KOHESI BOND Custom Engineered Adhesives

Kohesi Bond is a pioneer in manufacturing custom engineered adhesives, sealants, coatings, potting and encapsulation compounds. We offer a sweeping range of first-rate epoxy systems designed specifically for use in the assembly of aircraft interiors, components, structures, satellites and MRO applications. Using our extensive technical expertise, we offer these formulations with an array of performance and curing characteristics. Our unique ability to tailor products to each application’s specific needs, offers customers with reliable solutions and the ease of manufacturing. Product’s mechanical...

Innovation tailored to your needs Kohesi Bond performance products are specially designed for successful use in your applications from initial prototyping to scaled-up production lines. Meeting new challenges of the aerospace industry means inventing new technology. To make this happen, we offer you round-the-clock assistance right from the research and design phase through the manufacturing process. Typical Applications • Optical Fiber Systems • Fiber Reinforced Composite Assembly • Braking Systems • EMI/RFI Shielding • Launch Canister Liners • Potting & Encapsulation • Microelectronic Applications •...

Reach for the stars with our space adhesives Kohesi Bond’s space-ready compounds are capable of passing NASA standards for low outgassing (ASTM E-595). One of the key concerns while selecting an adhesive for space applications is its serviceability in extremely high vacuum environment. Systems operate under very high vacuum (~ 10-8 torr) in space. Any outgassing from the adhesive could lead to failure of crucial components of the system. To avoid such failure during operation, NASA developed the ASTM E-595 low outgassing test standard. This test involves collecting volatiles from the test specimen...

SODIUM SILICATES KB-SS-SCN

KB 1427 HT High temperature and chemically resistant epoxy Important Features • Can withstand temperatures up to 340°C (intermittent) • Extremely low exotherm upon curing • Castable beyond 1/2” thickness • Excellent flow properties Characteristic Properties Tensile Lap Shear Strength, Aluminum to Aluminum, 23°C > 3,300 psi Volume Resistivity, 23°C > 1015 ohm-cm Glass T ransition Temperature (Tg) 220°C - 230°C Service Temperature Range -60°C to +340°C TUF 1613 HT-DA Toughened epoxy for die attach applications Important Features • Daunting die shear strength • Fast cure schedule • Thermally...

Toughened, thermally conductive epoxy Important Features • • • • First-rate thermal conductivity Cryogenically serviceable Excellent resistance to thermal cycling Electrically insulating Characteristic Properties T-peel Strength, Aluminum to Aluminum, 23°C Flowable Paste Superb electrical conductor for bonding and sealing Important Features • • • • High purity silver filled electrically conductive epoxy Very low volume resistivity Cryogenically serviceable High toughness and dimensional stability Characteristic Properties Volume Resistivity, 23°C Tensile Modulus, 23°C Solids Content, 23°C Thermal...

Strong, toughened, cryogenically serviceable epoxy Important Features • • • • Outstanding physical strength properties Electrically insulative and thermally conductive Excellent dimensional stability Extremely wide serviceable temperature range Characteristic Properties Tensile Lap Shear Strength, Aluminum to Aluminum, 23°C Service Temperature Range Kohesi Bond - Adhesives for Space Ap

Thixotropic Paste KB 1631 AOLV-1 Two component thermally conductive epoxy Important Features • Outstanding electrical insulation • Easy to use mix ratio of 1:1 • Low shrinkage and excellent dimensional stability • Good flow properties Characteristic Properties Coefficient of Thermal Expansion, 23°C KB 1631 HTC-1 Cryogenic, thermally conductive epoxy Important Features • Electrically insulative and thermally conductive • Serviceable temperature range [4K (-269.15°C) to +200°C] • Superior resistance to thermal shock • Very smooth paste consistency Characteristic Properties Tensile Lap Shear Strength,...

KB 1031 AT-2LO Flexibilized epoxy for bonding, sealing and potting Important Features • Excellent toughness • Superior resistance to thermal shock • Thermally conductive • Outstanding peel strength and elongation Characteristic Properties T-peel Strength, Aluminum to Aluminum, 23°C KB 1031 ATHT-LO Toughened two component epoxy system Important Features • Easily bonds to similar and dissimilar substrates • Broad service temperature range (-70°C to +180°C) • Superior mechanical strength properties • Excellent impact resistance and peel strength Characteristic Properties Tensile Lap Shear Strength,...

KB 1040-2 Low viscosity, clear two component epoxy Important Features • Superior optical clarity • Cryogenically serviceable • Outstanding dimensional stability • Excellent mechanical strength properties Characteristic Properties Service Temperature Range 4K (-269.15°C) to +150°C KB 1040 CTE-LO Epoxy with very low coefficient of thermal expansion Important Features • Low viscosity • Very low linear shrinkage • Outstanding dimensional stability • Electrically insulative and thermally conductive Characteristic Properties Coefficient of Thermal Expansion, 23°C KB 10473 FLAO Thermally conductive,...

KB 1039 CRLP Optically clear and cryogenically serviceable epoxy Important Features • Very long pot life • Low exotherm; suitable for large castings • Capable of withstanding cryogenic shock • Excellent flow properties Characteristic Properties Tensile Lap Shear Strength, Aluminum to Aluminum, 23°C > 2,300 psi Volume Resistivity, 23°C > 1015 ohm-cm Mixed Viscosity of Part A and Part B, 23°C 500 - 1,600 cps Service Temperature Range 4K (-269.15°C) to +135°C KB 1039 CRLP-AO Thermally Conductive, cryogenic epoxy Important Features • Thermally conductive • Cryogenically serviceable •...