Surfscan® SP7XP
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Surfscan® SP7 XP Unpatterned Wafer Defect Inspection System The Surfscan® SP7 XP unpatterned wafer inspection system facilitates qualification and monitoring of processes and tools for IC, wafer, equipment and materials manufacturers for ≤5nm logic and advanced memory design nodes. With industry-best 12.5nm sensitivity and high throughput, the Surfscan SP7 XP provides a single tool solution for both R&D pathfinding applications and process monitoring during high volume manufacturing. Built on the industry-standard Surfscan® platform, the Surfscan SP7 XP delivers ultimate sensitivity to critical defects and enhanced defect classification for bare wafers, smooth and rough films, and fragile resists and litho stacks, including those used for EUV lithography. By discovering and identifying critical defects and surface quality issues, the Surfscan SP7 XP enables faster identification of process and tool issues, driving faster ramp, higher yield and improved fab profitability. As an extension of the Surfscan SP7, the Surfscan SP7 XP incorporates new hardware technologies and innovative algorithms that enable enhanced capability, including: Ultimate sensitivity for advanced design node R&D pathfinding by IC fabs, wafer houses and equipment manufacturers High throughput for cost-effective monitoring during high volume manufacturing of advanced design node devices Capture of unique defects types using new inspection modes for support of a broad range of process monitoring applications Image based defect classification using revolutionary machine learning algorithms for faster time to

Surfscan SP7 XP Advanced Features Defect Sensitivity New 12.5nm inspection mode and low noise sensors provide the inspection sensitivity required for R&D pathfinding at leading-edge design nodes, including development of logic devices using gate all around transistors. The new Phase Contrast Channel (PCC) provides enhanced signal for improved capture of defect types with weak scattering in the normal or oblique channel, such as shallow bumps or residue. The Normal Illumination (NI) inspection channel utilizes an independent objective to optimize capture of defects of interest not found in...

High volume manufacturing inspection modes have improved cost of ownership compared to the Surfscan SP7, enabling use of the Surfscan SP7 XP for advanced design nodes and high end film applications. The Surfscan SP7 XP offers up to 1.6x higher throughput for production modes compared to the Surfscan SP7 enabling more sampling, fast defect sourcing and effective wafer dispositioning. Production Integration The SurfServer™ centralized recipe management system facilitates recipe portability and helps streamline fab’s fleet management. The Recipe Distribution System (RDS) enables seamless...

Materials and Equipment Manufacturing IC Manufacturing Process Tool Monitoring Process Tool and Materials Qualification Within the IC fab, the Surfscan SP7 XP qualifies and monitors Defects added by process tools, such as fall-on particles or metal process tools for 3nm and 5nm design node R&D and high volume contamination, can adversely affect wafer yield or device manufacturing. By capturing tiny blanket film defects at performance. Certain process steps, like polishing, can worsen the production speeds, the Surfscan SP7 XP allows engineers to wafer surface quality and create abnormal...