SensArray
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SensArray WAFER LEVEL METROLOGY Product Line Overview

■ Operation Range ■ Calibration Range AT A GLANCE UNITS 1840 1850 Accuracy Sensor-to-Sensor Sensor Type Sensor Quantity Power Source Special Notes SPECIFICATIONS UNITS Measurand Sampling f(max) Operating Range Calibration Range Substrate Material Wafer Sizes Upper Coating Cleanability Power System Communications Thickness Recharge Time Recording Time Storage FOUP Warranty Use Life Calibration Life Hz Min-Max °C Min-Max °C mm Months/Cycles/Hours Months Battery Battery <6um local Time limited flatness elevated temp erature missions Integrated...

Diel/ Poly DT Hi CZ2 ■ Operation Range ■ Calibration Range Sensor Type Sensor Quantity Number Power Source Special notes SPECIFICATIONS UNITS EtchTemp EtchTemp SE Integral i3 0.2 0.2 0.5 Battery Battery Battery Oxide Etch Si Etch RF - 4KW Totally sealed Totally sealed RF EtchTemp EtchTemp SE Integral i3 Measurand Sampling f(max) Hz Operating Range Min-Max °C Calibration Range Min-Max °C Substrate Material Wafer Sizes mm Upper Coating Cleanability Power System Temperature 4 20-140 20-140 Silicon 300 Silicon Wet Clean (SC1,SC2) Dual fixed battery...

WAFER LEVEL METROLOGY ■ Operation Range ■ Calibration Range Sensor Type Sensor Quantity Number Power Source Special Notes Measurand Sampling f(max) Hz Operating Range Min-Max °C Calibration Range Min-Max °C Substrate Material Wafer Sizes mm Upper Coating Cleanability Power System Communications Thickness mm above Recharge Time Minutes Recording Time Minutes FOUP Warranty Months/Cycles/Hours Use Life Calibration Life Months

KUfr, encor Operation Range ■ Calibration Range AT A GLANCE UNITS WetTemp-LP Integral WetPro i3 Integral Implant i3 1730 Accuracy ± °C 0.5 Sensor Type IC Power Source Battery Special Notes Silicon cover 1.1 or 0.4% 0.1 TC - Type K 1 - 34 Wired Special sensor mounting for low temp Integral SPECIFICATIONS UNITS WetTemp-LP WetPro i3 Measurand Sampling f(max) Operating Range Calibration Range Substrate Material Wafer Sizes Upper Coating Cleanability Power System Communications Thickness Recharge Time Recording Time Storage Hz Min-Max °C Min-Max °C mm Warranty...

System Architecture–Wired WAFER LEVEL METROLOGY For high temperatures or subzero temperatures, self-contained, battery-powered systems are not yet available. They cannot function or become damaged in those environments. Wired architectures allow the electronics to be remote from the harsh process environment, but are not as easy to deploy, particularly in vacuum sealed environments. Modern systems include a small, near-wafer module (the ISIS 5) which can read the signals from the wafer sensors and transmit them to the handheld (Thermal Track) or laptop (Thermal Map 3) systems for analysis...

Visual Indicators Contact Carrier Integrated Wafer With the introduction of LithoSuite for lithography applications, and PlasmaSuite for plasma applications, and ThermalSuite for high-temp applications, our wireless software systems have evolved to create a common user interface between our module and non-module wafer products. Litho View Scanner Temp EtchTemp EtchTemp SE Base Station 300Z Litho System TrackTune AutoCal Plasma View Plasma Control HighTemp-350XP Plasma System Base Station 300 Multi Mission Analysis ESC Zone Analysis Multi Mission Analysis Advanced Analysis Modules

KLA-TENCOR SERVICE and SUPPORT Customer service is an integral part of KLA-Tencor’s portfolio that enables our customers to accelerate yield. Our vast customer service organization collaborates with worldwide customers to achieve the required productivity and performance at the lowest overall cost. K-T Services includes comprehensive contracts, time and materials, spares, asset management, customer training, and yield consulting. WAFER LEVEL METROLOGY KLA-Tencor Corporation One Technology Drive Milpitas, CA 95035 phone +1 408 875 3000 www.kla-tencor.com © 2014 KLA-Tencor Corporation. All...