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SPA2629LR5H Surface mount MEMS

SPA2629LR5H Surface mount MEMS
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SPA2629LR5H Surface mount MEMS

Product catalog summary
Overview: The SPA2629LR5H-B is a miniature, high-performance, low power, bottom port silicon microphone utilizing Knowles’ SiSonicTM MEMS technology. It is designed for applications requiring excellent wideband audio performance and RF immunity, such as cellphones, laptops, and portable music recorders.
Features: The microphone features very low noise, flat frequency response, small package size, low current consumption, MaxRF protection, Zero-Height MicTM, ultra-stable performance, standard SMD reflow, and omnidirectional directivity.
Absolute Maximum Ratings: The device can withstand a VDD to Ground voltage of -0.5 to +5.0 V, OUT to Ground voltage of -0.3 to VDD + 0.3 V, input current to any pin of ±5 mA, and a temperature range of -40 to +100 °C. Exceeding these ratings may cause permanent damage.
Acoustic & Electrical Specifications: The microphone operates with a supply voltage between 1.5 and 3.6 V, a supply current of 120 to 165 µA, and a sensitivity of -41 to -35 dBV/Pa at 94 dB SPL @ 1 kHz. It has a signal-to-noise ratio of 65 dB(A) and a total harmonic distortion of 0.2% at 94 dB SPL @ 1 kHz.
Mechanical Specifications: The microphone measures 3.35 mm in length, 2.50 mm in width, and 0.98 mm in height, with an acoustic port diameter of 0.25 mm. It has three pins: VDD (Power Supply), OUTPUT (Signal Output), and GROUND (Power Ground).
Packaging & Marking: The microphone is available in reels of 5,900 units, with a shelf life of 12 months when stored in factory-supplied, unopened ESD moisture-sensitive bags.
Reflow Profile: The recommended reflow profile for Pb-Free soldering includes a peak temperature of 260°C and a maximum of 3 reflow cycles.
Reliability Specifications: The microphone undergoes various tests, including thermal shock, high and low temperature storage, vibration, ESD, and mechanical shock. Sensitivity deviations post-testing should not exceed 3 dB from the initial value.
Materials Statement: The product complies with the European RoHS directive and does not use ozone-depleting substances.
Specifications Revisions: The document is the initial release dated 10/02/13.
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Catalog excerpts

SPA2629LR5H Surface mount MEMS-1

SPA2629LR5H-B Low Noise Zero-Height SiSonicTM Microphone The SPA2629LR5H-B is a miniature, highperformance, low power, bottom port silicon microphone. Using Knowles’ proven high performance SiSonicTM MEMS technology, the SPA2629LR5H-B consists of an acoustic sensor, a low noise input buffer, and an output amplifier. These devices are suitable for applications such as cellphones, smart phones, laptop computers, sensors, digital still cameras, portable music recorders, and other portable electronic devices where excellent wideband audio performance and RF immunity are required. Features: Very Low Noise Flat Frequency Response Small package Low Current MaxRF protection Zero-Height MicTM Ultra-Stable Performance Standard SMD Reflow Omnidirectional

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SPA2629LR5H Surface mount MEMS-2

ABSOLUTE MAXIMUM RATINGS Parameter Absolute Maximum Rating Input Current to Any Pin Temperature Range Stresses exceeding these “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only. Functional operation at these or any other conditions beyond those indicated under “Acoustic & Electrical Specifications” is not implied. Exposure beyond those indicated under “Acoustic & Electrical Specifications” for extended periods may affect device reliability. ACOUSTIC & ELECTRICAL SPECIFICATIONS TEST CONDITIONS: 23 ±2°C, 55±20% R.H., VDD(min) ≤ VDD ≤ VDD(max), no...

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SPA2629LR5H Surface mount MEMS-3

FREQUENCY RESPONSE CURVE

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SPA2629LR5H Surface mount MEMS-4

External Gain = -RF/RS (Set By User) Dotted Section Represents SiSonicTM Microphone Note: Capacitors near the microphone should not contain Class 2 dielectrics. Detailed information on acoustic, mechanical, and system integration can be found in the latest SiSonicTM Design Guide application note.

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SPA2629LR5H Surface mount MEMS-5

PRODUCT DATA SHEET Notes: Pick Area only extends to 0.25 mm of any edge or hole unless otherwise specified. Dimensions are in millimeters unless otherwise specified. Tolerance is ±0.15mm unless otherwise specified

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SPA2629LR5H Surface mount MEMS-6

6. EXAMPLE LAND PATTERN 7. EXAMPLE SOLDER STENCIL PATTERN Notes: Dimensions are in millimeters unless otherwise specified. Detailed information on AP size considerations can be found in the latest SiSonic Design Guide application note. Further optimizations based on application should be performed.

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SPA2629LR5H Surface mount MEMS-7

PRODUCT DATA SHEET 8. PACKAGING & MARKETING DETAIL "S": Knowles SiSonic™ Production "E": Knowles Engineering Samples "P": Knowles Prototype Samples Unique Job Identification Number Notes: Dimensions are in millimeters unless otherwise specified. Vacuum pickup only in the pick area indicated in Mechanical Specifications. Labels applied directly to reel and external package. Shelf life: Twelve (12) months when devices are to be stored in factory supplied, unopened ESD moisture sensitive bag under maximum environmental conditions of

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SPA2629LR5H Surface mount MEMS-8

RECOMMENDED REFLOW PROFILE tP Profile Feature Average Ramp-up rate (TSMAX to TP) Preheat Temperature Min (TSMIN) Temperature Max (TSMAX) Time (TSMIN to TSMAX) (tS) Time maintained above: Temperature (TL) Time (tL) Peak Temperature (TP) Time within 5°C of actual Peak Temperature (tP) Ramp-down rate (TP to TSMAX) Time 25°C to Peak Temperature Notes: Based on IPC/JDEC J-STD-020 Revision C. All temperatures refer to topside of the package, measured on the package body surface.

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SPA2629LR5H Surface mount MEMS-9

SPA2629LR5H-B 10. ADDITIONAL NOTES (A) MSL (moisture sensitivity level) Class 1. (B) Maximum of 3 reflow cycles is recommended. (C) In order to minimize device damage: Do not board wash or clean after the reflow process. Do not brush board with or without solvents after the reflow process. Do not directly expose to ultrasonic processing, welding, or cleaning. Do not insert any object in port hole of device at any time. Do not apply over 30 psi of air pressure into the port hole. Do not pull a vacuum over port hole of the microphone. Do not apply a vacuum when repacking into sealed bags at a rate...

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SPA2629LR5H Surface mount MEMS-10

SPA2629LR5H-B 12. RELIABILITY SPECIFICATIONS Test Thermal Shock High Temperature Storage Low Temperature Storage High Temperature Bias Low Temperature Bias Temperature / Humidity Bias Description 100 cycles air-to-air thermal shock from -40oC to +125oC with 15 minute soaks. (IEC 68-2-4) 1,000 hours at +105oC environment (IEC 68-2-2 Test Ba) 1,000 hours at -40oC environment (IEC 68-2-2 Test Aa) 1,000 hours at +105oC under bias (IEC 68-2-2 Test Ba) 1,000 hours at -40oC under bias (IEC 68-2-2 Test Aa) 1,000 hours at +85oC/85% R.H. under bias. (JESD22-A101A-B) 4 cycles of 20 to 2,000 Hz sinusoidal...

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SPA2629LR5H Surface mount MEMS-11

PRODUCT DATA SHEET Information contained herein is subject to change without notice. It may be used by a party at their own discretion and risk. We do not guarantee any results or assume any liability in connection with its use. This publication is not to be taken as a license to operate under any existing patents.

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.