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Space Applications

Space Applications

Space Applications

Product catalog summary
Overview: Kohesi Bond specializes in manufacturing custom-engineered adhesives, sealants, coatings, potting, and encapsulation compounds. These products are tailored for aerospace applications, including aircraft interiors, components, structures, satellites, and MRO (Maintenance, Repair, and Overhaul) applications. The company emphasizes its ability to customize formulations to meet specific application needs, ensuring reliability and ease of manufacturing.
Key Features: Kohesi Bond's products are designed with various performance characteristics such as mechanical strength, hardness, temperature resistance, viscosity, chemical resistance, heat dissipation, and electrical conductivity. They can also be color-matched to user specifications.
Applications: The products are suitable for a wide range of applications, including optical fiber systems, fiber-reinforced composite assembly, braking systems, EMI/RFI shielding, launch canister liners, potting and encapsulation, microelectronic applications, cryogenic systems, ultra-high vacuum assembly, and flight control seals.
Space-Ready Compounds: Kohesi Bond offers space-ready compounds that meet NASA's low outgassing standards (ASTM E-595). These compounds are crucial for space applications where high vacuum environments (~10-8 torr) are present. The compounds are tested for CVCM (Collected Volatile Condensable Materials), TML (Total Mass Loss), and WVR (Water Vapor Regained) to ensure they meet the stringent requirements.
Product List: The document lists various one-component and two-component epoxy products, detailing their electrical and thermal conductivity, and suitability for bonding, sealing, coating, and potting/encapsulation. Each product is associated with specific page numbers for further details.
Conclusion: Kohesi Bond provides comprehensive solutions for the aerospace industry, offering technical support from research and design through to manufacturing. Their products are designed to meet the evolving challenges of the aerospace sector, ensuring high performance and reliability.
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Catalog excerpts

Space Applications-2

Kohesi Bond is a pioneer in manufacturing custom engineered adhesives, sealants, coatings, potting and encapsulation compounds. We offer a sweeping range of first-rate epoxy systems designed specifically for use in the assembly of aircraft interiors, components, structures, satellites and MRO applications. Using our extensive technical expertise, we offer these formulations with an array of performance and curing characteristics. Our unique ability to tailor products to each application’s specific needs, offers customers with reliable solutions and the ease of manufacturing. Product’s mechanical...

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Space Applications-3

Innovation tailored to your needs Kohesi Bond performance products are specially designed for successful use in your applications from initial prototyping to scaled-up production lines. Meeting new challenges of the aerospace industry means inventing new technology. To make this happen, we offer you round-the-clock assistance right from the research and design phase through the manufacturing process. Typical Applications • Optical Fiber Systems • Fiber Reinforced Composite Assembly • Braking Systems • EMI/RFI Shielding • Launch Canister Liners • Potting & Encapsulation • Microelectronic Applications...

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Space Applications-4

Reach for the stars with our space adhesives Kohesi Bond’s space-ready compounds are capable of passing NASA standards for low outgassing (ASTM E-595). One of the key concerns while selecting an adhesive for space applications is its serviceability in extremely high vacuum environment. Systems operate under very high vacuum (~ 10-8 torr) in space. Any outgassing from the adhesive could lead to failure of crucial components of the system. To avoid such failure during operation, NASA developed the ASTM E-595 low outgassing test standard. This test involves collecting volatiles from the test specimen...

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Space Applications-5

LIST OF PRODUCTS Product Electrically Electrically Thermally Bonding/ Potting/ Page Coating Conductive Insulative Conductive Sealing Encapsulation No.

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