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Space Applications
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Catalog excerpts

Space Applications - 2

Kohesi Bond is a pioneer in manufacturing custom engineered adhesives, sealants, coatings, potting and encapsulation compounds. We offer a sweeping range of first-rate epoxy systems designed specifically for use in the assembly of aircraft interiors, components, structures, satellites and MRO applications. Using our extensive technical expertise, we offer these formulations with an array of performance and curing characteristics. Our unique ability to tailor products to each application’s specific needs, offers customers with reliable solutions and the ease of manufacturing. Product’s...

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Space Applications - 3

Innovation tailored to your needs Kohesi Bond performance products are specially designed for successful use in your applications from initial prototyping to scaled-up production lines. Meeting new challenges of the aerospace industry means inventing new technology. To make this happen, we offer you round-the-clock assistance right from the research and design phase through the manufacturing process. Typical Applications • Optical Fiber Systems • Fiber Reinforced Composite Assembly • Braking Systems • EMI/RFI Shielding • Launch Canister Liners • Potting & Encapsulation • Microelectronic...

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Space Applications - 4

Reach for the stars with our space adhesives Kohesi Bond’s space-ready compounds are capable of passing NASA standards for low outgassing (ASTM E-595). One of the key concerns while selecting an adhesive for space applications is its serviceability in extremely high vacuum environment. Systems operate under very high vacuum (~ 10-8 torr) in space. Any outgassing from the adhesive could lead to failure of crucial components of the system. To avoid such failure during operation, NASA developed the ASTM E-595 low outgassing test standard. This test involves collecting volatiles from the test...

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Space Applications - 5

LIST OF PRODUCTS Product Electrically Electrically Thermally Bonding/ Potting/ Page Coating Conductive Insulative Conductive Sealing Encapsulation No.

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