ICOS™ T890
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KLA-TENCOR SUPPORT Maintaining system productivity is an integral part of KLA-Tencor’s yield optimization solution. Efforts in this area include system maintenance, global supply chain management, cost reduction and obsolescence mitigation, system relocation, performance and productivity enhancements, and certified tool resale. KLA-Tencor Corporation One Technology Drive Milpitas, CA 95035 © 2018 KLA-Tencor Corporation. All brands or product names may be trademarks of their respective companies. KLA-Tencor reserves the right to change the hardware and/or software specifications without notice.

FLOOR PLAN With the T890, KLA-Tencor’s ICOS division introduces a new standard in the inspection of packaged semiconductor ICs. The tool was designed to address the many new challenges the industry is facing: increase in device complexity, decrease of time-to-market and tougher quality requirements. It consolidates decades of experience, research and development into one single tool—making it the most accurate inspection machine on the market today. Largest Device Range Z2 head Pocket Integrity Check Z2 Head andand Pocket Integrity Check Bottom 3D Metrology & PVI& PVI Bottom 3D Metrology...

Increased Sensitivity SIGMA: Groundbreaking 3D Metrology SPECTRUM+: Advanced 2D Inspection BGA, CSP, SGA Balls and Solder Pads The new-generation ICOS 3D module provides unprecedented inspection capability at unseen accuracy. SPECTRUM+ is the latest-generation 2D Package Visual Inspection module. It can be applied to inspect both the top and bottom of the device. It can also be embedded inside the SIGMA module. The BGA/CSP ball inspection system inspects BGA and CSP devices for critical items such as coplanarity, ball presence, position, offset, pitch, extra ball, body width, ball damage...

PAC K AG E D I C I N S P EC T I O N Top & Bottom Package Visual Inspection (PVI) SPECTRUM+ State-of-the-art inspection of the package surface. This option scans the device for voids, scratches, pits, package incomplete fill, nonhomogenous molding, foreign material, chips and similar defects. Due to the highly flexible illumination, a variety of surface materials can be inspected: plastic mold, exposed silicon, metal surfaces, substrate, etc. Silicon µCrack Mold µCrack Exposed Wire Exposed Copper xCrack+™ This option on SPECTRUM+ allows the detection of µcracks in silicon or mold. Color...