Product Fact Sheet Broadband plasma optical patterned wafer inspection system discovers defects that affect the yield and reliability of logic chips The 2935 provides high sensitivity discovery and binning of critical defects across a broad range of process layers, material types and process stacks. The 2935 helps logic manufacturers:  Accelerate R&D and ramp cycle time through characterization and optimization of new processes, design nodes and devices  Implement defect reduction strategies to meet chip quality requirements  Accelerate yield learning by providing accurate, actionable data on yield-critical defects  Detect and characterize defect issues at optimal cost of ownership  Tunable DUV, UV, visible broadband illumination source  Selectable optical apertures  Low-noise sensor  Design-aware technologies, including pin•point™ and super•cell™  Advanced defect detection algorithms  Automated defect binning  Defect discovery for R&D and ramp  Characterization and debug of defect issues  Inline monitoring of critical layers requiring high sensitivity  Process window discovery and qualification Chip manufacturing advanced design node logic devices  Customizable configurations  Extendible  Upgradeable