Product Fact Sheet Broadband plasma optical patterned wafer inspection system discovers defects that affect the yield and reliability of advanced foundry manufacturing and advanced logic chips The 2965 provides high sensitivity discovery and binning of critical defects across a broad range of process layers, material types, process stacks and device architectures, including advanced gate all around transistors. The 2965 helps advanced foundry and logic manufacturers:  Accelerate R&D and ramp cycle time through characterization and optimization of new processes, design nodes and devices  Implement defect reduction strategies to meet chip quality requirements  Accelerate yield learning by providing accurate, actionable data on yield-critical defects  Detect and characterize defect issues at optimal cost of ownership  Tunable DUV, UV, visible broadband illumination source  H-line spectral filter for improved sensitivity to critical defects in gate all around transistor structures  Selectable optical apertures  Low-noise sensor  Super•Pixel™ inspection test mode for high throughput at sensitivity  Advanced defect detection algorithms, including MCAT  iDO™ 3.0 with advanced machine learning techniques for defect binning and nuisance suppression  Defect discovery for R&D and ramp  Characterization and debug of defect issues  Inline monitoring of critical layers requiring high sensitivity  Process window discovery and qualification MARKET: Chip manufacturing advanced foundry and advanced design node logic devices PLATFORM:  Customizable configurations  Extendible  Upgradeable  300mm wafers MORE INFORMATION: