ICOS™ T3/T7
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KLA-TENCOR SUPPORT Maintaining system productivity is an integral part of KLA-Tencor’s yield optimization solution. Efforts in this area include system maintenance, global supply chain management, cost reduction and obsolescence mitigation, system relocation, performance and productivity enhancements, and certified tool resale. KLA-Tencor Corporation One Technology Drive Milpitas, CA 95035 © 2018 KLA-Tencor Corporation. All brands or product names may be trademarks of their respective companies. KLA-Tencor reserves the right to change the hardware and/or software specifications without notice.

FLOOR PLAN 3D Metrology & PVI • 2CAM, KITO or SIGMA Tray Transfer Option ICOS T3 & T7 SERIES With the T3 & T7 product family, KLA-Tencor’s ICOS division sets a new standard in the inspection of packaged semiconductor ICs. Its highly flexible design provides a solution for every inspection requirement. Base configurations focusing on minimizing cost of ownership, as well as highly advanced models providing solutions for the most challenging quality needs are available. It consolidates decades of experience, research and development into a single platform, making it the most versatile...

PACKAGED IC INSPECTION AND METROLOGYIncreased Sensitivity Kua encor SIGMA: Innovative 3D Metrology The new-generation ICOS 3D module provides unprecedented inspection capability at unseen accuracy. • Best accuracy in back end industry • 3D inspection of any object: ball, leads, passive device, solder pad, etc. • 3D scan of surfaces to detect and measure dents, bulges • Multi-row inspection of TSOP and QFP devices • Embedded SPECTRUM+ 2D inspection • Accurate component height measurement A common platform is used for tools with tray and tape output. Upgrades from tray to tape and vice...

Top & Bottom Package Visual Inspection (PVI) BGA, CSP, SGA Balls and Solder Pads The BGA/CSP ball inspection system inspects BGA and CSP devices for critical items such as coplanarity, ball presence, position, offset, pitch, extra ball, body width, ball damage and discolored balls. This option offers state-of-the-art inspection of the package surface. It scans the device for voids, scratches, pits, packageincomplete fill, non-homogenous molding, foreign material, chips and similar defects. Due to its highly flexible illumination, a variety of surface materials can be inspected, including...