Adhesives, Sealants, Coatings, Potting & Encapsulation Compounds for Electronic Industry
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ADHESIVES I SEALANTS I COATINGS

Kohesi Bond is a pioneer in manufacturing custom engineered adhesives, sealants, coatings, potting and encapsulation compounds. We offer a sweeping range of first-rate epoxy systems designed specifically for use in semiconductor packaging and assembly of electronics such as printed circuit boards. Using our extensive technical expertise, we offer these formulations with an array of performance and curing characteristics. Our unique ability to tailor products to each application’s specific needs, offers customers with reliable solutions and the ease of manufacturing. Product’s mechanical...

Innovation tailored to your needs Kohesi Bond performance products are specially designed for successful use in your applications from initial prototyping to scaled-up production lines. Meeting new challenges of the electronic industry means inventing new technology. To make this happen, we offer you round-the-clock assistance right from the research and design phase through the manufacturing process. Typical Applications • Chip & Wire Bonding • Conformal Coating • Die-attach • EMI/RFI Shielding • Glob Top • Potting & Encapsulation • Printed Circuit Board Assembly • Thermal Management •...

Electrically Conductive KB 1427 HT-3 TUF 1613 HT-DA TUF 1613 HT-CM TUF 1613 HT-GT TUF 1613 HT-SM TUF 1820 AOHT TUF 1820 ANHT TUF 1820 HTS TUF 1828 TC

LIST OF PRODUCTS Product Electrically Electrically Thermally Bonding/ Potting/ Page Coating Conductive Insulative Conductive Sealing Encapsulation No. TWO COMPONENT EPOXIES (continued) √

KB 1613 HT Superior electrical insulator for bonding and sealing Important Features • Excellent physical strength properties • Fast cure schedule • Outstanding dimensional stability • Wide serviceable temperature range Characteristic Properties Tensile Lap Shear Strength, Aluminum to Aluminum, 23°C > 2,300 psi Volume Resistivity, 23°C > 1014 ohm-cm Thixotropic Paste ervice Temperature Range KB 1613 RLV Underfill compound with good flow properties Important Features • Thermally conductive and electrically insulative • Accelerated cure at elevated temperatures • Superior dimensional...

STURDY even under extremely HOT conditions KB 1427 HT & KB 1427 HT-3 are our one component high temperature resistant systems. Their superior electrical insulation properties, outstanding chemical resistance and excellent physical strength properties make them an ideal fit for critical applications in the electronic industry. These products do not set up at room temperature, since they offer an unlimited working life. In addition, they are also available in thicker viscosities. KB 1427 HT High temperature and chemically resistant epoxy Important Features • Can withstand temperatures up to...

TOUGHENED Epoxies Built to LAST Kohesi Bond’s ‘TUF’ series of epoxy adhesives are specifically designed to provide additional toughness to the adhesive. They provide excellent mechanical strength, producing durable and tough bonds. In addition to resisting mechanical shocks and vibrations, their ability to handle stresses from temperature cycling and severe thermal shocks makes them quintessential for the challenges of today’s electronic industry. Toughened epoxy for die attach applications Important Features • • • • Daunting die shear strength Fast cure schedule Thermally conductive...

TUF 1613 HT-GT Toughened glob top epoxy Important Features • Excellent physical strength properties • Fast cure schedule • Outstanding dimensional stability • Electrically insulative and thermally conductive Characteristic Properties Tensile Lap Shear Strength, Aluminum to Aluminum, 23°C Viscosity, 23°C Coefficient of Thermal Expansion, 23°C Thixotropic Paste TUF 1613 HT-SM Fast curing, toughened surface mount epoxy Important Features • Thermally conductive • Broad service temperature range (-70°C to +180°C) • Superior mechanical strength properties • Very smooth paste...

Toughened, thermally conductive epoxy Important Features • • • • First-rate thermal conductivity Cryogenically serviceable Excellent resistance to thermal cycling Electrically insulating Characteristic Properties T-peel Strength, Aluminum to Aluminum, 23°C Flowable Paste Superb electrical conductor for bonding and sealing Important Features • • • • High purity silver filled electrically conductive epoxy Very low volume resistivity Cryogenically serviceable High toughness and dimensional stability Characteristic Properties Volume Resistivity, 23°C Toughened, low thermal resistance epoxy...

Thixotropic Paste KB 1631 AOLV-1 Two component thermally conductive epoxy Important Features • Outstanding electrical insulation • Easy to use mix ratio of 1:1 • Low shrinkage and excellent dimensional stability • Good flow properties Characteristic Properties Coefficient of Thermal Expansion, 23°C KB 1631 HTC-1 Cryogenic, thermally conductive epoxy Important Features • Electrically insulative and thermally conductive • Serviceable temperature range [4K (-269.15°C) to +200°C] • Superior resistance to thermal shock • Very smooth paste consistency Characteristic Properties Tensile Lap Shear...

TWO COMPONENT SYSTEM KB 1031 AT-2LO Flexibilized epoxy for bonding, sealing and potting Important Features • Excellent toughness • Superior resistance to thermal shock • Thermally conductive • Outstanding peel strength and elongation Characteristic Properties T-peel Strength, Aluminum to Aluminum, 23°C KB 1031 ATHT-LO Toughened two component epoxy system Important Features • Easily bonds to similar and dissimilar substrates • Broad service temperature range (-70°C to +180°C) • Superior mechanical strength properties • Excellent impact resistance and peel strength Characteristic Properties...