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![Axion® T2000 - 1](https://img.directindustry.com/pdf/repository_di/113449/axion-t2000-1041363_1m.jpg)
Product Fact Sheet High resolution CD-SAXS metrology system provides fast, accurate, non-destructive, 3D shape measurements for complex, high aspect ratio 3D NAND and DRAM device structures The Axion® T2000 leverages innovative X-ray technology to identify subtle structural variations that can affect memory device functionality or performance. By providing high resolution, non-destructive 3D device shape measurements, the Axion T2000 helps advanced memory manufacturers: Achieve fast cycles of learning during R&D, thereby reducing dependence on long lead time, destructive measurement methods such as FIB-SEM, TEM and cross-section SEM Accelerate ramp cycle time through fast and accurate characterization and optimization of new processes, design nodes and devices Monitor key process steps inline to ensure variations that affect device quality are identified and addressed quickly during high volume production Non-destructive CD-SAXS measurement technique High flux X-ray source Largest diffraction order separation High resolution detector Precision motion control with market-leading dynamic range AOI (angle of incidence) stage AcuShape® modeling Process characterization and optimization Engineering analysis Inline process monitoring Etch process tool monitoring Post-PM (preventative maintenance) etch process tool qualification MARKET: Chip manufacturing advanced design node memory devices, including 3D NAND and DRAM Customizable configurations Extendible 300mm wafers MORE INFORMATION:
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