SPW2430HR5H-B Surface mount MEMS
11Pages

SPW2430HR5H-B Top Port SiSonicTM Microphone The SPW2430HR5H-B is a miniature, highperformance, low power, top port silicon microphone. Using Knowles’ proven high performance SiSonicTM MEMS technology, the SPW2430HR5H-B consists of an acoustic sensor, a low noise input buffer, and an output amplifier. These devices are suitable for applications such as cellphones, smart phones, laptop computers, sensors, digital still cameras, portable music recorders, and other portable electronic devices where excellent audio performance and RF immunity are required. Features: Small package Low Current MaxRF protection Ultra-Stable Performance Standard SMD Reflow Omnidirectional

ABSOLUTE MAXIMUM RATINGS Parameter Absolute Maximum Rating Input Current to Any Pin Temperature Range Stresses exceeding these “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only. Functional operation at these or any other conditions beyond those indicated under “Acoustic & Electrical Specifications” is not implied. Exposure beyond those indicated under “Acoustic & Electrical Specifications” for extended periods may affect device reliability. ACOUSTIC & ELECTRICAL SPECIFICATIONS TEST CONDITIONS: 23 ±2°C, 55±20% R.H., VDD(min) < VDD < VDD(max),...

FREQUENCY RESPONSE CURVE

External Gain = -RF/RS (Set By User) Dotted Section Represents SiSonicTM Microphone Notes: All Ground pins must be connected to ground. Capacitors near the microphone should not contain Class 2 dielectrics. Detailed information on acoustic, mechanical, and system integration can be found in the latest SiSonicTM Design Guide application note.

MECHANICAL SPECIFICATIONS Output Signal Power Supply Notes: Pick Area only extends to 0.25 mm of any edge or hole unless otherwise specified. Dimensions are in millimeters unless otherwise specified. Tolerance is ±0.15mm unless otherwise specified

PRODUCT DATA SHEET 6. EXAMPLE LAND PATTERN 7. EXAMPLE SOLDER STENCIL PATTERN Notes: Dimensions are in millimeters unless otherwise specified. Further optimizations based on application should be performed.

8. PACKAGING & MARKING DETAIL "S": Knowles SiSonic™ Production "E": Knowles Engineering Samples "P": Knowles Prototype Samples Unique Job Identification Number Notes: Dimensions are in millimeters unless otherwise specified. Vacuum pickup only in the pick area indicated in Mechanical Specifications. Labels applied directly to reel and external package. Shelf life: Twelve (12) months when devices are to be stored in factory supplied, unopened ESD moisture sensitive bag under maximum environmental conditions of

RECOMMENDED REFLOW PROFILE tP Profile Feature Average Ramp-up rate (TSMAX to TP) Preheat Temperature Min (TSMIN) Temperature Max (TSMAX) Time (TSMIN to TSMAX) (tS) Time maintained above: Temperature (TL) Time (tL) Peak Temperature (TP) Time within 5°C of actual Peak Temperature (tP) Ramp-down rate (TP to TSMAX) Time 25°C to Peak Temperature Notes: Based on IPC/JDEC J-STD-020 Revision C. All temperatures refer to topside of the package, measured on the package body surface.

SPW2430HR5H-B 10. ADDITIONAL NOTES (A) MSL (moisture sensitivity level) Class 1. (B) Maximum of 3 reflow cycles is recommended. (C) In order to minimize device damage: Do not board wash or clean after the reflow process. Do not brush board with or without solvents after the reflow process. Do not directly expose to ultrasonic processing, welding, or cleaning. Do not insert any object in port hole of device at any time. Do not apply over 30 psi of air pressure into the port hole. Do not pull a vacuum over port hole of the microphone. Do not apply a vacuum when repacking into sealed bags at a...

PRODUCT DATA SHEET Note: After reliability tests are performed, the sensitivity of the microphones shall not deviate more than 3 dB from its initial value.

PRODUCT DATA SHEET Information contained herein is subject to change without notice. It may be used by a party at their own discretion and risk. We do not guarantee any results or assume any liability in connection with its use. This publication is not to be taken as a license to operate under any existing patents.