIDIA Tegra 3, and Freescale QorIQ series, offering single to quad-core configurations with different clock speeds.
Memory: Ranges from 1GB to 8GB DDR3, with some models supporting ECC.
Storage: Includes NAND and eMMC up to 64GB, with additional SATA and microSD card support.
Interfaces: Features extensive connectivity options such as PCIe, USB, Ethernet, and various serial interfaces.
Graphics: Integrated graphics support 2D/3D acceleration and multiple display interfaces like HDMI and LVDS.

Procedures and Support:

Bootloader and OS Support: Custom bootloader development and support for Windows, Android, Linux, and other OS.
Board Support Package: Available for various OS with customization and driver development services.
Support Services: Includes training, software development, and migration services.

Environmental and Compliance:

Temperature Range: Supports industrial and commercial ranges, with some models offering -40°C to +85°C.
Compliance: Adheres to standards like Com Express® and ETX® with specific form factors.

Key Features:

Power Efficiency: Ultra-low power consumption ranging from 2W to 30W.
Longevity and Scalability: Designed for long solution life and quick time-to-market, suitable for scalable applications.

Additional Specifications:

Form Factors: Includes COM Express® mini, compact, and basic, as well as ETX® 3.0, each with specific dimensions and pin-out types.
Temperature Ranges: Operational temperatures range from 0°C to 60°C, with storage temperatures from -30°C to 85°C. Extended ranges up to -40°C to 85°C are available for industrial applications.
Extreme Temperature Solutions: Designed for mission-critical applications in sectors like military and aerospace, with industrial-grade components and extensive testing.
Thermal Management: COM Express® Heatspreader ensures module compatibility within the same system, with additional heatsinks for enhanced thermal management.
Carrier Board Design: Kontron offers custom carrier board designs to optimize system functionality, including design, testing, and manufacturing services.
Development Tools: Hardware and software tools are available to accelerate R&D processes, including starter kits and graphics adapters.

Contact Information: The document provides contact details for Kontron's offices in Asia Pacific, Europe, Middle East & Africa, and North America.

Conclusion: Kontron's COM solutions enable customers to focus on their core business by providing standardized modules that integrate easily with custom carrier boards.

Catalog excerpts

» Computer-on-Modules 2012 « » » » » Flexibility Scalability Long solution life Short time-to-market YEARS Over 14 erience COM Exp The pulse of innovation

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» ARM Computer-on-Modules « Ultra-low Power Computer-on-Modules (82 x 50 mm) 5°C –40°C to +8 Preliminary ULP-COM-sA3874i ULP-COM-sAMX6i ULP-COM-sAT30 Processor TI Sitara AM3874, Single core Cortex A8, Up to 1.0 GHz Freescale i.MX 6 Solo, Dual and Quad Core ARM Cortex-A9, Up to 1.2GHz NVIDIA® Tegra 3 (Kel-Al), Quad Core™ ARM Cortex A9 1.2 GHz Memory DDR3 memory, 1 GB, down DDR3 up to 2 GB, memory down DDR3, 1 or 2 GB, down Flash Up to 32GB NAND (optionally) Up to 64GB NAND/eMMC (optionally) Up to 64 GB NAND/eMMC (optionally) Ethernet 10/100/1000 Gbit 10/100/1000 Mbit/sec 10/100/1000 Mbit/sec USB...

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» QorIQ™ Computer-on-Modules « COM Express® QorIQ™ Computer-on-Modules COMe-cP2020* COMe-cP5020* Processor Freescale QorIQ™ P2020 e500 Power Architecture (2x 1.2 GHz commercial temp. / 1.0 GHz industrial temp.) Freescale QorIQ™ P5020 (P5010) e5500 Power Architecture (2x 2.0 GHz (2x 1.6 GHz)) Cache 32 KB L1 instruction cache and 32 KB L1 data cache for each core; 512 KB L2 cache with ECC. 32 KB L1 instruction cache and 32 KB L1 data cache for each core; 512 KB L2 cache/Core; 2MB L3 cache shared Memory Up to 4GB DDR3-667 72-bit Up to 8GB DDR3-1333 MHz ECC Storage/Flash 64kbit I²C EEPROM / up to...

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» x86 Computer-on-Modules « COM Express® COM Express® compact (95x95mm) mini (84x55mm) –40°C –40°C to +85 °C The Thermal Concept ETX® COM Express® Heatspreader provides: » dentical mechanical size – all COM Express® modules I fit in the same system » he only surface that needs cooling is the top of the T heatspreader » dditional active and passive Heatsinks are available A (114x95mm) basic (125x95mm) to +85 °C COMe-mSP1 (nanoETXexpress-SP) COMe-mTT10 (nanoETXexpress-TT) COMe-mCT10 COMe-cSP2 (microETXexpress®-SP) COMe-cXLi2 (microETXexpress®-XL) COMe-cPV2 (microETXexpress®-PV) COMe-cDC2 (microETXexpress®-DC)...

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Concentrate on Your Core Business Thanks to Computer-on-Modules (COM), customers can concentrate on their core business and only have to design the necessary interfaces and circuits for their individual carrier boards. The standardized computer module is then simply plugged into the carrier board. Customers can focus on their application-specific elements without worrying about the computing core. Broad Knowledge Base Accelerates Time-to-Market Kontron offers a variety of hardware and software tools to speed up and simplify your R&D processes. With complete starter kits that, which include all...

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