Catalog excerpts
SPA2629LR5H-B Low Noise Zero-Height SiSonicTM Microphone The SPA2629LR5H-B is a miniature, highperformance, low power, bottom port silicon microphone. Using Knowles’ proven high performance SiSonicTM MEMS technology, the SPA2629LR5H-B consists of an acoustic sensor, a low noise input buffer, and an output amplifier. These devices are suitable for applications such as cellphones, smart phones, laptop computers, sensors, digital still cameras, portable music recorders, and other portable electronic devices where excellent wideband audio performance and RF immunity are required. Features: Very Low Noise Flat Frequency Response Small package Low Current MaxRF protection Zero-Height MicTM Ultra-Stable Performance Standard SMD Reflow Omnidirectional
Open the catalog to page 1ABSOLUTE MAXIMUM RATINGS Parameter Absolute Maximum Rating Input Current to Any Pin Temperature Range Stresses exceeding these “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only. Functional operation at these or any other conditions beyond those indicated under “Acoustic & Electrical Specifications” is not implied. Exposure beyond those indicated under “Acoustic & Electrical Specifications” for extended periods may affect device reliability. ACOUSTIC & ELECTRICAL SPECIFICATIONS TEST CONDITIONS: 23 ±2°C, 55±20% R.H., VDD(min) ≤ VDD ≤ VDD(max),...
Open the catalog to page 2FREQUENCY RESPONSE CURVE
Open the catalog to page 3External Gain = -RF/RS (Set By User) Dotted Section Represents SiSonicTM Microphone Note: Capacitors near the microphone should not contain Class 2 dielectrics. Detailed information on acoustic, mechanical, and system integration can be found in the latest SiSonicTM Design Guide application note.
Open the catalog to page 4PRODUCT DATA SHEET Notes: Pick Area only extends to 0.25 mm of any edge or hole unless otherwise specified. Dimensions are in millimeters unless otherwise specified. Tolerance is ±0.15mm unless otherwise specified
Open the catalog to page 56. EXAMPLE LAND PATTERN 7. EXAMPLE SOLDER STENCIL PATTERN Notes: Dimensions are in millimeters unless otherwise specified. Detailed information on AP size considerations can be found in the latest SiSonic Design Guide application note. Further optimizations based on application should be performed.
Open the catalog to page 6PRODUCT DATA SHEET 8. PACKAGING & MARKETING DETAIL "S": Knowles SiSonic™ Production "E": Knowles Engineering Samples "P": Knowles Prototype Samples Unique Job Identification Number Notes: Dimensions are in millimeters unless otherwise specified. Vacuum pickup only in the pick area indicated in Mechanical Specifications. Labels applied directly to reel and external package. Shelf life: Twelve (12) months when devices are to be stored in factory supplied, unopened ESD moisture sensitive bag under maximum environmental conditions of
Open the catalog to page 7RECOMMENDED REFLOW PROFILE tP Profile Feature Average Ramp-up rate (TSMAX to TP) Preheat Temperature Min (TSMIN) Temperature Max (TSMAX) Time (TSMIN to TSMAX) (tS) Time maintained above: Temperature (TL) Time (tL) Peak Temperature (TP) Time within 5°C of actual Peak Temperature (tP) Ramp-down rate (TP to TSMAX) Time 25°C to Peak Temperature Notes: Based on IPC/JDEC J-STD-020 Revision C. All temperatures refer to topside of the package, measured on the package body surface.
Open the catalog to page 8SPA2629LR5H-B 10. ADDITIONAL NOTES (A) MSL (moisture sensitivity level) Class 1. (B) Maximum of 3 reflow cycles is recommended. (C) In order to minimize device damage: Do not board wash or clean after the reflow process. Do not brush board with or without solvents after the reflow process. Do not directly expose to ultrasonic processing, welding, or cleaning. Do not insert any object in port hole of device at any time. Do not apply over 30 psi of air pressure into the port hole. Do not pull a vacuum over port hole of the microphone. Do not apply a vacuum when repacking into sealed bags at a...
Open the catalog to page 9SPA2629LR5H-B 12. RELIABILITY SPECIFICATIONS Test Thermal Shock High Temperature Storage Low Temperature Storage High Temperature Bias Low Temperature Bias Temperature / Humidity Bias Description 100 cycles air-to-air thermal shock from -40oC to +125oC with 15 minute soaks. (IEC 68-2-4) 1,000 hours at +105oC environment (IEC 68-2-2 Test Ba) 1,000 hours at -40oC environment (IEC 68-2-2 Test Aa) 1,000 hours at +105oC under bias (IEC 68-2-2 Test Ba) 1,000 hours at -40oC under bias (IEC 68-2-2 Test Aa) 1,000 hours at +85oC/85% R.H. under bias. (JESD22-A101A-B) 4 cycles of 20 to 2,000 Hz...
Open the catalog to page 10PRODUCT DATA SHEET Information contained herein is subject to change without notice. It may be used by a party at their own discretion and risk. We do not guarantee any results or assume any liability in connection with its use. This publication is not to be taken as a license to operate under any existing patents.
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